Datasheet Texas Instruments MSP430FR5726IPW

ManufacturerTexas Instruments
SeriesMSP430FR5726
Part NumberMSP430FR5726IPW
Datasheet Texas Instruments MSP430FR5726IPW

MSP430FR5726 8 MHz ULP microcontroller with 16 KB FRAM, 1 KB SRAM, 21 IO and comparator 28-TSSOP -40 to 85

Datasheets

MSP430FR572x Mixed-Signal Microcontrollers datasheet
PDF, 2.2 Mb, Revision: B, File published: Apr 25, 2016
Extract from the document

Prices

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Packaging

Pin28
Package TypePW
Industry STD TermTSSOP
JEDEC CodeR-PDSO-G
Package QTY50
CarrierTUBE
Device Marking430FR5726
Width (mm)4.4
Length (mm)9.7
Thickness (mm)1
Pitch (mm).65
Max Height (mm)1.2
Mechanical DataDownload

Parametrics

ADCSlope
AESN/A
Active Power125 uA/MHz
Additional FeaturesReal-Time Clock,Watchdog,Brown Out Reset,IrDA
BSLUART
CPUMSP430
Comparators12
DMA3
Featuredfr5
Frequency8 MHz
GPIO Pins21
I2C1
Max VCC3.6
Min VCC2
Multiplier32x32
Non-volatile Memory16 KB
Operating Temperature Range-40 to 85 C
Package GroupTSSOP
Package Size: mm2:W x L28TSSOP: 62 mm2: 6.4 x 9.7(TSSOP) PKG
RAM1 KB
RatingCatalog
SPI2
Security EnablerCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protection
Special I/ON/A
Standby Power6.4 LPM3-uA
Timers - 16-bit3
UART1
Wakeup Time78 us

Eco Plan

RoHSCompliant

Design Kits & Evaluation Modules

  • Evaluation Modules & Boards: MSP-TS430RHA40A
    MSP-TS430RHA40A- 40-pin Target Development Board for MSP430FRxx FRAM MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: MSP-FET430U40A
    40-pin Target Development Board and MSP-FET Programmer Bundle for MSP430F5x MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: ENERGYTRACE
    MSP EnergyTrace Technology
    Lifecycle Status: Active (Recommended for new designs)

Application Notes

  • Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A)
    PDF, 3.5 Mb, Revision: A, File published: Mar 2, 2015
  • MSP430 System-Level ESD Considerations
    PDF, 1.5 Mb, File published: Mar 29, 2012
    System-Level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low power components. This application report addresses three different ESD topics to help board designers and OEMs understand and design robust system-level designs:(1) Component-level ESD testing and system-level ESD testing, their differ
  • Maximizing Write Speed on the MSP430в„ў FRAM (Rev. B)
    PDF, 103 Kb, Revision: B, File published: Feb 4, 2015
    Nonvolatile low-power ferroelectric RAM (FRAM) is capable of extremely high-speed write accesses. This application report discusses how to maximize FRAM write speeds specifically in the MSP430FRxx family using simple techniques. The document uses examples from bench tests performed on the MSP430FR5739 device, which can be extended to all MSP430в„ў FRAM-based devices, and discusses tradeoffs such as
  • MSP430 FRAM Technology – How To and Best Practices
    PDF, 326 Kb, File published: Jun 23, 2014
    FRAM is a non-volatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specif
  • MSP430 FRAM Quality and Reliability (Rev. A)
    PDF, 295 Kb, Revision: A, File published: May 1, 2014
    FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endura
  • Migrating from the USCI Module to the eUSCI Module (Rev. A)
    PDF, 41 Kb, Revision: A, File published: Sep 13, 2012
    The purpose of this application report is to enable easy migration for designs based on the USCI_A and USCI_B modules to the eUSCI_A and the eUSCI_B modules. The document highlights the new features in the eUSCI module and the main differences between the USCI and the eUSCI modules.
  • Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)
    PDF, 154 Kb, Revision: A, File published: Feb 16, 2012
    This application report enables easy migration from MSP430F2xx Flash-based MCUs to the MSP430FR57xx family FRAM-based MCU. It covers programming, system, and peripheral considerations when migrating firmware. The purpose is to highlight differences between the two families. For more information on the usage of the MSP430FR57xx features, see the MSP430FR57xx Family User's Guide (
  • Design Considerations When Using the MSP430 Graphics Library
    PDF, 475 Kb, File published: Oct 5, 2012
    LCDs are a growing commodity in todays market with products as diverse as children's toys to medical devices. Modern LCDs, along with the graphics displayed on them, are growing in complexity. A graphics library can simplify and accelerate development while creating the desired user experience. TI provides the MSP430 Graphics Library for use in developing products with the MSP430в„ў MCU. This

Model Line

Manufacturer's Classification

  • Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430FRxx FRAM