Datasheet Texas Instruments ISO7331-Q1
Manufacturer | Texas Instruments |
Series | ISO7331-Q1 |
Automotive, Low Power, Triple-Channel 2/1 Digital Isolator
Datasheets
ISO733x-Q1 Robust EMC, Low Power, Triple-Channel Digital Isolators datasheet
PDF, 1.3 Mb, File published: Nov 16, 2015
Extract from the document
Prices
Status
ISO7331CQDWQ1 | ISO7331CQDWRQ1 | ISO7331FCQDWQ1 | ISO7331FCQDWRQ1 | |
---|---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | No | No | Yes | Yes |
Packaging
ISO7331CQDWQ1 | ISO7331CQDWRQ1 | ISO7331FCQDWQ1 | ISO7331FCQDWRQ1 | |
---|---|---|---|---|
N | 1 | 2 | 3 | 4 |
Pin | 16 | 16 | 16 | 16 |
Package Type | DW | DW | DW | DW |
Industry STD Term | SOIC | SOIC | SOIC | SOIC |
JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G |
Package QTY | 40 | 2000 | 40 | 2000 |
Carrier | TUBE | LARGE T&R | TUBE | LARGE T&R |
Device Marking | ISO7331CQ | ISO7331CQ | ISO7331FCQ | ISO7331FCQ |
Width (mm) | 7.5 | 7.5 | 7.5 | 7.5 |
Length (mm) | 10.3 | 10.3 | 10.3 | 10.3 |
Thickness (mm) | 2.35 | 2.35 | 2.35 | 2.35 |
Pitch (mm) | 1.27 | 1.27 | 1.27 | 1.27 |
Max Height (mm) | 2.65 | 2.65 | 2.65 | 2.65 |
Mechanical Data | Download | Download | Download | Download |
Parametrics
Parameters / Models | ISO7331CQDWQ1 | ISO7331CQDWRQ1 | ISO7331FCQDWQ1 | ISO7331FCQDWRQ1 |
---|---|---|---|---|
Data Rate(Max), Mbps | 25 | 25 | 25 | 25 |
Default Output | High | High | Low | Low |
Forward/Reverse Channels | 2/1 | 2/1 | 2/1 | 2/1 |
Integrated Isolated Power | No | No | No | No |
Isolation Rating, Vrms | 3000 | 3000 | 3000 | 3000 |
Number of Channels | 3 | 3 | 3 | 3 |
Operating Temperature Range, C | -40 to 125 | -40 to 125 | -40 to 125 | -40 to 125 |
Package Group | SOIC | SOIC | SOIC | SOIC |
Package Size: mm2:W x L, PKG | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) |
Propagation Delay, ns | 31 | 31 | 31 | 31 |
Propagation Delay(Typ), ns | 31 | 31 | 31 | 31 |
Rating | Automotive | Automotive | Automotive | Automotive |
Surge Voltage Rating, Vpk | 6000 | 6000 | 6000 | 6000 |
VCC(Max), V | 5 | 5 | 5 | 5 |
VCC(Min), V | 3.3 | 3.3 | 3.3 | 3.3 |
Eco Plan
ISO7331CQDWQ1 | ISO7331CQDWRQ1 | ISO7331FCQDWQ1 | ISO7331FCQDWRQ1 | |
---|---|---|---|---|
RoHS | Compliant | Compliant | Compliant | Compliant |
Application Notes
- Shelf-Life Evaluation of Lead-Free Component FinishesPDF, 1.3 Mb, File published: May 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a
Model Line
Series: ISO7331-Q1 (4)
Manufacturer's Classification
- Semiconductors> Isolation> Digital Isolators