Datasheet Texas Instruments ISO7331-Q1

ManufacturerTexas Instruments
SeriesISO7331-Q1

Automotive, Low Power, Triple-Channel 2/1 Digital Isolator

Datasheets

ISO733x-Q1 Robust EMC, Low Power, Triple-Channel Digital Isolators datasheet
PDF, 1.3 Mb, File published: Nov 16, 2015
Extract from the document

Prices

Status

ISO7331CQDWQ1ISO7331CQDWRQ1ISO7331FCQDWQ1ISO7331FCQDWRQ1
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoYesYes

Packaging

ISO7331CQDWQ1ISO7331CQDWRQ1ISO7331FCQDWQ1ISO7331FCQDWRQ1
N1234
Pin16161616
Package TypeDWDWDWDW
Industry STD TermSOICSOICSOICSOIC
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY402000402000
CarrierTUBELARGE T&RTUBELARGE T&R
Device MarkingISO7331CQISO7331CQISO7331FCQISO7331FCQ
Width (mm)7.57.57.57.5
Length (mm)10.310.310.310.3
Thickness (mm)2.352.352.352.35
Pitch (mm)1.271.271.271.27
Max Height (mm)2.652.652.652.65
Mechanical DataDownloadDownloadDownloadDownload

Parametrics

Parameters / ModelsISO7331CQDWQ1ISO7331CQDWRQ1ISO7331FCQDWQ1ISO7331FCQDWRQ1
Data Rate(Max), Mbps25252525
Default OutputHighHighLowLow
Forward/Reverse Channels2/12/12/12/1
Integrated Isolated PowerNoNoNoNo
Isolation Rating, Vrms3000300030003000
Number of Channels3333
Operating Temperature Range, C-40 to 125-40 to 125-40 to 125-40 to 125
Package GroupSOICSOICSOICSOIC
Package Size: mm2:W x L, PKG16SOIC: 106 mm2: 10.3 x 10.3(SOIC)16SOIC: 106 mm2: 10.3 x 10.3(SOIC)16SOIC: 106 mm2: 10.3 x 10.3(SOIC)16SOIC: 106 mm2: 10.3 x 10.3(SOIC)
Propagation Delay, ns31313131
Propagation Delay(Typ), ns31313131
RatingAutomotiveAutomotiveAutomotiveAutomotive
Surge Voltage Rating, Vpk6000600060006000
VCC(Max), V5555
VCC(Min), V3.33.33.33.3

Eco Plan

ISO7331CQDWQ1ISO7331CQDWRQ1ISO7331FCQDWQ1ISO7331FCQDWRQ1
RoHSCompliantCompliantCompliantCompliant

Application Notes

  • Shelf-Life Evaluation of Lead-Free Component Finishes
    PDF, 1.3 Mb, File published: May 24, 2004
    The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a

Model Line

Manufacturer's Classification

  • Semiconductors> Isolation> Digital Isolators