Datasheet Texas Instruments AM3715CBP
Manufacturer | Texas Instruments |
Series | AM3715 |
Part Number | AM3715CBP |
Sitara Processor: ARM Cortex-A8, 3D Graphics, LPDDR 515-POP-FCBGA 0 to 90
Datasheets
AM3715, AM3703 Sitara ARM Microprocessors datasheet
PDF, 3.2 Mb, Revision: F, File published: Aug 29, 2011
Extract from the document
Prices
Status
Lifecycle Status | Active (Recommended for new designs) |
Manufacture's Sample Availability | Yes |
Packaging
Pin | 515 | 515 |
Package Type | CBP | CBP |
Industry STD Term | POP-FCBGA | POP-FCBGA |
JEDEC Code | S-PBGA-N | S-PBGA-N |
Package QTY | 168 | 168 |
Carrier | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) |
Device Marking | AM3715CBP-AS3 | AM3715CBP |
Width (mm) | 12 | 12 |
Length (mm) | 12 | 12 |
Thickness (mm) | .5 | .5 |
Pitch (mm) | .4 | .4 |
Max Height (mm) | .7 | .7 |
Mechanical Data | Download | Download |
Parametrics
ARM CPU | 1 ARM Cortex-A8 |
ARM MHz | 1000 Max. |
Applications | Industrial,Personal Electronics |
DRAM | LPDDR |
Display Options | DSS |
Graphics Acceleration | 1 3D |
I2C | 4 |
On-Chip L2 Cache | 256 KB (ARM Cortex-A8) |
Operating Systems | Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE |
Operating Temperature Range | -40 to 105,-40 to 90,0 to 90 C |
Other On-Chip Memory | 64 KB |
Rating | Catalog |
SPI | 4 |
UART | 4 SCI |
USB | 4 |
Video Port | 1 Input,1 Output Configurable |
Eco Plan
RoHS | Compliant |
Design Kits & Evaluation Modules
- JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
XDS560v2 System Trace USB & Ethernet Debug Probe
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: TMDSEVM3730
AM/DM37x Evaluation Module
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
XDS560v2 System Trace USB Debug Probe
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU200-U
XDS200 USB Debug Probe
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: BEAGLEXM
BeagleBoard-xM Development Board
Lifecycle Status: Obsolete (Manufacturer has discontinued the production of the device)
Application Notes
- AM3715/03 SDRC SubsystemPDF, 19 Kb, File published: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_SDRC_SubsystemThe SDRC subsystem module provides connectivity between the AM37x and SDRAM memory components. The module incl - AM3715 GPMCPDF, 19 Kb, File published: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:href=http://processors.wiki.ti.com/index.php/Am3715_gpmcThe GPMC is a 16-bit external memory controller. The GPMC data access engine provides a flexible programming model for communicatio - AM/DM37x Power Estimation SpreadsheetPDF, 20 Kb, File published: Jun 7, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or tocontribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Power_Estimation_SpreadsheetThis article discusses the power consumption of the Texas Instruments AM/DM37x high - AM/DM37x OverviewPDF, 19 Kb, File published: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Overview.This document provides an overview of the AM37x applications processor.All trademarks are property of their respective - AM3715/03 Memory SubsystemPDF, 19 Kb, File published: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_Memory_SubsystemThe Memory Subsystem in the AM3715/03 devices consists of the internal SRAM and two dedicated memory contr - AM37x/DM37x Schematic ChecklistPDF, 19 Kb, File published: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x/DM37x_Schematic_Checklist.This article provides many tips related to reset, JTAG, peripherals, etc. It should be used as - AM37x EVM Software Developer's GuidePDF, 19 Kb, File published: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_EVM_Software_Developer%27s_Guide.This wiki article illustrates the various software components provided with the A - PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUsPDF, 739 Kb, File published: Jun 15, 2011
The purpose of a power distribution network (PDN) is to provide clean and reliable power to active devices in the system. The printed circuit board (PCB) is a critical component of the system-level PDN. Therefore, the PCB design is of utmost importance for high-performance low-power microprocessors. This application report provides design requirements and details a step-by-step methodology on how - Ethernet Connectivity via GPMCPDF, 19 Kb, File published: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Ethernet_Connectivity_via_GPMCThe purpose of this article is to describe a solution for connecting Ethernet to various devices, - Setting up AM37x SDRC RegistersPDF, 19 Kb, File published: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Setting_up_AM37x_SDRC_registersThis wiki article describes how to set the SDRC registers in the OMAP35x SDRC module depending o - AM37x CUS Routing GuidelinesPDF, 19 Kb, File published: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_CUS_Routing_Guidelines.CUS package is designed with a new technology called Via Channelв„ў array. This technology allows for e - OMAP35x to AM37x Hardware Migration GuidePDF, 37 Kb, File published: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:http://processors.wiki.ti.com/index.php/OMAP35x_To_AM37x_Hardware_Migration_Guide.
The OMAP35x to AM37x Hardware Migration Guide describes device consideratio
- PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages Part II (Rev. A)PDF, 2.4 Mb, Revision: A, File published: Nov 1, 2013
Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design the solder paste char
- PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages Part I (Rev. B)PDF, 6.7 Mb, Revision: B, File published: Jun 13, 2009
Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de - PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part IPDF, 2.0 Mb, File published: Jun 23, 2010
Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.Fine-pitch PCB design is a team effort and may require more than
- PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part IIPDF, 1.2 Mb, File published: Jun 23, 2010
Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process
Model Line
Series: AM3715 (11)
Manufacturer's Classification
- Semiconductors > Processors > Sitara Processors > ARM Cortex-A8 > AM3x