Datasheet Texas Instruments 5962-9677301QRA

Manufacturer	Texas Instruments
Series	SN54AC574
Part Number	5962-9677301QRA

Octal D-type Edge-Triggered Flip-Flops with 3-State Outputs 20-CDIP -55 to 125

Datasheets

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PDF, 1.1 Mb, Revision: E, File published: Oct 23, 2003

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Status

Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	No

Packaging

Pin	20	20	20
Package Type	J	J	J
Industry STD Term	CDIP	CDIP	CDIP
JEDEC Code	R-GDIP-T	R-GDIP-T	R-GDIP-T
Package QTY	1	1	1
Carrier	TUBE	TUBE	TUBE
Device Marking	SNJ54AC574J	5962-9677301QR	A
Width (mm)	6.92	6.92	6.92
Length (mm)	24.2	24.2	24.2
Thickness (mm)	4.57	4.57	4.57
Pitch (mm)	2.54	2.54	2.54
Max Height (mm)	5.08	5.08	5.08
Mechanical Data	Download	Download	Download

Parametrics

3-State Output	Yes
Bits	8
F @ Nom Voltage(Max)	100 Mhz
ICC @ Nom Voltage(Max)	0.04 mA
Input Type	CMOS
Operating Temperature Range	-55 to 125 C
Output Drive (IOL/IOH)(Max)	24/-24 mA
Output Type	CMOS
Package Group	CDIP
Package Size: mm2:W x L	See datasheet (CDIP) PKG
Rating	Military
Technology Family	AC
VCC(Max)	6 V
VCC(Min)	2 V
tpd @ Nom Voltage(Max)	15,11 ns

Eco Plan

RoHS	See ti.com

Application Notes

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Input and Output Characteristics of Digital Integrated Circuits
PDF, 1.7 Mb, File published: Oct 1, 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
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Power-Up Behavior of Clocked Devices (Rev. A)
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TI IBIS File Creation Validation and Distribution Processes
PDF, 380 Kb, File published: Aug 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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Live Insertion
PDF, 150 Kb, File published: Oct 1, 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
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Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
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Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
PDF, 337 Kb, File published: Jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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Designing With Logic (Rev. C)
PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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Introduction to Logic
PDF, 93 Kb, File published: Apr 30, 2015
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Implications of Slow or Floating CMOS Inputs (Rev. D)
PDF, 260 Kb, Revision: D, File published: Jun 23, 2016
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CMOS Power Consumption and CPD Calculation (Rev. B)
PDF, 89 Kb, Revision: B, File published: Jun 1, 1997
Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
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Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
PDF, 43 Kb, File published: Apr 1, 1996
Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

Model Line

Series: SN54AC574 (6)

5962-9677301Q2A 5962-9677301QRA 5962-9677301QSA SNJ54AC574FK SNJ54AC574J SNJ54AC574W

Manufacturer's Classification

Semiconductors > Space & High Reliability > Logic Products > Flip-Flop/Latch/Registers

Other Names:

59629677301QRA, 5962 9677301QRA