Datasheet Texas Instruments TLV170IDR
| Manufacturer | Texas Instruments |
| Series | TLV170 |
| Part Number | TLV170IDR |
36V, 1.2 MHz, microPower, Rail-to-Rail Output, General Purpose Op Amp 8-SOIC -40 to 125
Datasheets
TLVx170 36-V, Single-Supply, EMI-Hardened, Low-Power Operational Amplifiers for Cost-Sensitive Systems datasheet
PDF, 1.9 Mb, File published: Nov 16, 2016
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Prices
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes |
Packaging
| Pin | 8 |
| Package Type | D |
| Industry STD Term | SOIC |
| JEDEC Code | R-PDSO-G |
| Package QTY | 2500 |
| Carrier | LARGE T&R |
| Device Marking | TLV170 |
| Width (mm) | 3.91 |
| Length (mm) | 4.9 |
| Thickness (mm) | 1.58 |
| Pitch (mm) | 1.27 |
| Max Height (mm) | 1.75 |
| Mechanical Data | Download |
Parametrics
| Additional Features | Cost Optimized,EMI Hardened |
| Architecture | CMOS |
| CMRR(Min) | 95 dB |
| CMRR(Typ) | 110 dB |
| GBW(Typ) | 1.2 MHz |
| Iq per channel(Max) | 0.175 mA |
| Iq per channel(Typ) | 0.125 mA |
| Number of Channels | 1 |
| Offset Drift(Typ) | 2 uV/C |
| Operating Temperature Range | -40 to 125 C |
| Output Current(Typ) | 17 mA |
| Package Group | SOIC |
| Package Size: mm2:W x L | 8SOIC: 29 mm2: 6 x 4.9(SOIC) PKG |
| Rail-to-Rail | Out |
| Rating | Catalog |
| Slew Rate(Typ) | 0.4 V/us |
| Total Supply Voltage(Max) | 36 +5V=5, +/-5V=10 |
| Total Supply Voltage(Min) | 2.7 +5V=5, +/-5V=10 |
| Vn at 1kHz(Typ) | 22 nV/rtHz |
| Vos (Offset Voltage @ 25C)(Max) | 2.5 mV |
Eco Plan
| RoHS | Compliant |
Design Kits & Evaluation Modules
- Evaluation Modules & Boards: DIP-ADAPTER-EVM
DIP Adapter Evaluation Module
Lifecycle Status: Active (Recommended for new designs)
Application Notes
- Interfacing a Differential-Output (Isolated) Amp to a Single-Ended Input ADCPDF, 177 Kb, File published: Apr 19, 2017
Model Line
Series: TLV170 (3)
- TLV170IDBVR TLV170IDBVT TLV170IDR
Manufacturer's Classification
- Semiconductors > Amplifiers > Operational Amplifiers (Op Amps) > General-Purpose Op Amps
