Plastic Packages for Integrated Circuits Package Outline Drawing
Q80.12x12B
80 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE (LQFP)
Rev 0, 3/11
14.00
12.00
D A 3 4 14.00
12.00 3 4 B 0.20 C A-B D 4X TOP VIEW 1.60 MAX 11/13В° 0В° MIN.
0.05 0.20 -0.03/+0.07
0.08 M C A -B D 2 1.40 В±0.05 0.08 C C
0.09-0.20 BOTTOM VIEW 0.20 H A-B D 0.50 H 4X 0.05/0.15 SEE DETAIL "A" 6 0.08
R. MIN.
0.20 MIN. 0.25
0-7В° GAUGE
PLANE
0.60 В±0.15 (1.00) SIDE VIEW DETAIL "A"
SCALE: NONE (14.60) (0.28) TYP NOTES:
1. All dimensioning and tolerancing conform to ANSI Y14.5-1982.
2. Datum plane H located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting line.
3. Dimensions do not include mold protrusion. Allowable mold
protrusion is 0.25mm per side.
4. These dimensions to be determined at datum plane H. (14.60) 5. Package top dimensions are smaller than bottom dimensions …
