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  1. Fujifilm Corporation and nano-electronics research institute, imec (CEO: Luc Van den hove), have demonstrated full-color organic light-emitting diodes (OLED) by using their jointly-developed photoresist technology for organic semiconductors, a ...
    02-06-2015
  2. IoT subsystem for ARM® Cortex®-M processors on TSMC 55ULP process accelerates development time for innovators ARM has unveiled a new hardware subsystem to enable the fast and efficient development of highly customized chips for smart ...
    01-06-2015
  3. Joint press release from the partners of the research project ”NeuLand”: AIXTRON, Infineon Technologies , SiCrystal, SMA Solar Technology New semiconductor materials could mean 50 percent less energy loss in switched-mode power supplies ...
    23-06-2014
  4. Electronics are getting smaller all the time, but there's a limit to how tiny they can get with today's materials. Takayoshi Sasaki and co-workers at the International Center for Materials Nanoarchitectonics, National Institute for Materials ...
    28-03-2014
  5. Imec, in collaboration with Vrije Universiteit Brussel, presents the world’s first 79 GHz radar transmitter implemented in plain digital 28 nm CMOS. With an output power above 10 dBm, the transmitter front-end paves the way towards full ...
    22-02-2014
  6. Fujitsu Semiconductor limited announced that it has developed the world's first technology to produce chips with embedded flash memory on logic circuits fabricated using deeply depleted channel (DDCTM) technology, with the 55nm process at the ...
    16-12-2013
  7. A new material built from aluminum and antimony shows promise for next-generation data-storage devices A new, environmentally-friendly electronic alloy consisting of 50 aluminum atoms bound to 50 atoms of antimony may be promising for building ...
    21-09-2013
  8. EPFL scientists have developed a tiny, portable personal blood testing laboratory: a minuscule device implanted just under the skin provides an immediate analysis of substances in the body, and a radio module transmits the results to a doctor over ...
    23-03-2013
  9. Toshiba exhibited a 300mm wafer that had 128-Gbit NAND flash memory chips and was made by using 19nm process technology at nano tech 2013. The company employed the 19nm process technology, which is the industry's most advanced process used for ...
    21-02-2013
  10. JEDEC UFS Ver.1.1 standard compliant embedded memories combine up to 64GB NAND and controller in single package Toshiba Corporation and Toshiba Electronics Europe have announced shipping of samples of its 64-gigabyte (GB) embedded NAND flash memory ...
    19-02-2013
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