Datasheet Texas Instruments 74LVT162244ADGGRE4
| Manufacturer | Texas Instruments |
| Series | SN74LVT162244A |
| Part Number | 74LVT162244ADGGRE4 |
3.3-V ABT 16-Bit Buffers/Drivers With 3-State Outputs 48-TSSOP -40 to 85
Datasheets
SN54LVT162244A, SN74LVT162244A datasheet
PDF, 934 Kb, Revision: D, File published: Dec 1, 2006
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Prices
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
Packaging
| Pin | 48 |
| Package Type | DGG |
| Industry STD Term | TSSOP |
| JEDEC Code | R-PDSO-G |
| Package QTY | 2000 |
| Carrier | LARGE T&R |
| Device Marking | LVT162244A |
| Width (mm) | 6.1 |
| Length (mm) | 12.5 |
| Thickness (mm) | 1.15 |
| Pitch (mm) | .5 |
| Max Height (mm) | 1.2 |
| Mechanical Data | Download |
Parametrics
| Bits | 16 |
| F @ Nom Voltage(Max) | 100 Mhz |
| ICC @ Nom Voltage(Max) | 0.005 mA |
| Operating Temperature Range | -40 to 85 C |
| Output Drive (IOL/IOH)(Max) | -12/12 mA |
| Package Group | TSSOP |
| Package Size: mm2:W x L | 48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) PKG |
| Rating | Catalog |
| Schmitt Trigger | No |
| Technology Family | LVT |
| VCC(Max) | 3.6 V |
| VCC(Min) | 2.7 V |
| Voltage(Nom) | 3.3 V |
| tpd @ Nom Voltage(Max) | 4 ns |
Eco Plan
| RoHS | Compliant |
Application Notes
- LVT Family Characteristics (Rev. A)PDF, 98 Kb, Revision: A, File published: Mar 1, 1998
To address the need for a complete low-voltage interface solution, Texas Instruments has developed a new generation of logic devices capable of mixed-mode operation. The LVT series relies on a state-of-the-art submicron BiCMOS process to provide up to a 90% reduction in static power dissipation over ABT. LVT devices solve the system need for a transparent seam between the low-voltage and 5-V secti - LVT-to-LVTH ConversionPDF, 84 Kb, File published: Dec 8, 1998
Original LVT devices that have bus hold have been redesigned to add the High-Impedance State During Power Up and Power Down feature. Additional devices with and without bus hold have been added to the LVT product line. Design guidelines and issues related to the bus-hold features, switching characteristics, and timing requirements are discussed. - 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)PDF, 895 Kb, Revision: B, File published: May 22, 2002
TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa - Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi - Understanding Advanced Bus-Interface Products Design GuidePDF, 253 Kb, File published: May 1, 1996
- Power-Up 3-State (PU3S) Circuits in TI Standard Logic DevicesPDF, 209 Kb, File published: May 10, 2002
Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features - Implications of Slow or Floating CMOS Inputs (Rev. D)PDF, 260 Kb, Revision: D, File published: Jun 23, 2016
- Live InsertionPDF, 150 Kb, File published: Oct 1, 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha - Input and Output Characteristics of Digital Integrated CircuitsPDF, 1.7 Mb, File published: Oct 1, 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
Model Line
Series: SN74LVT162244A (9)
Manufacturer's Classification
- Semiconductors > Logic > Buffer/Driver/Transceiver > Non-Inverting Buffer/Driver
