Datasheet Texas Instruments SN74LVC1G00DBVR
| Manufacturer | Texas Instruments |
| Series | SN74LVC1G00 |
| Part Number | SN74LVC1G00DBVR |
Single 2 Input Positive NAND Gate 5-SOT-23 -40 to 125
Datasheets
SN74LVC1G00 Single 2-Input Positive-NAND Gate datasheet
PDF, 1.5 Mb, Revision: AB, File published: Apr 23, 2014
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Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes |
Packaging
| Pin | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| Package Type | DBV | DBV | DBV | DBV | DBV | DBV | DBV |
| Industry STD Term | SOT-23 | SOT-23 | SOT-23 | SOT-23 | SOT-23 | SOT-23 | SOT-23 |
| JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G |
| Package QTY | 3000 | 3000 | 3000 | 3000 | 3000 | 3000 | 3000 |
| Carrier | LARGE T&R | LARGE T&R | LARGE T&R | LARGE T&R | LARGE T&R | LARGE T&R | LARGE T&R |
| Device Marking | C00P | C00S | C005 | C00K | C00R | C00F | C00H |
| Width (mm) | 1.6 | 1.6 | 1.6 | 1.6 | 1.6 | 1.6 | 1.6 |
| Length (mm) | 2.9 | 2.9 | 2.9 | 2.9 | 2.9 | 2.9 | 2.9 |
| Thickness (mm) | 1.2 | 1.2 | 1.2 | 1.2 | 1.2 | 1.2 | 1.2 |
| Pitch (mm) | .95 | .95 | .95 | .95 | .95 | .95 | .95 |
| Max Height (mm) | 1.45 | 1.45 | 1.45 | 1.45 | 1.45 | 1.45 | 1.45 |
| Mechanical Data | Download | Download | Download | Download | Download | Download | Download |
Parametrics
| 3-State Output | No |
| Bits | 1 |
| F @ Nom Voltage(Max) | 150 Mhz |
| Gate Type | NAND |
| ICC @ Nom Voltage(Max) | 0.01 mA |
| Logic | True |
| Operating Temperature Range | -40 to 125,-40 to 85 C |
| Output Drive (IOL/IOH)(Max) | 32/-32 mA |
| Package Group | SOT-23 |
| Package Size: mm2:W x L | 5SOT-23: 8 mm2: 2.8 x 2.9(SOT-23) PKG |
| Rating | Catalog |
| Schmitt Trigger | No |
| Special Features | Ioff,down translation to Vcc,Small DPW package,low power |
| Sub-Family | NAND Gate |
| Technology Family | LVC |
| VCC(Max) | 5.5 V |
| VCC(Min) | 1.65 V |
| Voltage(Nom) | 1.8,2.5,3.3,5 V |
| tpd @ Nom Voltage(Max) | 9,5.5,4.7,4 ns |
Eco Plan
| RoHS | Compliant |
Application Notes
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The NanoStarв„ў Wafer Chip-Scale Package (WCSP) is a family of bare die packages developed for applications that require the smallest possible package. WCSP provides electrical interconnection via solder spheres attached to the die and is aligned with JEDEC package standard MOв€’211. NanoStarв„ў, with advanced materials engineering technology, has demonstrated excellent board level rel - Designing and Manufacturing with TI's X2SON PackagesPDF, 134 Kb, File published: Aug 23, 2017
- LVC Characterization InformationPDF, 114 Kb, File published: Dec 1, 1996
This document provides characterization information about low-voltage logic (LVL) that operates from a 3.3-V power supply. It addresses the issues of interfacing to 5-V logic ac performance power considerations input and output characteristics and signal integrity for this family of devices. - Use of the CMOS Unbuffered Inverter in Oscillator CircuitsPDF, 796 Kb, File published: Nov 6, 2003
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Model Line
Series: SN74LVC1G00 (20)
- SN74LVC1G00DBVR SN74LVC1G00DBVRE4 SN74LVC1G00DBVRG4 SN74LVC1G00DBVT SN74LVC1G00DBVTE4 SN74LVC1G00DBVTG4 SN74LVC1G00DCKR SN74LVC1G00DCKRE4 SN74LVC1G00DCKRG4 SN74LVC1G00DCKT SN74LVC1G00DCKTE4 SN74LVC1G00DCKTG4 SN74LVC1G00DPWR SN74LVC1G00DRLR SN74LVC1G00DRLRG4 SN74LVC1G00DRY2 SN74LVC1G00DRYR SN74LVC1G00DSF2 SN74LVC1G00DSFR SN74LVC1G00YZPR
Manufacturer's Classification
- Semiconductors > Logic > Little Logic
