Datasheet Texas Instruments SN54HCT245-SP

Manufacturer	Texas Instruments
Series	SN54HCT245-SP

Datasheets

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Packaging

Parametrics

Parameters / Models	5962-8550601VRA	5962-8550601VSA
Bits	8	8
Operating Temperature Range, C	-55 to 125	-55 to 125
Package Group	CDIP	CFP
Package Size: mm2:W x L, PKG	See datasheet (CDIP)	See datasheet (CFP)
Rating	Space	Space
Schmitt Trigger	No	No
Technology Family	HCT	HCT
VCC(Max), V	5.5	5.5
VCC(Min), V	4.5	4.5

Eco Plan

Application Notes

• Download
  SN54/74HCT CMOS Logic Family Applications and Restrictions
  PDF, 102 Kb, File published: May 1, 1996
  The TI SN54/74HCT family of CMOS devices is a subgroup of the SN74HC series with the HCT circuitry modified to meet the interfacing requirements of TTL outputs to high-speed CMOS inputs. The HCT devices can be driven by the TTL circuits directly without additional components. This document describes the TTL/HC interface the operating voltages circuit noise and power consumption. A Bergeron anal
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  TI IBIS File Creation Validation and Distribution Processes
  PDF, 380 Kb, File published: Aug 29, 2002
  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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  Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
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  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Kb, File published: Jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  Designing With Logic (Rev. C)
  PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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  Introduction to Logic
  PDF, 93 Kb, File published: Apr 30, 2015
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  Implications of Slow or Floating CMOS Inputs (Rev. D)
  PDF, 260 Kb, Revision: D, File published: Jun 23, 2016
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  CMOS Power Consumption and CPD Calculation (Rev. B)
  PDF, 89 Kb, Revision: B, File published: Jun 1, 1997
  Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
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  Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
  PDF, 43 Kb, File published: Apr 1, 1996
  Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

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Manufacturer's Classification

• Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Transceivers