Datasheet Texas Instruments 74AHC1G125DCKRE4

ManufacturerTexas Instruments
SeriesSN74AHC1G125
Part Number74AHC1G125DCKRE4
Datasheet Texas Instruments 74AHC1G125DCKRE4

Single Bus Buffer Gate with 3-State Output 5-SC70 -40 to 125

Datasheets

SN74AHC1G125 Single Bus Buffer Gate With 3-State Output datasheet
PDF, 1.0 Mb, Revision: K, File published: Dec 21, 2014
Extract from the document

Prices

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Packaging

Pin55555
Package TypeDCKDCKDCKDCKDCK
Industry STD TermSOT-SC70SOT-SC70SOT-SC70SOT-SC70SOT-SC70
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY30003000300030003000
CarrierLARGE T&RLARGE T&RLARGE T&RLARGE T&RLARGE T&R
Device MarkingAMGAMJAM3AMLAMS
Width (mm)1.251.251.251.251.25
Length (mm)22222
Thickness (mm).9.9.9.9.9
Pitch (mm).65.65.65.65.65
Max Height (mm)1.11.11.11.11.1
Mechanical DataDownloadDownloadDownloadDownloadDownload

Parametrics

3-State OutputYes
Bits1
F @ Nom Voltage(Max)75 Mhz
Gate TypeBUFFER
ICC @ Nom Voltage(Max)0.01 mA
LogicTrue
Operating Temperature Range-40 to 125 C
Output Drive (IOL/IOH)(Max)8/-8 mA
Package GroupSC70
Package Size: mm2:W x L5SC70: 4 mm2: 2.1 x 2(SC70) PKG
RatingCatalog
Schmitt TriggerNo
Special FeaturesDown translation to Vcc,low power,3-state
Sub-FamilyNon-Inverting Buffer/Driver
Technology FamilyAHC
VCC(Max)5.5 V
VCC(Min)2 V
Voltage(Nom)3.3,5 V
tpd @ Nom Voltage(Max)11.5,7.5 ns

Eco Plan

RoHSCompliant

Design Kits & Evaluation Modules

  • Evaluation Modules & Boards: DLPLCR6500EVM
    DLPВ® LightCrafterВ™ 6500 Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: DLPLCR9000EVM
    DLPВ® LightCrafterВ™ 9000 Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: LMP91051EVM
    LMP91051 Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)

Application Notes

  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A)
    PDF, 154 Kb, Revision: A, File published: Sep 8, 1999
    In the last few years the trend toward reducing supply voltage (VCC) has continued as reflected in an additional specification of 2.5-V VCC for the AVC ALVT ALVC LVC LV and the CBTLV families.In this application report the different logic levels at VCC of 5 V 3.3 V 2.5 V and 1.8 V are compared. Within the report the possibilities for migration from 5-V logic and 3.3-V logic families
  • How to Select Little Logic (Rev. A)
    PDF, 1.1 Mb, Revision: A, File published: Jul 26, 2016
    TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b
  • Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
    PDF, 115 Kb, File published: Dec 1, 1997
    This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
  • Texas Instruments Little Logic Application Report
    PDF, 359 Kb, File published: Nov 1, 2002
    Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, Revision: A, File published: Jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, File published: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, File published: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Introduction to Logic
    PDF, 93 Kb, File published: Apr 30, 2015
  • Advanced High-Speed CMOS (AHC) Logic Family (Rev. C)
    PDF, 102 Kb, Revision: C, File published: Dec 2, 2002
    The Texas Instruments (TI) advanced high-speed CMOS (AHC) logic family provides a natural migration for high-speed CMOS (HCMOS) users who need more speed for low-power and low-drive applications. Unlike many other advanced logic families AHC does not have the drawbacks that come with higher speed e.g. higher signal noise and power consumption. The AHC logic family consists of gates medium-sca
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, Revision: D, File published: Jun 23, 2016
  • Live Insertion
    PDF, 150 Kb, File published: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, Revision: B, File published: Jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale

Model Line

Manufacturer's Classification

  • Semiconductors > Logic > Little Logic