Datasheet Texas Instruments AM3359

Manufacturer	Texas Instruments
Series	AM3359

Datasheets

Prices

Status

Packaging

Parametrics

Parameters / Models	AM3359BZCZA80
ARM CPU	1 ARM Cortex-A8
ARM MHz, Max.	800
Applications	Automotive,Industrial,Personal Electronics
Co-Processor, s	2 PRU-ICSS
DMIPS	1600
DRAM	DDR2,DDR3,DDR3L,LPDDR
Display Outputs	1
EMAC	2-Port 10/100 PRU EMAC,2-Port 1Gb Switch
Graphics Acceleration	1 3D
Industrial Protocols	1588,EtherCAT,EtherNet/IP,Ethernet POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III
On-Chip L2 Cache	256 KB (ARM Cortex-A8)
Operating Systems	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE
Operating Temperature Range, C	-40 to 105
Other On-Chip Memory	128 KB
Rating	Catalog
Security Enabler	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment
Serial I/O	CAN,I2C,SPI,UART,USB

Eco Plan

Application Notes

• Download
  AM335x Low Power Design Guide (Rev. A)
  PDF, 300 Kb, Revision: A, File published: Feb 28, 2017
  This document discusses techniques to develop a low power, low cost system based on the AM335x series processor. The goal is to explain how system design choices affect power consumption and how power consumption can vary significantly depending on how the developer’s application runs in that system under specific conditions.
• Download
  AM335x Reliability Considerations in PLC Applications (Rev. A)
  PDF, 112 Kb, Revision: A, File published: Apr 27, 2017
  Programmable Logic Controllers (PLC) are used as the main control in an automation system with high-reliability expectations and long life in harsh environments. Processors used in these applications require an assessment of performance verses expected power on hours to achieve the optimal performance for the application.
• Download
  Processor SDK RTOS Customization: Modifying Board library to change UART instanc
  PDF, 783 Kb, File published: Mar 4, 2016
• Download
  AM335x Thermal Considerations
  PDF, 16 Kb, File published: Apr 15, 2013
  This article discusses the thermal considerations of the AM335x devices. It offers guidance on analysis of the processor's thermal performance, suggests improvements for an end system to aid in overcoming some of the existing challenges of producing a good thermal design, and provides real power/thermal data measured with AM335x EVMs for user evaluation.
• Download
  nFBGA Packaging (Rev. B)
  PDF, 3.1 Mb, Revision: B, File published: Nov 13, 2015
  This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
• Download
  0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
  PDF, 40.5 Mb, Revision: A, File published: Aug 9, 2015
• Download
  Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
  PDF, 324 Kb, Revision: A, File published: Aug 17, 2016
  This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
• Download
  Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  PDF, 1.6 Mb, Revision: B, File published: Aug 13, 2015
• Download
  High-Speed Interface Layout Guidelines (Rev. G)
  PDF, 814 Kb, Revision: G, File published: Jul 27, 2017
  As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Model Line

Manufacturer's Classification

• Semiconductors> Processors> Sitara Processors> ARM Cortex-A8> AM335x