The complexity and density of electronic modules is constantly rising as they are challenged to support more and more loads and functions. Car manufacturers, automotive suppliers and industry players are thus looking for modular, scalable solutions that they can adapt to varying requirements and reuse in different projects. In addition to increased flexibility, today’s modules must offer optimum size and weight.
The Infineon's SPOC+ family addresses these needs by combining smart high-side drivers and added intelligence in a single package. All SPOC+ devices are fully scalable thanks to compatible footprint and software. They are highly integrated devices that reduce the complexity of electronics and save on-board space by cutting the number of external components required.
Control, configuration and diagnostics functions are carried out by a serial peripheral interface (SPI), thus reducing the amount of I/Os needed on the microcontroller and ensuring outstanding flexibility. The SPOC+ family also supports fail-safe modes and increases safety levels during operation.
The SPOC+ family comes in six different versions offering varying numbers of channels, scalable power capabilities (RDS(on)) and additional features (for example, the ability to drive external switches). All versions come in the small, leadless TSON24 package.
Features
- Serial peripheral interface (SPI) for control and diagnosis (daisy-chain capability)
- PWM driving via direct inputs or SPI
- Activation of fail-safe modes via limp home pin and configuration via input pins
- Multiplexed, proportional load current sense signals
- Full load protection
- AEC qualified
Applications
- 12V boardnet grounded high-side loads
- Automotive and industrial applications such as lighting, heating, motor driving, energy and power distribution
- Replacement of electromechanical relays and fuses
- Replacement of discrete smart high-side chip sets
