Datasheet Texas Instruments SN74AHC16244

ManufacturerTexas Instruments
SeriesSN74AHC16244
Datasheet Texas Instruments SN74AHC16244

16-Bit Buffers/Drivers With 3-State Outputs

Datasheets

SNx4AHC16244 16-Bit Buffers/Drivers With 3-State Outputs datasheet
PDF, 846 Kb, Revision: H, File published: Oct 10, 2014
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Prices

Status

74AHC16244DGGRG4SN74AHC16244DGGRSN74AHC16244DGVRSN74AHC16244DLSN74AHC16244DLG4SN74AHC16244DLRSN74AHC16244DLRG4
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNo

Packaging

74AHC16244DGGRG4SN74AHC16244DGGRSN74AHC16244DGVRSN74AHC16244DLSN74AHC16244DLG4SN74AHC16244DLRSN74AHC16244DLRG4
N1234567
Pin48484848484848
Package TypeDGGDGGDGVDLDLDLDL
Industry STD TermTSSOPTSSOPTVSOPSSOPSSOPSSOPSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY200020002000252510001000
CarrierLARGE T&RLARGE T&RLARGE T&RTUBETUBELARGE T&RLARGE T&R
Device MarkingAHC16244AHC16244HE244AHC16244AHC16244AHC16244AHC16244
Width (mm)6.16.14.47.497.497.497.49
Length (mm)12.512.59.715.8815.8815.8815.88
Thickness (mm)1.151.151.052.592.592.592.59
Pitch (mm).5.5.4.635.635.635.635
Max Height (mm)1.21.21.22.792.792.792.79
Mechanical DataDownloadDownloadDownloadDownloadDownloadDownloadDownload

Parametrics

Parameters / Models74AHC16244DGGRG4
74AHC16244DGGRG4
SN74AHC16244DGGR
SN74AHC16244DGGR
SN74AHC16244DGVR
SN74AHC16244DGVR
SN74AHC16244DL
SN74AHC16244DL
SN74AHC16244DLG4
SN74AHC16244DLG4
SN74AHC16244DLR
SN74AHC16244DLR
SN74AHC16244DLRG4
SN74AHC16244DLRG4
Bits16161616161616
F @ Nom Voltage(Max), Mhz110110110110110110110
ICC @ Nom Voltage(Max), mA0.040.040.040.040.040.040.04
Operating Temperature Range, C-40 to 125-40 to 125-40 to 125-40 to 125-40 to 125-40 to 125-40 to 125
Output Drive (IOL/IOH)(Max), mA-8/8-8/8-8/8-8/8-8/8-8/8-8/8
Package GroupTSSOPTSSOPTVSOPSSOPSSOPSSOPSSOP
Package Size: mm2:W x L, PKG48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)48TVSOP: 62 mm2: 6.4 x 9.7(TVSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Schmitt TriggerNoNoNoNoNoNoNo
Technology FamilyAHCAHCAHCAHCAHCAHCAHC
VCC(Max), V5.55.55.55.55.55.55.5
VCC(Min), V2222222
Voltage(Nom), V3.3,53.3,53.3,53.3,53.3,53.3,53.3,5
tpd @ Nom Voltage(Max), ns11.5,8.511.5,8.511.5,8.511.5,8.511.5,8.511.5,8.511.5,8.5

Eco Plan

74AHC16244DGGRG4SN74AHC16244DGGRSN74AHC16244DGVRSN74AHC16244DLSN74AHC16244DLG4SN74AHC16244DLRSN74AHC16244DLRG4
RoHSCompliantCompliantCompliantCompliantCompliantCompliantCompliant

Application Notes

  • How to Select Little Logic (Rev. A)
    PDF, 1.1 Mb, Revision: A, File published: Jul 26, 2016
    TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b
  • Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
    PDF, 115 Kb, File published: Dec 1, 1997
    This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
  • Texas Instruments Little Logic Application Report
    PDF, 359 Kb, File published: Nov 1, 2002
    Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond
  • Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A)
    PDF, 154 Kb, Revision: A, File published: Sep 8, 1999
    In the last few years the trend toward reducing supply voltage (VCC) has continued as reflected in an additional specification of 2.5-V VCC for the AVC ALVT ALVC LVC LV and the CBTLV families.In this application report the different logic levels at VCC of 5 V 3.3 V 2.5 V and 1.8 V are compared. Within the report the possibilities for migration from 5-V logic and 3.3-V logic families
  • Advanced High-Speed CMOS (AHC) Logic Family (Rev. C)
    PDF, 102 Kb, Revision: C, File published: Dec 2, 2002
    The Texas Instruments (TI) advanced high-speed CMOS (AHC) logic family provides a natural migration for high-speed CMOS (HCMOS) users who need more speed for low-power and low-drive applications. Unlike many other advanced logic families AHC does not have the drawbacks that come with higher speed e.g. higher signal noise and power consumption. The AHC logic family consists of gates medium-sca
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, Revision: A, File published: Jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Live Insertion
    PDF, 150 Kb, File published: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Introduction to Logic
    PDF, 93 Kb, File published: Apr 30, 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, Revision: D, File published: Jun 23, 2016
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, Revision: B, File published: Jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale

Model Line

Manufacturer's Classification

  • Semiconductors> Logic> Buffer/Driver/Transceiver> Non-Inverting Buffer/Driver