Datasheet Texas Instruments MSP430FR5730

Manufacturer	Texas Instruments
Series	MSP430FR5730

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Packaging

Parametrics

Parameters / Models	MSP430FR5730IPW	MSP430FR5730IPWR	MSP430FR5730IRGER	MSP430FR5730IRGET
ADC	ADC10 - 8ch	ADC10 - 8ch	ADC10 - 8ch	ADC10 - 8ch
AES	N/A	N/A	N/A	N/A
Active Power, uA/MHz	91.667	91.667	91.667	91.667
Additional Features	Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA	Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA	Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA	Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA
BSL	UART	UART	UART	UART
CPU	MSP430	MSP430	MSP430	MSP430
Comparators	12	12	12	12
DMA	3	3	3	3
Featured	fr5	fr5	fr5	fr5
Frequency, MHz	24	24	24	24
GPIO Pins	21	21	21	21
I2C	1	1	1	1
Max VCC	3.6	3.6	3.6	3.6
Min VCC	2	2	2	2
Multiplier	32x32	32x32	32x32	32x32
Non-volatile Memory, KB	4	4	4	4
Operating Temperature Range, C	-40 to 85	-40 to 85	-40 to 85	-40 to 85
Package Group	TSSOP	TSSOP	VQFN	VQFN
Package Size: mm2:W x L, PKG	28TSSOP: 62 mm2: 6.4 x 9.7(TSSOP)	28TSSOP: 62 mm2: 6.4 x 9.7(TSSOP)	24VQFN: 16 mm2: 4 x 4(VQFN)	24VQFN: 16 mm2: 4 x 4(VQFN)
RAM, KB	1	1	1	1
Rating	Catalog	Catalog	Catalog	Catalog
SPI	2	2	2	2
Security Enabler	Cryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protection	Cryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protection	Cryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protection	Cryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protection
Special I/O	N/A	N/A	N/A	N/A
Standby Power, LPM3-uA	6.4	6.4	6.4	6.4
Timers - 16-bit	3	3	3	3
UART	1	1	1	1
Wakeup Time, us	78	78	78	78

Eco Plan

Application Notes

• Download
  Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A)
  PDF, 3.5 Mb, Revision: A, File published: Mar 2, 2015
• Download
  MSP430 System-Level ESD Considerations
  PDF, 1.5 Mb, File published: Mar 29, 2012
  System-Level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low power components. This application report addresses three different ESD topics to help board designers and OEMs understand and design robust system-level designs:(1) Component-level ESD testing and system-level ESD testing, their differ
• Download
  Maximizing Write Speed on the MSP430в„ў FRAM (Rev. B)
  PDF, 103 Kb, Revision: B, File published: Feb 4, 2015
  Nonvolatile low-power ferroelectric RAM (FRAM) is capable of extremely high-speed write accesses. This application report discusses how to maximize FRAM write speeds specifically in the MSP430FRxx family using simple techniques. The document uses examples from bench tests performed on the MSP430FR5739 device, which can be extended to all MSP430в„ў FRAM-based devices, and discusses tradeoffs such as
• Download
  MSP430 FRAM Technology – How To and Best Practices
  PDF, 326 Kb, File published: Jun 23, 2014
  FRAM is a non-volatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specif
• Download
  MSP430 FRAM Quality and Reliability (Rev. A)
  PDF, 295 Kb, Revision: A, File published: May 1, 2014
  FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endura
• Download
  Migrating from the USCI Module to the eUSCI Module (Rev. A)
  PDF, 41 Kb, Revision: A, File published: Sep 13, 2012
  The purpose of this application report is to enable easy migration for designs based on the USCI_A and USCI_B modules to the eUSCI_A and the eUSCI_B modules. The document highlights the new features in the eUSCI module and the main differences between the USCI and the eUSCI modules.
• Download
  Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)
  PDF, 154 Kb, Revision: A, File published: Feb 16, 2012
  This application report enables easy migration from MSP430F2xx Flash-based MCUs to the MSP430FR57xx family FRAM-based MCU. It covers programming, system, and peripheral considerations when migrating firmware. The purpose is to highlight differences between the two families. For more information on the usage of the MSP430FR57xx features, see the MSP430FR57xx Family User's Guide (
• Download
  General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
  PDF, 551 Kb, Revision: A, File published: Apr 1, 2016
  Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl

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Manufacturer's Classification

• Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430FRxx FRAM