Datasheet Texas Instruments SN74CB3Q16211

ManufacturerTexas Instruments
SeriesSN74CB3Q16211
Datasheet Texas Instruments SN74CB3Q16211

24-Bit FET 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch

Datasheets

24-BIT SWITCH--SN74CB3Q16211 datasheet
PDF, 1.2 Mb, File published: May 10, 2004
Extract from the document

Prices

Status

SN74CB3Q16211DGGRSN74CB3Q16211DGVRSN74CB3Q16211DLSN74CB3Q16211DLRSN74CB3Q16211GQLRSN74CB3Q16211ZQLR
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Obsolete (Manufacturer has discontinued the production of the device)Active (Recommended for new designs)
Manufacture's Sample AvailabilityYesNoYesYesYesNo

Packaging

SN74CB3Q16211DGGRSN74CB3Q16211DGVRSN74CB3Q16211DLSN74CB3Q16211DLRSN74CB3Q16211GQLRSN74CB3Q16211ZQLR
N123456
Pin565656565656
Package TypeDGGDGVDLDLGQLZQL
Industry STD TermTSSOPTVSOPSSOPSSOPBGA MICROSTAR JUNIORBGA MICROSTAR JUNIOR
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PBGA-NR-PBGA-N
Package QTY200020002010001000
CarrierLARGE T&RLARGE T&RTUBELARGE T&RLARGE T&R
Device MarkingCB3Q16211BW211CB3Q16211CB3Q16211BW211
Width (mm)6.14.47.497.494.54.5
Length (mm)1411.318.4118.4177
Thickness (mm)1.151.052.592.59.75.75
Pitch (mm).5.4.635.635.65.65
Max Height (mm)1.21.22.792.7911
Mechanical DataDownloadDownloadDownloadDownloadDownloadDownload

Parametrics

Parameters / ModelsSN74CB3Q16211DGGR
SN74CB3Q16211DGGR
SN74CB3Q16211DGVR
SN74CB3Q16211DGVR
SN74CB3Q16211DL
SN74CB3Q16211DL
SN74CB3Q16211DLR
SN74CB3Q16211DLR
SN74CB3Q16211GQLR
SN74CB3Q16211GQLR
SN74CB3Q16211ZQLR
SN74CB3Q16211ZQLR
Additional FeaturesPowered off protectionPowered off protectionPowered off protectionPowered off protectionIOFFPowered off protection
Approx. Price (US$)0.94 | 1ku
Bandwidth, MHz500500500500500
Bandwidth(MHz)500
Configuration1:1 SPST1:1 SPST1:1 SPST1:1 SPSTSPST1:1 SPST
ESD Charged Device Model, kV11111
ESD Charged Device Model(kV)1
ESD HBM, kV22222
ESD HBM(kV)2
ICC(Max)(uA)3000
Input/Ouput Voltage(Max), V5.55.55.55.55.5
Input/Ouput Voltage(Max)(V)5.5
Input/Output Continuous Current(Max), mA6464646464
Input/Output Continuous Current(Max)(mA)64
Input/Output OFF-state Capacitance(Typ), pF44444
Input/Output ON-state Capacitance(Typ), pF1010101010
Number of Channels2424242424
Number of Channels(#)24
OFF-state leakage current(Max), µA11111
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85
Operating Temperature Range(C)-40 to 85
Package GroupTSSOPTVSOPSSOPSSOPBGA MICROSTAR JUNIORBGA MICROSTAR JUNIOR
Package Size: mm2:W x L, PKG56TSSOP: 113 mm2: 8.1 x 14(TSSOP)56TVSOP: 72 mm2: 6.4 x 11.3(TVSOP)56SSOP: 191 mm2: 10.35 x 18.42(SSOP)56SSOP: 191 mm2: 10.35 x 18.42(SSOP)56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR)
Package Size: mm2:W x L (PKG)56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR)
RatingCatalogCatalogCatalogCatalogCatalogCatalog
Ron(Max), Ohms99999
Ron(Max)(Ohms)9
Ron(Typ), Ohms55555
Ron(Typ)(Ohms)5
Supply Current(Max), uA20002000200020002000
Supply Current(Typ), uA10001000100010001000
Supply Range, Max3.63.63.63.63.6
VCC(Max)(V)3.6
VCC(Min)(V)2.3
VIH(Min), V1.71.71.71.71.7
VIL(Max), V0.80.80.80.80.8
Vdd(Max), V3.63.63.63.63.6
Vdd(Min), V2.32.32.32.32.3
Vss(Max), VN/AN/AN/AN/AN/A
Vss(Min), VN/AN/AN/AN/AN/A

Eco Plan

SN74CB3Q16211DGGRSN74CB3Q16211DGVRSN74CB3Q16211DLSN74CB3Q16211DLRSN74CB3Q16211GQLRSN74CB3Q16211ZQLR
RoHSCompliantCompliantCompliantCompliantNot CompliantCompliant
Pb FreeNo

Application Notes

  • CBT-C, CB3T, and CB3Q Signal-Switch Families
    PDF, 584 Kb, File published: Feb 4, 2003
    Signal switch devices are widely used in applications requiring bus isolation, multiplexing, demultiplexing, and voltage translation. Compared to other logic and linear product alternatives, signal switches are the fastest and least power consuming. Texas Instruments (TI) CBT-C, CB3Q, and CB3T signal-switch families have low on-state resistance, negligible power consumption, and better undershoot
  • Bus FET Switch Solutions for Live Insertion Applications
    PDF, 300 Kb, File published: Feb 7, 2003
    In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ

Model Line

Manufacturer's Classification

  • Semiconductors> Switches and Multiplexers> Analog Switches/Muxes