Datasheet Texas Instruments MSP430F5659IZQWT
| Manufacturer | Texas Instruments |
| Series | MSP430F5659 |
| Part Number | MSP430F5659IZQWT |
MSP430F56xx Mixed Signal Microcontroller 113-BGA MICROSTAR JUNIOR -40 to 85
Datasheets
MSP430F665x, MSP430F645x, MSP430F565x, MSP430F535x Mixed Signal Microcontroller datasheet
PDF, 1.9 Mb, Revision: C, File published: Oct 21, 2013
Extract from the document
Prices
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
Packaging
| Pin | 113 |
| Package Type | ZQW |
| Industry STD Term | BGA MICROSTAR JUNIOR |
| JEDEC Code | S-PBGA-N |
| Package QTY | 250 |
| Carrier | SMALL T&R |
| Device Marking | F5659 |
| Width (mm) | 7 |
| Length (mm) | 7 |
| Thickness (mm) | .74 |
| Pitch (mm) | .5 |
| Max Height (mm) | 1 |
| Mechanical Data | Download |
Parametrics
| ADC | ADC12 - 12ch |
| AES | N/A |
| Active Power | 370 uA/MHz |
| Additional Features | USB,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA |
| BSL | USB |
| CPU | MSP430 |
| Comparators | 12 |
| DMA | 6 |
| Featured | f5 |
| Frequency | 20 MHz |
| GPIO Pins | 74 |
| I2C | 3 |
| Max VCC | 3.6 |
| Min VCC | 1.8 |
| Multiplier | 32x32 |
| Non-volatile Memory | 512 KB |
| Operating Temperature Range | -40 to 85 C |
| Package Group | BGA MICROSTAR JUNIOR |
| Package Size: mm2:W x L | 113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR) PKG |
| RAM | 66 KB |
| Rating | Catalog |
| SPI | 6 |
| Special I/O | N/A |
| Standby Power | 2.6 LPM3-uA |
| Timers - 16-bit | 4 |
| UART | 3 |
| Wakeup Time | 3 us |
Eco Plan
| RoHS | Compliant |
Design Kits & Evaluation Modules
- Evaluation Modules & Boards: CC2564MODAEM
Dual-mode BluetoothВ® CC2564 Module with Integrated Antenna Evaluation Board
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: MSP-EXP430F5529LP
MSP430F5529 USB LaunchPad Evaluation Kit
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: MSP-FET430U100USB
100-pin Target Development Board and MSP-FET Programmer Bundle for MSP430F5x and MSP430F6x MCUs
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: ENERGYTRACE
MSP EnergyTrace Technology
Lifecycle Status: Active (Recommended for new designs)
Application Notes
- Using the MSP430 RTC_B Module With Battery Backup Supply (Rev. B)PDF, 135 Kb, Revision: B, File published: Jun 4, 2015
Some applications need to retain an accurate real-time clock (RTC) through battery changes, power outages, and other events. For these applications, MSP430в„ў devices that contain the RTC_B Real-Time Clock module with a Battery Backup System can be a great fit. This application note demonstrates how to use RTC_B with Battery Backup Supply functionality to retain the time and keep the RTC counting th - Starting a USB Design Using MSP430 MCUs (Rev. A)PDF, 949 Kb, Revision: A, File published: May 30, 2014
This document is a high-level starting point for those wanting to design USB devices with MSP430в„ў MCUs. It provides an overview of the TI MSP430 hardware and software offerings for USB, as well as guidance in quickly getting started.Among the topics covered:An overview of the MSP430 hardware USB moduleAn introduction to the MSP430 USB Developer's Package - Using the MSP430 Timer_D Module in Hi-Resolution ModePDF, 870 Kb, File published: Oct 2, 2013
This application report describes the use of the high-resolution feature of the Timer_D module introduced in MSP430F51x1 and MSP430F51x2 devices. Timer_D enables applications that require high resolution such as capacitive touch detection, PWM DACs, advanced LED lighting, and digital controllers for power supplies. This application report provides an advanced description of the use and calibration - General Oversampling of MSP ADCs for Higher Resolution (Rev. A)PDF, 551 Kb, Revision: A, File published: Apr 1, 2016
Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl - MSP Code Protection FeaturesPDF, 752 Kb, File published: Dec 7, 2015
MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur - ESD Diode Current SpecificationPDF, 520 Kb, File published: Dec 7, 2015
This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.
Model Line
Series: MSP430F5659 (4)
- MSP430F5659IPZ MSP430F5659IPZR MSP430F5659IZQWR MSP430F5659IZQWT
Manufacturer's Classification
- Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430F5x/6x
