Datasheet MCP6041, MCP6042, MCP6043, MCP6044 (Microchip) - 3
| Manufacturer | Microchip |
| Description | Оperational amplifier (op amp) has a gain bandwidth product of 14 kHz with a low typical operating current of 600 nA and an offset voltage that is less than 3 mV |
| Pages / Page | 40 / 3 — MCP6041/2/3/4. AC ELECTRICAL CHARACTERISTICS. Electrical … |
| File Format / Size | PDF / 1.2 Mb |
| Document Language | English |
MCP6041/2/3/4. AC ELECTRICAL CHARACTERISTICS. Electrical Characteristics:. Parameters. Sym. Min. Typ. Max. Units. Conditions. AC Response
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MCP6041/2/3/4 AC ELECTRICAL CHARACTERISTICS Electrical Characteristics:
Unless otherwise indicated, VDD = +1.4V to +5.5V, VSS = GND, TA = 25°C, VCM = VDD/2, V OUT VDD/2, VL = VDD/2, RL = 1 Mto VL, and CL = 60 pF (refer to Figure 1-2 and Figure 1-3).
Parameters Sym Min Typ Max Units Conditions AC Response
Gain Bandwidth Product GBWP — 14 — kHz Slew Rate SR — 3.0 — V/ms Phase Margin PM — 65 — ° G = +1 V/V
Noise
Input Voltage Noise Eni — 5.0 — µVP-P f = 0.1 Hz to 10 Hz Input Voltage Noise Density eni — 170 — nV/Hz f = 1 kHz Input Current Noise Density ini — 0.6 — fA/Hz f = 1 kHz
MCP6043 CHIP SELECT (CS) ELECTRICAL CHARACTERISTICS Electrical Characteristics:
Unless otherwise indicated, VDD = +1.4V to +5.5V, VSS = GND, TA = 25°C, VCM = VDD/2, V OUT VDD/2, VL = VDD/2, RL = 1 Mto VL, and CL = 60 pF (refer to Figure 1-2 and Figure 1-3).
Parameters Sym Min Typ Max Units Conditions CS Low Specifications
CS Logic Threshold, Low VIL VSS — VSS+0.3 V CS Input Current, Low ICSL — 5 — pA CS = VSS
CS High Specifications
CS Logic Threshold, High VIH VDD–0.3 — VDD V CS Input Current, High ICSH — 5 — pA CS = VDD CS Input High, GND Current ISS — -20 — pA CS = VDD Amplifier Output Leakage, CS High IOLEAK — 20 — pA CS = VDD
Dynamic Specifications
CS Low to Amplifier Output Turn-on Time tON — 2 50 ms G = +1V/V, CS = 0.3V to VOUT = 0.9VDD/2 CS High to Amplifier Output High-Z tOFF — 10 — µs G = +1V/V, CS = VDD–0.3V to VOUT = 0.1VDD/2 Hysteresis VHYST — 0.6 — V VDD = 5.0V V CS IL VIH t t OFF ON VOUT High-Z High-Z -0.6 µA I -20 pA (typical) SS -20 pA (typical) (typical) ICS 5 pA (typical)
FIGURE 1-1:
Chip Select (CS) Timing Diagram (MCP6043 only). 2001-2013 Microchip Technology Inc. DS21669D-page 3 Document Outline 1.0 Electrical Characteristics FIGURE 1-1: Chip Select (CS) Timing Diagram (MCP6043 only). 1.1 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift with TA = -40°C to +85°C. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 1.4V. FIGURE 2-4: Input Offset Voltage Drift with TA = +85°C to +125°C and VDD = 1.4V. FIGURE 2-5: Input Offset Voltage Drift with TA = +25°C to +125°C and VDD = 5.5V. FIGURE 2-6: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 5.5V. FIGURE 2-7: Input Offset Voltage vs. Output Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: The MCP6041/2/3/4 family shows no phase reversal. FIGURE 2-11: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-12: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-13: Input Bias, Offset Currents vs. Ambient Temperature. FIGURE 2-14: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-15: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-16: Input Bias, Offset Currents vs. Common Mode Input Voltage. FIGURE 2-17: DC Open-Loop Gain vs. Load Resistance. FIGURE 2-18: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-19: Channel-to-Channel Separation vs. Frequency (MCP6042 and MCP6044 only). FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature with VDD = 1.4V. FIGURE 2-21: Quiescent Current vs. Power Supply Voltage. FIGURE 2-22: Gain Bandwidth Product, Phase Margin vs. Common Mode Input Voltage. FIGURE 2-23: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature with VDD = 5.5V. FIGURE 2-24: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-25: Output Voltage Headroom vs. Output Current Magnitude. FIGURE 2-26: Slew Rate vs. Ambient Temperature. FIGURE 2-27: Small Signal Non-inverting Pulse Response. FIGURE 2-28: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-29: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-30: Small Signal Inverting Pulse Response. FIGURE 2-31: Large Signal Non-inverting Pulse Response. FIGURE 2-32: Chip Select (CS) to Amplifier Output Response Time (MCP6043 only). FIGURE 2-33: Input Current vs. Input Voltage (below VSS). FIGURE 2-34: Large Signal Inverting Pulse Response. FIGURE 2-35: Chip Select (CS) Hysteresis (MCP6043 only). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Chip Select Digital Input 3.4 Power Supply Pins 4.0 Applications Information 4.1 Rail-to-Rail Input FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Output Loads and Battery Life 4.4 Capacitive Loads FIGURE 4-3: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-4: Recommended RISO Values for Capacitive Loads. 4.5 MCP6043 Chip Select 4.6 Supply Bypass 4.7 Unused Op Amps FIGURE 4-5: Unused Op Amps. 4.8 PCB Surface Leakage FIGURE 4-6: Example Guard Ring Layout for Inverting Gain. 4.9 Application Circuits FIGURE 4-7: High-Side Battery Current Sensor. FIGURE 4-8: Two Op Amp Instrumentation Amplifier. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 MAPS (Microchip Advanced Part Selector) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service
MCP6041/2/3/4 AC ELECTRICAL CHARACTERISTICS Electrical Characteristics:
Unless otherwise indicated, VDD = +1.4V to +5.5V, VSS = GND, TA = 25°C, VCM = VDD/2, V OUT VDD/2, VL = VDD/2, RL = 1 Mto VL, and CL = 60 pF (refer to Figure 1-2 and Figure 1-3).
