Datasheet Texas Instruments SN74ALVC164245

Manufacturer	Texas Instruments
Series	SN74ALVC164245

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Parametrics

Parameters / Models	74ALVC164245DGGRE4	74ALVC164245DGGRG4	74ALVC164245DGGTE4	74ALVC164245DGGTG4	74ALVC164245DLG4	74ALVC164245DLRG4	74ALVC164245GRDR	74ALVC164245ZQLR	74ALVC164245ZRDR	SN74ALVC164245-W	SN74ALVC164245DGGR	SN74ALVC164245DGGT	SN74ALVC164245DL	SN74ALVC164245DLR	SN74ALVC164245KR
Approx. Price (US$)							0.87 | 1ku			0.87 | 1ku					0.87 | 1ku
Bits	16	16	16	16	16	16		16	16		16	16	16	16
Bits(#)							16			16					16
ICCA Static Current, mA	0.04	0.04	0.04	0.04	0.04	0.04		0.04	0.04		0.04	0.04	0.04	0.04
ICCA Static Current(mA)							0.04			0.04					0.04
ICCB Static Current, mA	0.04	0.04	0.04	0.04	0.04	0.04		0.04	0.04		0.04	0.04	0.04	0.04
ICCB Static Current(mA)							0.04			0.04					0.04
Operating Temperature Range(C)							-40 to 85								-40 to 85
Package Group	TSSOP	TSSOP	TSSOP	TSSOP	SSOP	SSOP	BGA MICROSTAR JUNIOR	BGA MICROSTAR JUNIOR	BGA MICROSTAR JUNIOR	WAFERSALE	TSSOP	TSSOP	SSOP	SSOP	BGA MICROSTAR JUNIOR
Package Size: mm2:W x L, PKG	48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)	48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)	48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)	48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)	48SSOP: 164 mm2: 10.35 x 15.88(SSOP)	48SSOP: 164 mm2: 10.35 x 15.88(SSOP)		56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR)	56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR)		48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)	48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)	48SSOP: 164 mm2: 10.35 x 15.88(SSOP)	48SSOP: 164 mm2: 10.35 x 15.88(SSOP)
Package Size: mm2:W x L (PKG)							56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR)			56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR) 54BGA MICROSTAR JUNIOR: 44 mm2: 5.5 x 8(BGA MICROSTAR JUNIOR) 48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) 48SSOP: 164 mm2: 10.35 x 15.88(SSOP)					56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR)
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Special Features	N/A	N/A	N/A	N/A	N/A	N/A		N/A	N/A	N/A	N/A	N/A	N/A	N/A
Static Current, mA	0.04	0.04	0.04	0.04	0.04	0.04		0.04	0.04		0.04	0.04	0.04	0.04
Static Current(mA)										0.04
VCCA(Max), V	3.3	3.3	3.3	3.3	3.3	3.3		3.3	3.3		3.3	3.3	3.3	3.3
VCCA(Max)(V)							3.3			3.3					3.3
VCCA(Min), V	2.5	2.5	2.5	2.5	2.5	2.5		2.5	2.5		2.5	2.5	2.5	2.5
VCCA(Min)(V)							2.5			2.5					2.5
VCCB(Max), V	5	5	5	5	5	5		5	5		5	5	5	5
VCCB(Max)(V)							5			5					5
VCCB(Min), V	3.3	3.3	3.3	3.3	3.3	3.3		3.3	3.3		3.3	3.3	3.3	3.3
VCCB(Min)(V)							3.3			3.3					3.3

Eco Plan

Application Notes

• Download
  TI SN74ALVC16835 Component Specification Analysis for PC100
  PDF, 43 Kb, File published: Aug 3, 1998
  The PC100 standard establishes design parameters for the PC SDRAM DIMM that is designed to operate at 100 MHz. The 168-pin, 8-byte, registered SDRAM DIMM is a JEDEC-defined device (JC-42.5-96-146A). Some of the defined signal paths include data signals, address signals, and control signals. This application report discusses the SN74ALVC16835 18-bit universal bus driver that is available from T
• Download
  Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A)
  PDF, 96 Kb, Revision: A, File published: May 13, 1998
  Design of high-performance personal computer (PC) systems that are capable of meeting the needs imposed by modern operating systems and software includes the use of large banks of SDRAMs on DIMMs (see Figure 1).To meet the demands of stable functionality over the broad spectrum of operating environments, meet system timing needs, and to support data integrity, the loads presented by the large
• Download
  16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
  PDF, 895 Kb, Revision: B, File published: May 22, 2002
  TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
• Download
  Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
  PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
  The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
• Download
  Understanding Advanced Bus-Interface Products Design Guide
  PDF, 253 Kb, File published: May 1, 1996
• Download
  Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
  PDF, 115 Kb, File published: Dec 1, 1997
  This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
• Download
  Live Insertion
  PDF, 150 Kb, File published: Oct 1, 1996
  Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
• Download
  Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A)
  PDF, 154 Kb, Revision: A, File published: Sep 8, 1999
  In the last few years the trend toward reducing supply voltage (VCC) has continued as reflected in an additional specification of 2.5-V VCC for the AVC ALVT ALVC LVC LV and the CBTLV families.In this application report the different logic levels at VCC of 5 V 3.3 V 2.5 V and 1.8 V are compared. Within the report the possibilities for migration from 5-V logic and 3.3-V logic families
• Download
  CMOS Power Consumption and CPD Calculation (Rev. B)
  PDF, 89 Kb, Revision: B, File published: Jun 1, 1997
  Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
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  Input and Output Characteristics of Digital Integrated Circuits
  PDF, 1.7 Mb, File published: Oct 1, 1996
  This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou

Model Line

Manufacturer's Classification

• Semiconductors> Logic> Voltage Level Translation> Application Specific Voltage Translation