News & Press Releases Power - 8

Subsection: "Power"
Search results: 974 Output: 71-80
  1. 3-fold Half-Bridge Driver IC E523.50 for BLDC Applications Elmos introduces with the E523.50 , a threefold 72 V half-bridge driver for brushless DC (BLDC) motors. Feasible are automotive applications with 12/24 V- (Trucks) and 48 V board net power ...
    07-08-2018
  2. New device offers significantly reduced footprint for automotive 3-phase brushless motor applications Toshiba Electronics Europe announces the availability of a new compact power MOSFET gate driver intelligent power device (IPD) for automotive ...
    26-07-2018
  1. Power Renesas ISL68300 ISL68301
    Feature-Rich ISL68300 and ISL68301 Deliver up to Eight Phases and More Than 240 A for FPGAs, DSPs, ASICs, and Network Processors Renesas Electronics announced two new PMBus™ compliant, fully digital DC/DC controllers that provide single ...
    24-07-2018
  2. Analog Devices announces the Power by Linear™ LTM4678 dual 25 A or single 50 A step-down µModule® regulator with PMBus digital interface. By stacking and exposing its two inductors on top of BGA package, the LTM4678 uses the ...
    19-07-2018
  3. Optimal power efficiency using the latest technology sets a new industry standard for high power density applications Alpha and Omega Semiconductor introduced the AONX38168 , which utilizes the latest 25 V N-Channel MOSFET Technology. The XSPairFET ...
    11-07-2018
  4. Supply Power ON Semiconductor FAN65008B FAN65005A FAN65004B
    FAN6500xx series delivers exceptional levels of integration for higher efficiency and reliability ON Semiconductor has announced the release of three new highly-efficient mid-voltage PWM buck converters. Supporting a wide input voltage range of 4.5 ...
    03-07-2018
  5. Drivers Power Toshiba TPD4204F TPD4206F TPD4207F
    Simple to use board simplifies and speeds up development process Toshiba Electronics Europe announces a new evaluation board for their TPD420xF series of brushless DC (BLDC) three-phase motor driver ICs to speed up the process of prototyping and ...
    18-06-2018
  6. New packaging design provides 1.7 times higher rupture resistance than conventional press-pack packaging Toshiba Electronics Europe will be providing details on its new packaging for its 4.5 kV class press-pack IEGT (PPI) devices at PCIM 2018 in ...
    13-06-2018
  7. Supply Power Texas Instruments LMR33620 LMR33630 LMR36006 LMR36015
    Highly integrated, wide-Vin DC/DC buck regulators simplify the design of industrial power supplies Texas Instruments (TI) introduced two wide-V IN synchronous SIMPLE SWITCHER® DC/DC buck regulators in ultra-small HotRod™ quad flat no-lead ...
    12-06-2018
  8. Infineon Technologies expands its product portfolio of the thin-wafer technology TRENCHSTOP™5 IGBT. The new product family is offering up to 40 A 650 V IGBT, co-packed with a full rated 40 A diode in a surface mounting TO-263-3 also known as ...
    12-06-2018
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