Datasheet Texas Instruments CC2564MODNCMOET

ManufacturerTexas Instruments
SeriesCC2564MODN
Part NumberCC2564MODNCMOET
Datasheet Texas Instruments CC2564MODNCMOET

Dual-mode Bluetooth® CC2564 module 33-QFM -30 to 85

Datasheets

CC2564MODx BluetoothВ® Host Controller Interface (HCI) Module datasheet
PDF, 16.9 Mb, Revision: E, File published: Jan 16, 2016
Extract from the document

Prices

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

Packaging

Pin33
Package TypeMOE
Package QTY250
CarrierSMALL T&R
Width (mm)7
Length (mm)7
Thickness (mm)1.4
Mechanical DataDownload

Parametrics

Bluetooth StandardBluetooth Smart (Bluetooth low energy),Classic Bluetooth,Dual-mode Bluetooth
Data Rate(Max)3000 kbps
Device TypeSmart RF Transceiver,Module
Package GroupQFM
Package Size: mm2:W x LSee datasheet (QFM) PKG
RatingCatalog
Special FeaturesN/A
TechnologyDual-mode Bluetooth
Throughput(Max)3 Mbps

Eco Plan

RoHSNot Compliant

Design Kits & Evaluation Modules

  • Evaluation Modules & Boards: DLPNIRNANOEVM
    DLPВ® NIRscanВ™ Nano Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: CC256XSTBTBLESW
    TI Dual-mode BluetoothВ® Stack on STM32F4 MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: MSP-EXP430F5529
    MSP430F5529 USB Experimenter’s Board
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: BT-MSPAUDSOURCE
    Bluetooth and MSP430 Audio Source Reference Design Board
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: CC2564MODNEM
    Dual-mode BluetoothВ® CC2564 module evaluation board
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: CC256XQFNEM
    Dual-mode BluetoothВ® CC2564 evaluation board
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: MSP-EXP430F5438
    MSP430F5438 Experimenter Board
    Lifecycle Status: Active (Recommended for new designs)
  • Development Kits: DK-TM4C123G
    TM4C123G USB+CAN Development Kit
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: CC2564MODAEM
    Dual-mode BluetoothВ® CC2564 Module with Integrated Antenna Evaluation Board
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: BOOST-CC2564MODA
    Dual-mode BluetoothВ® CC2564 module with integrated antenna BoosterPackВ™ plug-in module
    Lifecycle Status: Active (Recommended for new designs)
  • Development Kits: DK-TM4C129X
    IoT Enabled ARMВ® CortexВ®-M4F MCU TM4C129X Connected Development Kit
    Lifecycle Status: Active (Recommended for new designs)

Application Notes

  • Using TI Technology to Simplify Bluetooth Pairing Via NFC
    PDF, 3.0 Mb, File published: Nov 28, 2011
    Bluetooth pairing usually involves some level of user interaction to confirm the identity of the user and/or the devices themselves. There are many pairing mechanisms available across the versions of Bluetooth (v2.0 through v4.0). This process is typically lengthy and sometimes confusing to the user, and so this application report is aimed at showing TI technology developers details on implementin
  • AN058 -- Antenna Selection Guide (Rev. B)
    PDF, 1.8 Mb, Revision: B, File published: Oct 6, 2010
  • DN035 -- Antenna Quick Guide (Rev. A)
    PDF, 138 Kb, Revision: A, File published: Feb 12, 2013

Model Line

Series: CC2564MODN (2)

Manufacturer's Classification

  • Semiconductors > Wireless Connectivity > Dual Mode Bluetooth (BLE/BT) > CC2564