NXP released first Trench Schottky rectifier in CFP15

NXP PMEG45T15EPD

NXP just released our first medium-power Schottky rectifier PMEG45T15EPD with Trench technology in CFP15 (SOT1289) FlatPower package. Due to the Trench process, the new type offers a very low reverse current of only 30 µA. The voltage drop value remains about the same compared to planar types. Furthermore, it delivers a reverse voltage of 45 V and a average forward current of 15 A.

NXP PMEG45T15EPD

The rectifier is housed in an ultra-thin CFP15 package, with a package height of only 0.78 mm, integrated clip-bond technology and a large heat sink. It is capable of temperatures up to 150 °C. This makes it highly suitable for applications such as high-efficiency low-power adapter, especially at high operating temperatures.

The new Trench type expands the earlier released planar portfolio of medium-power Schottky rectifiers in CFP15. The expansion of our porfolio will continue with the release of our first automotive qualified Trench type in September.

Key features and benefits

  • Average forward current: IF(AV) ≤ 15 A
  • Reverse voltage: VR ≤ 45 V
  • Low forward voltage, VF typ = 480 mV (@ 15 A)
  • Low leakage current, IR typ = 30 µA (@ 45 V) due to Trench MEGA Schottky technology
  • High-power capability due to clip-bonding technology and heat sink
  • Small and thin SMD power plastic package, typical height 0.78 mm

Key applications

  • High-efficiency DC-to-DC conversion
  • Switch mode power supply
  • Reverse polarity protection
  • Low power consumption application
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