Datasheet Texas Instruments MSP430F5229
Manufacturer | Texas Instruments |
Series | MSP430F5229 |
Ultra-Low Power 1.8V Split-Rail I/O
Datasheets
MSP430F522x, MSP430F521x Mixed-Signal Microcontrollers datasheet
PDF, 2.1 Mb, Revision: G, File published: Jun 28, 2016
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Status
MSP430F5229IRGCR | MSP430F5229IRGCT | MSP430F5229IYFFR | MSP430F5229IYFFT | MSP430F5229IZQE | MSP430F5229IZQER | |
---|---|---|---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | No | No | Yes | No | Yes | No |
Packaging
MSP430F5229IRGCR | MSP430F5229IRGCT | MSP430F5229IYFFR | MSP430F5229IYFFT | MSP430F5229IZQE | MSP430F5229IZQER | |
---|---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 | 6 |
Pin | 64 | 64 | 64 | 64 | 80 | 80 |
Package Type | RGC | RGC | YFF | YFF | ZQE | ZQE |
Industry STD Term | VQFN | VQFN | DSBGA | DSBGA | BGA MICROSTAR JUNIOR | BGA MICROSTAR JUNIOR |
JEDEC Code | S-PQFP-N | S-PQFP-N | R-XBGA-N | R-XBGA-N | S-PBGA-N | S-PBGA-N |
Package QTY | 2000 | 250 | 2500 | 250 | 360 | 2500 |
Carrier | LARGE T&R | SMALL T&R | LARGE T&R | SMALL T&R | JEDEC TRAY (5+1) | LARGE T&R |
Device Marking | F5229 | F5229 | M430F5229 | M430F5229 | F5229 | F5229 |
Width (mm) | 9 | 9 | 5 | 5 | ||
Length (mm) | 9 | 9 | 5 | 5 | ||
Thickness (mm) | .88 | .88 | .4 | .4 | .74 | .74 |
Pitch (mm) | .5 | .5 | .4 | .4 | .5 | .5 |
Max Height (mm) | 1 | 1 | .625 | .625 | 1 | 1 |
Mechanical Data | Download | Download | Download | Download | Download | Download |
Parametrics
Parameters / Models | MSP430F5229IRGCR | MSP430F5229IRGCT | MSP430F5229IYFFR | MSP430F5229IYFFT | MSP430F5229IZQE | MSP430F5229IZQER |
---|---|---|---|---|---|---|
ADC | ADC10 - 10ch | ADC10 - 10ch | ADC10 - 10ch | ADC10 - 10ch | ADC10 - 10ch | ADC10 - 10ch |
AES | N/A | N/A | N/A | N/A | N/A | N/A |
Active Power, uA/MHz | 404 | 404 | 404 | 404 | 404 | 404 |
Additional Features | Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA | Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA | Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA | Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA | Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA | Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA |
BSL | UART | UART | UART | UART | UART | UART |
CPU | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 |
Comparators | 8 | 8 | 8 | 8 | 8 | 8 |
DMA | 3 | 3 | 3 | 3 | 3 | 3 |
Featured | f5 | f5 | f5 | f5 | f5 | f5 |
Frequency, MHz | 25 | 25 | 25 | 25 | 25 | 25 |
GPIO Pins | 53 | 53 | 53 | 53 | 53 | 53 |
I2C | 2 | 2 | 2 | 2 | 2 | 2 |
Max VCC | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 |
Min VCC | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 |
Multiplier | 32x32 | 32x32 | 32x32 | 32x32 | 32x32 | 32x32 |
Non-volatile Memory, KB | 128 | 128 | 128 | 128 | 128 | 128 |
Operating Temperature Range, C | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 |
Package Group | VQFN | VQFN | DSBGA | DSBGA | BGA MICROSTAR JUNIOR | BGA MICROSTAR JUNIOR |
Package Size: mm2:W x L, PKG | 64VQFN: 81 mm2: 9 x 9(VQFN) | 64VQFN: 81 mm2: 9 x 9(VQFN) | See datasheet (DSBGA) | See datasheet (DSBGA) | 80BGA MICROSTAR JUNIOR: 25 mm2: 5 x 5(BGA MICROSTAR JUNIOR) | 80BGA MICROSTAR JUNIOR: 25 mm2: 5 x 5(BGA MICROSTAR JUNIOR) |
RAM, KB | 8 | 8 | 8 | 8 | 8 | 8 |
Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog |
SPI | 4 | 4 | 4 | 4 | 4 | 4 |
Special I/O | 1.8V I/O | 1.8V I/O | 1.8V I/O | 1.8V I/O | 1.8V I/O | 1.8V I/O |
Standby Power, LPM3-uA | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 |
Timers - 16-bit | 4 | 4 | 4 | 4 | 4 | 4 |
UART | 2 | 2 | 2 | 2 | 2 | 2 |
Wakeup Time, us | 3.5 | 3.5 | 3.5 | 3.5 | 3.5 | 3.5 |
Eco Plan
MSP430F5229IRGCR | MSP430F5229IRGCT | MSP430F5229IYFFR | MSP430F5229IYFFT | MSP430F5229IZQE | MSP430F5229IZQER | |
---|---|---|---|---|---|---|
RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Application Notes
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- Software I2C on MSP430 MCUsPDF, 126 Kb, File published: May 18, 2016
