Datasheet Texas Instruments 5962-9175301MRA

ManufacturerTexas Instruments
SeriesSN54F541
Part Number5962-9175301MRA
Datasheet Texas Instruments 5962-9175301MRA

Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125

Datasheets

Octal Buffers/Drivers With 3-State Outputs datasheet
PDF, 1.2 Mb, Revision: A, File published: Oct 1, 1993
Extract from the document

Prices

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Packaging

Pin20
Package TypeJ
Industry STD TermCDIP
JEDEC CodeR-GDIP-T
Package QTY1
CarrierTUBE
Width (mm)6.92
Length (mm)24.2
Thickness (mm)4.57
Pitch (mm)2.54
Max Height (mm)5.08
Mechanical DataDownload

Parametrics

Bits8
Input TypeTTL
Operating Temperature Range-55 to 125 C
Output TypeTTL
Package GroupCDIP
Package Size: mm2:W x LSee datasheet (CDIP) PKG
RatingMilitary
Schmitt TriggerNo
Technology FamilyF
VCC(Max)5.5 V
VCC(Min)4.5 V
Voltage(Nom)5 V

Eco Plan

RoHSSee ti.com

Application Notes

  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, File published: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Introduction to Logic
    PDF, 93 Kb, File published: Apr 30, 2015
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, File published: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, File published: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con

Model Line

Series: SN54F541 (4)

Manufacturer's Classification

  • Semiconductors > Space & High Reliability > Logic Products > Buffers/Drivers/Transceivers > Buffer Drivers

Other Names:

59629175301MRA, 5962 9175301MRA