Datasheet ADA4177-1, ADA4177-2, ADA4177-4 (Analog Devices) - 7

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Data Sheet ADA4177-1/ADA4177-2/ADA4177-4 ABSOLUTE MAXIMUM RATINGS Table 4.
The power dissipated in the package (PD) is the sum of the
Parameter Rating
quiescent power dissipation and the power dissipated by the output stage transistor. It is calculated as follows: Supply Voltage 36 V Input Voltage V ± 32 V P SY D = (VSY × ISY) + (VSY − VOUT) × ILOAD Differential Input Voltage ±V SY where: Output Short-Circuit Duration to GND See the Maximum Power V Dissipation section SY is the power supply rail. I Storage Temperature Range −65°C to +150°C SY is the quiescent current. V Operating Temperature Range −40°C to +125°C OUT is the output of the amplifier. I Junction Temperature Range −65°C to +150°C LOAD is the output load. Lead Temperature, Soldering (10 sec)1 300°C Do not exceed the 150°C maximum junction temperature for ESD the device. Exceeding the junction temperature limit can cause Human Body Model (HBM)2 4 kV degradation in the parametric performance or even destroy the Field Induced Charged Device 1250 V device. Refer to Technical Article MS-2251, Data Sheet Intricacies— Model (FICDM)3 Absolute Maximum Ratings and Thermal Resistances, for more Machine Model (MM) 200 V information. 1 IPC/JEDEC J-STS-020D applicable standard.
THERMAL RESISTANCE
2 ESDA/JEDEC JS-001-2011 applicable standard. 3 JESD22-C101 (ESD FICDM standard of JEDEC) applicable standard. Thermal resistance between junction and ambient (θJA) is Stresses at or above those listed under Absolute Maximum specified for the worst-case conditions, that is, a device soldered Ratings may cause permanent damage to the product. This is a in a circuit board for surface-mount packages. stress rating only; functional operation of the product at these
Table 5. Thermal Resistance
or any other conditions above those indicated in the operational
Package Type θ θ Unit
section of this specification is not implied. Operation beyond
JA JC
8-Lead MSOP 190 44 °C/W the maximum operating conditions for extended periods may 8-Lead SOIC 158 43 °C/W affect product reliability. 14-Lead TSSOP 240 43 °C/W
MAXIMUM POWER DISSIPATION
14-Lead SOIC 115 36 °C/W The ADA4177-1, ADA4177-2, and ADA4177-4 can drive a short-circuit output current of up to 65 mA. However, the
ESD CAUTION
usable output load current drive is limited by the maximum power dissipation al owed by the device package. The absolute maximum junction temperature is 150°C (see Table 4). The junction temperature can be estimated as follows: T J = PD × θJA + TA where: T J is the die junction temperature. PD is the power dissipated in the package. θJA is the thermal resistance of the package. T A is the ambient temperature. Rev. C | Page 7 of 31 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PIN CONNECTION DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS, ±5 V ELECTRICAL CHARACTERISTICS, ±15 V ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION ACTIVE OVERVOLTAGE PROTECTION Common Protection Methods Add an External Series Input Resistor Add External Clamping Diodes Input Protection Circuit LIMITING OVERVOLTAGE CURRENT OUT OF THE POSITIVE SUPPLY PIN EMI PROTECTION SELF HEATING USING THE ADA4177-1/ADA4177-2/ADA4177-4 AS A COMPARATOR OUTPUT PHASE REVERSAL PROPER PRINTED CIRCUIT BOARD (PCB) LAYOUT OUTLINE DIMENSIONS ORDERING GUIDE