Datasheet Texas Instruments TPS65176RHDT

Manufacturer	Texas Instruments
Series	TPS65176
Part Number	TPS65176RHDT

LCD Bias IC for TV 28-VQFN -40 to 85

Datasheets

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PDF, 699 Kb, File published: Oct 16, 2012

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To request a full data sheet, please send an email to:
display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION
Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (В°C) Top-Side Markings (3) (4) TPS65176RHDR ACTIVE VQFN RHD 28 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TPS
65176 TPS65176RHDT ACTIVE VQFN RHD 28 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TPS
65176 (1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan -The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) -please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight …

Prices

Status

Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	Yes

Packaging

Pin	28
Package Type	RHD
Industry STD Term	VQFN
JEDEC Code	S-PQFP-N
Package QTY	250
Carrier	SMALL T&R
Width (mm)	5
Length (mm)	5
Thickness (mm)	0.9
Pitch (mm)	0.5
Max Height (mm)	1
Mechanical Data	Download

Parametrics

DisplayType	LCD Unipolar
IC Integration	LCD Bias
Pin/Package	28VQFN
Source Driver Voltage(Max)	18.5 V
Source Driver Voltage(Min)	13.7 V
Special Function	Reset Generator
Target Application	13 to 21 inches,21 inches and above
Topology	Boost,Buck
Vin(Max)	14 V
Vin(Min)	9.5 V

Eco Plan

RoHS

Compliant

Application Notes

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Generation of a VCOM buffer input using PWM signal
PDF, 439 Kb, File published: Dec 21, 2015
In an LCD the backlight shines through the liquid crystal material and the voltage across the liquid crystal controls how much light shines through it. An active matrix LCD (AMLCD) contains many pixels arranged in a grid pattern. The voltage across each pixel is controlled individually so that high resolution images can be created. One terminal of every pixel is connected to a common plane. The v
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Understanding Undervoltage Lockout in Power Devices (Rev. A)
PDF, 90 Kb, Revision: A, File published: Sep 19, 2018
Many integrated circuits include an undervoltage lockout (UVLO) function to disable the device at low supply voltages. Below the minimum supply voltage the function and performance of a device may be undefined making it impossible to predict system behavior. This application note explains how to correctly understand the undervoltage lockout specification in the data sheets of TI's power products.
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Minimizing Ringing at the Switch Node of a Boost Converter
PDF, 201 Kb, File published: Sep 15, 2006
The application report explains how to use proper board layout and/or a snubber to reduce high-frequency ringing at the switch node of a boost converter.
Download
Basic Calculation of a Boost Converter's Power Stage (Rev. C)
PDF, 186 Kb, Revision: C, File published: Jan 8, 2014
This application note gives the equations to calculate the power stage of a boost converter built with an IC with integrated switch and operating in continuous conduction mode. It is not intended to give details on the functionality of a boost converter (see Reference 1) or how to compensate a converter. See the references at the end of this document if more detail is needed.

Model Line

Series: TPS65176 (2)

TPS65176RHDR TPS65176RHDT

Manufacturer's Classification

Semiconductors > Power Management > LCD/OLED Display Bias Solutions