Package Intersil V416.27x27
416 Plastic Ball Grid Array Package (Cavity Down)
Package Outline Drawing (POD)
Parametrics
Family | PBGA |
Pin Count | 416 |
Weight | 2.28 g |
Pitch | 25.40 mm |
Peak Temperature | 235 °C |
Lead Free Peak Temperature | 260 °C |
Features | Plastic |
Package Index | V416.27X27 |
Model Line
Series: BGA (14)
Manufacturer's Classification
- Plastic Packages