Datasheet Texas Instruments CY54FCT541T

ManufacturerTexas Instruments
SeriesCY54FCT541T
Datasheet Texas Instruments CY54FCT541T

Octal Buffers and Line Drivers with 3-State Outputs

Datasheets

8-Bit Buffers/Line Drivers With 3-State Outputs datasheet
PDF, 681 Kb, File published: Oct 11, 2001
Extract from the document

Prices

Status

5962-9223701M2A5962-9223701MRA5962-9223705MRACY54FCT541TDMBCY54FCT541TLMB
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNo

Packaging

5962-9223701M2A5962-9223701MRA5962-9223705MRACY54FCT541TDMBCY54FCT541TLMB
N12345
Pin2020202020
Package TypeFKJJJFK
Industry STD TermLCCCCDIPCDIPCDIPLCCC
JEDEC CodeS-CQCC-NR-GDIP-TR-GDIP-TR-GDIP-TS-CQCC-N
Package QTY11111
CarrierTUBETUBETUBETUBETUBE
Width (mm)8.896.926.926.928.89
Length (mm)8.8924.224.224.28.89
Thickness (mm)1.834.574.574.571.83
Pitch (mm)1.272.542.542.541.27
Max Height (mm)2.035.085.085.082.03
Mechanical DataDownloadDownloadDownloadDownloadDownload
Device MarkingACY54FCT

Parametrics

Parameters / Models5962-9223701M2A
5962-9223701M2A
5962-9223701MRA
5962-9223701MRA
5962-9223705MRACY54FCT541TDMB
CY54FCT541TDMB
CY54FCT541TLMB
CY54FCT541TLMB
Bits8888
Input TypeTTLTTLTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125
Output TypeCMOSCMOSCMOSCMOS
Package GroupLCCCCDIPCDIPCDIPLCCC
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CDIP)See datasheet (CDIP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)
RatingMilitaryMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNoNo
Technology FamilyFCTFCTFCTFCTFCT
VCC(Max), V5.255.255.255.25
VCC(Min), V4.754.754.754.75
Voltage(Nom), V5555

Eco Plan

5962-9223701M2A5962-9223701MRA5962-9223705MRACY54FCT541TDMBCY54FCT541TLMB
RoHSSee ti.comSee ti.comSee ti.comSee ti.comSee ti.com

Application Notes

  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, File published: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, Revision: A, File published: Jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Introduction to Logic
    PDF, 93 Kb, File published: Apr 30, 2015

Model Line

Manufacturer's Classification

  • Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Buffer Drivers