Datasheet Texas Instruments CY54FCT543T

ManufacturerTexas Instruments
SeriesCY54FCT543T
Datasheet Texas Instruments CY54FCT543T

Octal Registered Transceivers with 3-State Outputs

Datasheets

8-Bit Latched Registered Transceivers With 3-State Outputs datasheet
PDF, 684 Kb, Revision: A, File published: Oct 1, 2001
Extract from the document

Prices

Status

5962-9222101M3A5962-9222101MLACY54FCT543TDMBCY54FCT543TLMB
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNo

Packaging

5962-9222101M3A5962-9222101MLACY54FCT543TDMBCY54FCT543TLMB
N1234
Pin28242428
Package TypeFKJTJTFK
Industry STD TermLCCCCDIPCDIPLCCC
JEDEC CodeS-CQCC-NR-GDIP-TR-GDIP-TS-CQCC-N
Package QTY1111
CarrierTUBETUBETUBETUBE
Width (mm)11.436.926.9211.43
Length (mm)11.43323211.43
Thickness (mm)1.834.74.71.83
Pitch (mm)1.272.542.541.27
Max Height (mm)2.035.085.082.03
Mechanical DataDownloadDownloadDownloadDownload
Device MarkingCY54FCT543TDMB5962-

Parametrics

Parameters / Models5962-9222101M3A
5962-9222101M3A
5962-9222101MLA
5962-9222101MLA
CY54FCT543TDMB
CY54FCT543TDMB
CY54FCT543TLMB
CY54FCT543TLMB
Bits8888
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125
Package GroupLCCCCDIPCDIPLCCC
Package Size: mm2:W x L, PKG28LCCC: 131 mm2: 11.43 x 11.43(LCCC)See datasheet (CDIP)See datasheet (CDIP)28LCCC: 131 mm2: 11.43 x 11.43(LCCC)
RatingMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNo
Technology FamilyFCTFCTFCTFCT
VCC(Max), V5.255.255.255.25
VCC(Min), V4.754.754.754.75

Eco Plan

5962-9222101M3A5962-9222101MLACY54FCT543TDMBCY54FCT543TLMB
RoHSSee ti.comSee ti.comSee ti.comSee ti.com

Application Notes

  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, File published: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, Revision: A, File published: Jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Introduction to Logic
    PDF, 93 Kb, File published: Apr 30, 2015

Model Line

Manufacturer's Classification

  • Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Transceivers