Datasheet Texas Instruments LMR10520YSDX/NOPB

ManufacturerTexas Instruments
SeriesLMR10520
Part NumberLMR10520YSDX/NOPB
Datasheet Texas Instruments LMR10520YSDX/NOPB

5.5Vin, 2A Step-Down Voltage Regulator in SOT-23 and LLP 6-WSON -40 to 125

Datasheets

SIMPLE SWITCHER 5.5Vin, 2.0A Step-Dwn V-Reg in LLP datasheet
PDF, 1.0 Mb, Revision: B, File published: Apr 4, 2013
Extract from the document

Prices

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Packaging

Pin6
Package TypeNGG
Industry STD TermWSON
JEDEC CodeS-PDSO-N
Package QTY4500
CarrierLARGE T&R
Device MarkingL267B
Width (mm)3
Length (mm)3
Thickness (mm).8
Pitch (mm).95
Max Height (mm).8
Mechanical DataDownload

Parametrics

Control ModeCurrent Mode
Duty Cycle(Max)94 %
Iout(Max)2 A
Iq(Typ)3.3 mA
Operating Temperature Range-40 to 125 C
Package GroupWSON
RatingCatalog
Regulated Outputs1
Special FeaturesEnable
Switching Frequency(Max)3000 kHz
Switching Frequency(Min)1600 kHz
TypeConverter
Vin(Max)5.5 V
Vin(Min)3 V
Vout(Max)4.5 V
Vout(Min)0.6 V

Eco Plan

RoHSCompliant

Design Kits & Evaluation Modules

  • Evaluation Modules & Boards: LMR10520YSDDEMO
    LMR10520 Small Footprint LLP Buck Regulator 3 MHz 2A Demo Board
    Lifecycle Status: Active (Recommended for new designs)

Application Notes

  • QFN and SON PCB Attachment (Rev. B)
    PDF, 821 Kb, Revision: B, File published: Aug 24, 2018
  • AN-643 EMI/RFI Board Design (Rev. B)
    PDF, 742 Kb, Revision: B, File published: May 3, 2004
    Application Note 643 EMI/RFI Board Design
  • Input and Output Capacitor Selection
    PDF, 219 Kb, File published: Sep 19, 2005
  • AN-1197 Selecting Inductors for Buck Converters (Rev. B)
    PDF, 558 Kb, Revision: B, File published: Apr 23, 2013
    This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
  • AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
    PDF, 3.6 Mb, Revision: A, File published: Apr 23, 2013
    This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
  • AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
    PDF, 1.4 Mb, Revision: A, File published: Apr 23, 2013
    This application note provides thermal power analysis techniques for analyzing the power IC.
  • AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
    PDF, 2.7 Mb, Revision: A, File published: Apr 23, 2013
    This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, Revision: C, File published: Apr 19, 2016
  • Absolute Maximum Ratings for Soldering (Rev. D)
    PDF, 52 Kb, Revision: D, File published: Jun 9, 2016
  • AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
    PDF, 82 Kb, Revision: C, File published: Apr 23, 2013
    When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
  • AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
    PDF, 374 Kb, Revision: C, File published: Apr 23, 2013
    This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
  • AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
    PDF, 2.5 Mb, Revision: C, File published: Apr 24, 2013
    Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
  • AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
    PDF, 9.2 Mb, Revision: B, File published: Apr 23, 2013
    This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

Model Line

Manufacturer's Classification

  • Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)
EMS supplier