Parameters Sym Min Typ Max Units Conditions AC Response
Gain Bandwidth Product GBWP — 14 — kHz Slew Rate SR — 3.0 — V/ms Phase Margin PM — 65 — ° G = +1 V/V
Noise
Input Voltage Noise Eni — 5.0 — µVP-P f = 0.1 Hz to 10 Hz Input Voltage Noise Density eni — 170 — nV/Hz f = 1 kHz Input Current Noise Density ini — 0.6 — fA/Hz f = 1 kHz
MCP6043 CHIP SELECT (CS) ELECTRICAL CHARACTERISTICS Electrical Characteristics:
Unless otherwise indicated, VDD = +1.4V to +5.5V, VSS = GND, TA = 25°C, VCM = VDD/2, V OUT VDD/2, VL = VDD/2, RL = 1 Mto VL, and CL = 60 pF (refer to Figure 1-2 and Figure 1-3).
Parameters Sym Min Typ Max Units Conditions CS Low Specifications
CS Logic Threshold, Low VIL VSS — VSS+0.3 V CS Input Current, Low ICSL — 5 — pA CS = VSS
CS High Specifications
CS Logic Threshold, High VIH VDD–0.3 — VDD V CS Input Current, High ICSH — 5 — pA CS = VDD CS Input High, GND Current ISS — -20 — pA CS = VDD Amplifier Output Leakage, CS High IOLEAK — 20 — pA CS = VDD
Dynamic Specifications
CS Low to Amplifier Output Turn-on Time tON — 2 50 ms G = +1V/V, CS = 0.3V to VOUT = 0.9VDD/2 CS High to Amplifier Output High-Z tOFF — 10 — µs G = +1V/V, CS = VDD–0.3V to VOUT = 0.1VDD/2 Hysteresis VHYST — 0.6 — V VDD = 5.0V V CS IL VIH t t OFF ON VOUT High-Z High-Z -0.6 µA I -20 pA (typical) SS -20 pA (typical) (typical) ICS 5 pA (typical)
FIGURE 1-1:
Chip Select (CS) Timing Diagram (MCP6043 only). 2001-2013 Microchip Technology Inc. DS21669D-page 3 Document Outline 1.0 Electrical Characteristics FIGURE 1-1: Chip Select (CS) Timing Diagram (MCP6043 only). 1.1 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift with TA = -40°C to +85°C. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 1.4V. FIGURE 2-4: Input Offset Voltage Drift with TA = +85°C to +125°C and VDD = 1.4V. FIGURE 2-5: Input Offset Voltage Drift with TA = +25°C to +125°C and VDD = 5.5V. FIGURE 2-6: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 5.5V. FIGURE 2-7: Input Offset Voltage vs. Output Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: The MCP6041/2/3/4 family shows no phase reversal. FIGURE 2-11: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-12: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-13: Input Bias, Offset Currents vs. Ambient Temperature. FIGURE 2-14: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-15: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-16: Input Bias, Offset Currents vs. Common Mode Input Voltage. FIGURE 2-17: DC Open-Loop Gain vs. Load Resistance. FIGURE 2-18: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-19: Channel-to-Channel Separation vs. Frequency (MCP6042 and MCP6044 only). FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature with VDD = 1.4V. FIGURE 2-21: Quiescent Current vs. Power Supply Voltage. FIGURE 2-22: Gain Bandwidth Product, Phase Margin vs. Common Mode Input Voltage. FIGURE 2-23: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature with VDD = 5.5V. FIGURE 2-24: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-25: Output Voltage Headroom vs. Output Current Magnitude. FIGURE 2-26: Slew Rate vs. Ambient Temperature. FIGURE 2-27: Small Signal Non-inverting Pulse Response. FIGURE 2-28: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-29: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-30: Small Signal Inverting Pulse Response. FIGURE 2-31: Large Signal Non-inverting Pulse Response. FIGURE 2-32: Chip Select (CS) to Amplifier Output Response Time (MCP6043 only). FIGURE 2-33: Input Current vs. Input Voltage (below VSS). FIGURE 2-34: Large Signal Inverting Pulse Response. FIGURE 2-35: Chip Select (CS) Hysteresis (MCP6043 only). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Chip Select Digital Input 3.4 Power Supply Pins 4.0 Applications Information 4.1 Rail-to-Rail Input FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Output Loads and Battery Life 4.4 Capacitive Loads FIGURE 4-3: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-4: Recommended RISO Values for Capacitive Loads. 4.5 MCP6043 Chip Select 4.6 Supply Bypass 4.7 Unused Op Amps FIGURE 4-5: Unused Op Amps. 4.8 PCB Surface Leakage FIGURE 4-6: Example Guard Ring Layout for Inverting Gain. 4.9 Application Circuits FIGURE 4-7: High-Side Battery Current Sensor. FIGURE 4-8: Two Op Amp Instrumentation Amplifier. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 MAPS (Microchip Advanced Part Selector) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service
