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09-22-2005

Spansion Introduces Innovative Package-on-Package Solution To Reduce Wireless Device Size

Spansion

Spansion's Solution Reduces Form Factors as Devices Adopt New FeaturesSpansion LLC announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable them to deliver sleek, feature-rich wireless phones, PDAs, digital cameras and MP3 players. Spansion's new PoP solution vertically combines discrete logic and memory packages for board space savings, lower pin-count, simplified system integration and enhanced performance. As a result, handset manufacturers can accommodate the growing demand for advanced features in their wireless products without having to increase their size and weight.

Spansion's POP solutions measure approximately 1.4 mm in height and vertically combine a system memory package with a logic chip set package . PoP solutions enable a high degree of flexibility for designers, allowing virtually any POP-enabled memory package to be combined with any PoP-enabled logic chip set in a matter of weeks. PoP solutions also enable high yield utilization of both logic and memory, and simplified test to help reduce time-to-market and maximize cost efficiency.

Spansion: Driving PoP Standards, Chipset Support
Spansion takes a system-level approach to the design and delivery of Flash memory and is undertaking extensive work to foster PoP standardization . As an active member of JEDEC, Spansion leads the JC11.2 task group responsible for the PoP design guide generation. The company is also working to help ensure broad availability and interoperability of its PoP solutions through close working relationships with chipset vendors.

Technical Features
Spansion has the capability of delivering 8-die solutions in a 128-ball, 12 x 12 mm package with a 0.65 mm pitch. PoP's short trace lengths and low bus capacitance also help to overcome the signal integrity and timing issues associated with emerging 133 MHz dual-data rate (DDR) memory solutions. Spansion's approach reduces pin-count and eliminates printed-circuit board (PCB) routing between logic and memory, for reduced design complexity.

Spansion's PoP solutions include the inherent benefits of its advanced two-bit-per-cell MirrorBitTM technology, including the right combination of reliability, cost, performance and density. With the future availability of the ORNANDTM architecture, Spansion plans to extend the benefits of MirrorBit technology and believes it will be able to respond to the demand for mass storage solutions in wireless handsets and complement application processors with an optimized code and data storage solution.

Availability
Samples of 12 x 12 mm and 15 x 15 mm Flash memory PoP solutions are available now for wireless phones and will vary in pricing depending on logic/memory densities and combinations.

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