Datasheet Texas Instruments 5962-8873101CA
| Manufacturer | Texas Instruments |
| Series | SN54AS1034A |
| Part Number | 5962-8873101CA |
Hex Drivers 14-CDIP -55 to 125
Datasheets
Hex Drivers datasheet
PDF, 1.1 Mb, Revision: B, File published: Jan 1, 1995
Extract from the document
Prices
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
Packaging
| Pin | 14 |
| Package Type | J |
| Industry STD Term | CDIP |
| JEDEC Code | R-GDIP-T |
| Package QTY | 1 |
| Carrier | TUBE |
| Width (mm) | 6.67 |
| Length (mm) | 19.56 |
| Thickness (mm) | 4.57 |
| Pitch (mm) | 2.54 |
| Max Height (mm) | 5.08 |
| Mechanical Data | Download |
Parametrics
| Bits | 6 |
| Input Type | TTL |
| Operating Temperature Range | -55 to 125 C |
| Output Type | TTL |
| Package Group | CDIP |
| Package Size: mm2:W x L | See datasheet (CDIP) PKG |
| Rating | Military |
| Schmitt Trigger | No |
| Technology Family | AS |
| VCC(Max) | 5.5 V |
| VCC(Min) | 4.5 V |
| Voltage(Nom) | 5 V |
Eco Plan
| RoHS | See ti.com |
Application Notes
- Advanced Schottky (ALS and AS) Logic FamiliesPDF, 1.9 Mb, File published: Aug 1, 1995
This document introduces the advanced Schottky family of clamped TTL integrated circuits (ICs). Detailed electrical characteristics of the 'AS and 'ALS devices with table formats are provided. Guidelines for designing high-performance digital systems using the Advanced Schottky family are given along with a brief summary of the solutions to most design decisions needed to implement systems using t - Advanced Schottky Load ManagementPDF, 277 Kb, File published: Feb 1, 1997
Designers of high-speed systems that include advanced Schottky (AS) devices must consider the operating environment in their work. They must be aware of the individual device characteristics and their interaction with other devices. This document provides a detailed discussion of the waveform characteristics equivalent circuit models transmission line fanout and termination for AS load manageme - Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Kb, File published: Jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - Introduction to LogicPDF, 93 Kb, File published: Apr 30, 2015
- Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
- Live InsertionPDF, 150 Kb, File published: Oct 1, 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha - Input and Output Characteristics of Digital Integrated CircuitsPDF, 1.7 Mb, File published: Oct 1, 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou - Designing With Logic (Rev. C)PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w - TI IBIS File Creation Validation and Distribution ProcessesPDF, 380 Kb, File published: Aug 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
Model Line
Series: SN54AS1034A (3)
- 5962-8873101CA SN54AS1034AJ SNJ54AS1034AJ
Manufacturer's Classification
- Semiconductors > Space & High Reliability > Logic Products > Buffers/Drivers/Transceivers > Buffer Drivers
Other Names:
59628873101CA, 5962 8873101CA
