Datasheet Texas Instruments SN74LVTH162245-EP

Manufacturer	Texas Instruments
Series	SN74LVTH162245-EP

Datasheets

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Status

Packaging

Parametrics

Parameters / Models	CLVTH162245IDGGREP	CLVTH162245MDLREP	V62/04709-01XE	V62/04709-02YE
Bits	16	16	16	16
Operating Temperature Range, C	-40 to 85,-55 to 125	-40 to 85,-55 to 125	-40 to 85,-55 to 125	-40 to 85,-55 to 125
Package Group	TSSOP	SSOP	TSSOP	SSOP
Package Size: mm2:W x L, PKG	48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)	48SSOP: 164 mm2: 10.35 x 15.88(SSOP)	48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)	48SSOP: 164 mm2: 10.35 x 15.88(SSOP)
Rating	HiRel Enhanced Product	HiRel Enhanced Product	HiRel Enhanced Product	HiRel Enhanced Product
Schmitt Trigger	No	No	No	No
Technology Family	LVT	LVT	LVT	LVT
VCC(Max), V	3.6	3.6	3.6	3.6
VCC(Min), V	2.7	2.7	2.7	2.7

Eco Plan

Application Notes

• Download
  LVT Family Characteristics (Rev. A)
  PDF, 98 Kb, Revision: A, File published: Mar 1, 1998
  To address the need for a complete low-voltage interface solution, Texas Instruments has developed a new generation of logic devices capable of mixed-mode operation. The LVT series relies on a state-of-the-art submicron BiCMOS process to provide up to a 90% reduction in static power dissipation over ABT. LVT devices solve the system need for a transparent seam between the low-voltage and 5-V secti
• Download
  LVT-to-LVTH Conversion
  PDF, 84 Kb, File published: Dec 8, 1998
  Original LVT devices that have bus hold have been redesigned to add the High-Impedance State During Power Up and Power Down feature. Additional devices with and without bus hold have been added to the LVT product line. Design guidelines and issues related to the bus-hold features, switching characteristics, and timing requirements are discussed.
• Download
  16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
  PDF, 895 Kb, Revision: B, File published: May 22, 2002
  TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
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  Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
  PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
  The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
• Download
  Understanding Advanced Bus-Interface Products Design Guide
  PDF, 253 Kb, File published: May 1, 1996
• Download
  Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
  PDF, 209 Kb, File published: May 10, 2002
  Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features

Model Line

Manufacturer's Classification

• Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Transceivers