Datasheet Texas Instruments MSP430F6459IZQWR
| Manufacturer | Texas Instruments |
| Series | MSP430F6459 |
| Part Number | MSP430F6459IZQWR |
MSP430F64xx Mixed Signal Microcontroller 113-BGA MICROSTAR JUNIOR -40 to 85
Datasheets
MSP430F665x, MSP430F645x, MSP430F565x, MSP430F535x Mixed Signal Microcontroller datasheet
PDF, 1.9 Mb, Revision: C, File published: Oct 21, 2013
Extract from the document
Prices
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
Packaging
| Pin | 113 |
| Package Type | ZQW |
| Industry STD Term | BGA MICROSTAR JUNIOR |
| JEDEC Code | S-PBGA-N |
| Package QTY | 2500 |
| Carrier | LARGE T&R |
| Device Marking | F6459 |
| Width (mm) | 7 |
| Length (mm) | 7 |
| Thickness (mm) | .74 |
| Pitch (mm) | .5 |
| Max Height (mm) | 1 |
| Mechanical Data | Download |
Parametrics
| ADC | ADC12 - 12ch |
| AES | N/A |
| Active Power | 370 uA/MHz |
| Additional Features | LCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA |
| BSL | UART |
| CPU | MSP430 |
| Comparators | 12 |
| DMA | 6 |
| Featured | f6 |
| Frequency | 20 MHz |
| GPIO Pins | 74 |
| I2C | 3 |
| Max VCC | 3.6 |
| Min VCC | 1.8 |
| Multiplier | 32x32 |
| Non-volatile Memory | 512 KB |
| Operating Temperature Range | -40 to 85 C |
| Package Group | BGA MICROSTAR JUNIOR |
| Package Size: mm2:W x L | 113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR) PKG |
| RAM | 66 KB |
| Rating | Catalog |
| SPI | 6 |
| Special I/O | N/A |
| Standby Power | 2.6 LPM3-uA |
| Timers - 16-bit | 4 |
| UART | 3 |
| Wakeup Time | 3 us |
Eco Plan
| RoHS | Compliant |
Design Kits & Evaluation Modules
- Evaluation Modules & Boards: MSP-TS430PZ100C
MSP-TS430PZ100C - 100-pin Target Development Board for MSP430F5x and MSP430F6x MCUs
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: MSP-EXP430F5529LP
MSP430F5529 USB LaunchPad Evaluation Kit
Lifecycle Status: Active (Recommended for new designs) - Development Kits: MSP-FET430U128
128-pin Target Development Board and MSP-FET Programmer Bundle for MSP430F6x MCUs
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: ENERGYTRACE
MSP EnergyTrace Technology
Lifecycle Status: Active (Recommended for new designs)
Application Notes
- Using the MSP430 RTC_B Module With Battery Backup Supply (Rev. B)PDF, 135 Kb, Revision: B, File published: Jun 4, 2015
Some applications need to retain an accurate real-time clock (RTC) through battery changes, power outages, and other events. For these applications, MSP430в„ў devices that contain the RTC_B Real-Time Clock module with a Battery Backup System can be a great fit. This application note demonstrates how to use RTC_B with Battery Backup Supply functionality to retain the time and keep the RTC counting th - MSP430 Embedded Application Binary InterfacePDF, 596 Kb, File published: May 16, 2012
This document is a specification for the ELF-based Embedded Application Binary Interface (EABI) for the MSP430 family of processors from Texas Instruments. The EABI defines the low-level interface between programs, program components, and the execution environment, including the operating system if one is present. Components of the EABI include calling conventions, data layout and addressing conve - Designing With MSP430 and Segment LCDs (Rev. A)PDF, 2.1 Mb, Revision: A, File published: Jul 20, 2015
Segment liquid crystal displays (LCDs) are needed to provide information to users in a wide variety of applications from smart meters to electronic shelf labels (ESL) to medical equipment. Several MSP430в„ў microcontroller families include built-in low-power LCD driver circuitry that allows the MSP430 MCU to directly control the segmented LCD glass. This application note helps explain how segmented - General Oversampling of MSP ADCs for Higher Resolution (Rev. A)PDF, 551 Kb, Revision: A, File published: Apr 1, 2016
Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl - MSP Code Protection FeaturesPDF, 752 Kb, File published: Dec 7, 2015
MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur - ESD Diode Current SpecificationPDF, 520 Kb, File published: Dec 7, 2015
This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.
Model Line
Series: MSP430F6459 (4)
- MSP430F6459IPZ MSP430F6459IPZR MSP430F6459IZQWR MSP430F6459IZQWT
Manufacturer's Classification
- Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430F5x/6x
