Datasheet Texas Instruments SN54AS808B

Manufacturer	Texas Instruments
Series	SN54AS808B

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Parametrics

Parameters / Models	5962-88522012A	5962-8852201RA	5962-8852201SA	SN54AS808BJ	SNJ54AS808BFK	SNJ54AS808BJ
Bits	6	6		6	6	6
F @ Nom Voltage(Max), Mhz	125	125		125	125	125
ICC @ Nom Voltage(Max), mA	0.013	0.013		0.013	0.013	0.013
Input Type	TTL	TTL	TTL	TTL	TTL	TTL
Operating Temperature Range, C	-55 to 125	-55 to 125		-55 to 125	-55 to 125	-55 to 125
Operating Temperature Range(C)			-55 to 125
Output Drive (IOL/IOH)(Max), mA	-2/20	-2/20		-2/20	-2/20	-2/20
Output Type	TTL	TTL	TTL	TTL	TTL	TTL
Package Group	LCCC	CDIP	CDIP	CDIP	LCCC	CDIP
Package Size: mm2:W x L, PKG	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)		See datasheet (CDIP)	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)
Package Size: mm2:W x L (PKG)			See datasheet (CDIP)
Rating	Military	Military	Military	Military	Military	Military
Schmitt Trigger	No	No	No	No	No	No
Technology Family	AS	AS	AS	AS	AS	AS
VCC(Max), V	5.5	5.5		5.5	5.5	5.5
VCC(Max)(V)			5.5
VCC(Min), V	4.5	4.5		4.5	4.5	4.5
VCC(Min)(V)			4.5
tpd @ Nom Voltage(Max), ns	6.5	6.5		6.5	6.5	6.5
tpd @ Nom Voltage(Max)(ns)			6.5

Eco Plan

Application Notes

• Download
  Input and Output Characteristics of Digital Integrated Circuits
  PDF, 1.7 Mb, File published: Oct 1, 1996
  This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
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  Advanced Schottky (ALS and AS) Logic Families
  PDF, 1.9 Mb, File published: Aug 1, 1995
  This document introduces the advanced Schottky family of clamped TTL integrated circuits (ICs). Detailed electrical characteristics of the 'AS and 'ALS devices with table formats are provided. Guidelines for designing high-performance digital systems using the Advanced Schottky family are given along with a brief summary of the solutions to most design decisions needed to implement systems using t
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  TI IBIS File Creation Validation and Distribution Processes
  PDF, 380 Kb, File published: Aug 29, 2002
  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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  PDF, 277 Kb, File published: Feb 1, 1997
  Designers of high-speed systems that include advanced Schottky (AS) devices must consider the operating environment in their work. They must be aware of the individual device characteristics and their interaction with other devices. This document provides a detailed discussion of the waveform characteristics equivalent circuit models transmission line fanout and termination for AS load manageme
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  Live Insertion
  PDF, 150 Kb, File published: Oct 1, 1996
  Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
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  Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
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  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Kb, File published: Jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
• Download
  Designing With Logic (Rev. C)
  PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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  Introduction to Logic
  PDF, 93 Kb, File published: Apr 30, 2015
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  Shelf-Life Evaluation of Lead-Free Component Finishes
  PDF, 1.3 Mb, File published: May 24, 2004
  The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a

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Manufacturer's Classification

• Semiconductors> Space & High Reliability> Logic Products> Gate Products