Hardware and layout limitations often require smaller package sizes that could potentially create a tradeoff for the number of serial peripherals available to the user. With the I2C protocol, special software can be created to use a pair of simple GPIO ports to emulate an I2C master device. This allows programmers to be flexible with pin assignments and enables smaller package devices to overcome - Low-Power Pedometer Using an MSP430 MCUPDF, 182 Kb, File published: May 28, 2013
This application report describes a low-power pedometer example application that uses an MSP430F5229 microcontroller and the TI Pedometer firmware algorithm. This application was developed and targeted for the health and fitness markets.Fitness monitors typically measure both a person's amount and rate of exercise (traveled distanced and pace) as well as effort expended (calories burned in the p - Enabling Low-Power Windows 8 HID Over I2C Applications Using MSP430 MCUsPDF, 1.4 Mb, File published: Nov 30, 2012
The Human Interface Device (HID) protocol was originally targeted at human interface devices such as keyboards, touchpads, mice, and joysticks. It was originally developed to run over USB and Bluetooth(R). For Windows 8(R), Microsoft created a new HID miniport driver that allows devices to communicate to SoC over an Inter-Integrated Circuit (I2C) bus. Power consumption and design simplicity are ke - Designing with MSP430F522x and MSP430F521x DevicesPDF, 72 Kb, File published: Nov 30, 2012
The MSP430F522x and MSP430F521x devices support a split supply I/O system that is essential in systems in which the MCU is required to interface with external devices (such as sensors or other processors) that operate at different voltage level compared to the MCU device supply. Additionally, the split supply input voltage range of the F522x and F521x devices starts as low as 1.62 V (see the devic - Using the MSP430 Timer_D Module in Hi-Resolution ModePDF, 870 Kb, File published: Oct 2, 2013
This application report describes the use of the high-resolution feature of the Timer_D module introduced in MSP430F51x1 and MSP430F51x2 devices. Timer_D enables applications that require high resolution such as capacitive touch detection, PWM DACs, advanced LED lighting, and digital controllers for power supplies. This application report provides an advanced description of the use and calibration - Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)PDF, 151 Kb, Revision: D, File published: Nov 3, 2016
This application report helps enable easy migration from MSP430F5xx and MSP430F6xx flash-based MCUs to the MSP430FR58xx/FR59xx/68xx/69xx FRAM-based MCUs. For the migration guide to MSP430FR57xx, see Migrating From the MSP430F2xx Family to the MSP430FR57xx Family. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight differences between the - General Oversampling of MSP ADCs for Higher Resolution (Rev. A)PDF, 551 Kb, Revision: A, File published: Apr 1, 2016
Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl - Design Considerations When Using the MSP430 Graphics LibraryPDF, 475 Kb, File published: Oct 5, 2012
LCDs are a growing commodity in todays market with products as diverse as children's toys to medical devices. Modern LCDs, along with the graphics displayed on them, are growing in complexity. A graphics library can simplify and accelerate development while creating the desired user experience. TI provides the MSP430 Graphics Library for use in developing products with the MSP430в„ў MCU. This - ESD Diode Current SpecificationPDF, 520 Kb, File published: Dec 7, 2015
This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document. - MSP Code Protection FeaturesPDF, 752 Kb, File published: Dec 7, 2015
MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur
Model Line
Series: MSP430F5229 (6)
Manufacturer's Classification
- Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430F5x/6x