Datasheet Texas Instruments SN74ALVC126

ManufacturerTexas Instruments
SeriesSN74ALVC126
Datasheet Texas Instruments SN74ALVC126

Quadruple Bus Buffer Gate With 3-State Outputs

Datasheets

SN74ALVC126 datasheet
PDF, 651 Kb, Revision: J, File published: Sep 17, 2004
Extract from the document

Prices

Status

SN74ALVC126DSN74ALVC126DGVRSN74ALVC126DGVRE4SN74ALVC126DRSN74ALVC126NSRSN74ALVC126PWRSN74ALVC126PWRE4SN74ALVC126PWRG4
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNoNo

Packaging

SN74ALVC126DSN74ALVC126DGVRSN74ALVC126DGVRE4SN74ALVC126DRSN74ALVC126NSRSN74ALVC126PWRSN74ALVC126PWRE4SN74ALVC126PWRG4
N12345678
Pin1414141414141414
Package TypeDDGVDGVDNSPWPWPW
Industry STD TermSOICTVSOPTVSOPSOICSOPTSSOPTSSOPTSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY502000200025002000200020002000
CarrierTUBELARGE T&RLARGE T&RLARGE T&RLARGE T&RLARGE T&RLARGE T&RLARGE T&R
Device MarkingALVC126VA126VA126ALVC126ALVC126VA126VA126VA126
Width (mm)3.914.44.43.915.34.44.44.4
Length (mm)8.653.63.68.6510.3555
Thickness (mm)1.581.051.051.581.95111
Pitch (mm)1.27.4.41.271.27.65.65.65
Max Height (mm)1.751.21.21.7521.21.21.2
Mechanical DataDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownload

Parametrics

Parameters / ModelsSN74ALVC126D
SN74ALVC126D
SN74ALVC126DGVR
SN74ALVC126DGVR
SN74ALVC126DGVRE4
SN74ALVC126DGVRE4
SN74ALVC126DR
SN74ALVC126DR
SN74ALVC126NSR
SN74ALVC126NSR
SN74ALVC126PWR
SN74ALVC126PWR
SN74ALVC126PWRE4
SN74ALVC126PWRE4
SN74ALVC126PWRG4
SN74ALVC126PWRG4
Bits44444444
F @ Nom Voltage(Max), Mhz100100100100100100100100
ICC @ Nom Voltage(Max), mA0.010.010.010.010.010.010.010.01
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85
Output Drive (IOL/IOH)(Max), mA-24/24-24/24-24/24-24/24-24/24-24/24-24/24-24/24
Package GroupSOICTVSOPTVSOPSOICSOTSSOPTSSOPTSSOP
Package Size: mm2:W x L, PKG14SOIC: 52 mm2: 6 x 8.65(SOIC)14TVSOP: 23 mm2: 6.4 x 3.6(TVSOP)14TVSOP: 23 mm2: 6.4 x 3.6(TVSOP)14SOIC: 52 mm2: 6 x 8.65(SOIC)14SO: 80 mm2: 7.8 x 10.2(SO)14TSSOP: 32 mm2: 6.4 x 5(TSSOP)14TSSOP: 32 mm2: 6.4 x 5(TSSOP)14TSSOP: 32 mm2: 6.4 x 5(TSSOP)
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Schmitt TriggerNoNoNoNoNoNoNoNo
Technology FamilyALVCALVCALVCALVCALVCALVCALVCALVC
VCC(Max), V3.63.63.63.63.63.63.63.6
VCC(Min), V1.651.651.651.651.651.651.651.65
Voltage(Nom), V1.8,2.5,2.7,3.31.8,2.5,2.7,3.31.8,2.5,2.7,3.31.8,2.5,2.7,3.31.8,2.5,2.7,3.31.8,2.5,2.7,3.31.8,2.5,2.7,3.31.8,2.5,2.7,3.3
tpd @ Nom Voltage(Max), ns5.6,3.4,3.15.6,3.4,3.15.6,3.4,3.15.6,3.4,3.15.6,3.4,3.15.6,3.4,3.15.6,3.4,3.15.6,3.4,3.1

Eco Plan

SN74ALVC126DSN74ALVC126DGVRSN74ALVC126DGVRE4SN74ALVC126DRSN74ALVC126NSRSN74ALVC126PWRSN74ALVC126PWRE4SN74ALVC126PWRG4
RoHSCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliant

Application Notes

  • TI SN74ALVC16835 Component Specification Analysis for PC100
    PDF, 43 Kb, File published: Aug 3, 1998
    The PC100 standard establishes design parameters for the PC SDRAM DIMM that is designed to operate at 100 MHz. The 168-pin, 8-byte, registered SDRAM DIMM is a JEDEC-defined device (JC-42.5-96-146A). Some of the defined signal paths include data signals, address signals, and control signals. This application report discusses the SN74ALVC16835 18-bit universal bus driver that is available from T
  • Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A)
    PDF, 96 Kb, Revision: A, File published: May 13, 1998
    Design of high-performance personal computer (PC) systems that are capable of meeting the needs imposed by modern operating systems and software includes the use of large banks of SDRAMs on DIMMs (see Figure 1).To meet the demands of stable functionality over the broad spectrum of operating environments, meet system timing needs, and to support data integrity, the loads presented by the large
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, Revision: B, File published: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Kb, File published: May 1, 1996
  • Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A)
    PDF, 154 Kb, Revision: A, File published: Sep 8, 1999
    In the last few years the trend toward reducing supply voltage (VCC) has continued as reflected in an additional specification of 2.5-V VCC for the AVC ALVT ALVC LVC LV and the CBTLV families.In this application report the different logic levels at VCC of 5 V 3.3 V 2.5 V and 1.8 V are compared. Within the report the possibilities for migration from 5-V logic and 3.3-V logic families

Model Line

Manufacturer's Classification

  • Semiconductors> Logic> Buffer/Driver/Transceiver> Non-Inverting Buffer/Driver