Datasheet MCP6H01, MCP6H02, MCP6H04 (Microchip)

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MCP6H01/2/4 1.2 MHz, 16V Op Amps Features: Description:
• Input Offset Voltage: ±0.7 mV (typical) Microchip’s MCP6H01/2/4 family of operational amplifi- • Quiescent Current: 135 µA (typical) ers (op amps) has a wide supply voltage range of 3.5V • Common Mode Rejection Ratio: 100 dB (typical) to 16V and rail-to-rail output operation. This family is unity gain stable and has a gain bandwidth product of • Power Supply Rejection Ratio: 102 dB (typical) 1.2 MHz (typical). These devices operate with a • Rail-to-Rail Output single-supply voltage as high as 16V, while only • Supply Voltage Range: drawing 135 µA/amplifier (typical) of quiescent current. - Single-Supply Operation: 3.5V to 16V The MCP6H01/2/4 family is offered in single - Dual-Supply Operation: ±1.75V to ±8V (MCP6H01), dual (MCP6H02) and quad (MCP6H04) • Gain Bandwidth Product: 1.2 MHz (typical) configurations. All devices are fully specified in • Slew Rate: 0.8V/µs (typical) extended temperature range from -40°C to +125°C. • Unity Gain Stable
Package Types
• Extended Temperature Range: -40°C to +125°C • No Phase Reversal
MCP6H01
SC70-5, SOT 23-5
Applications:
VOUT 1 5 VDD • Automotive Power Electronics V 2 SS • Industrial Control Equipment VIN+ 3 4 VIN– • Battery Powered Systems
MCP6H01 MCP6H02
• Medical Diagnostic Instruments SOIC SOIC
Design Aids:
NC 1 8 NC V 1 8 V OUTA DD V 2 7 VDD V 2 7 V IN– INA– OUTB • SPICE Macro Models V 3 6 V V IN+ OUT INA+ 3 6 VINB– • FilterLab® Software V 4 5 NC V V SS SS 4 5 INB+ • MAPS (Microchip Advanced Part Selector) • Analog Demonstration and Evaluation Boards
MCP6H01 MCP6H02
• Application Notes 2x3 TDFN 2x3 TDFN NC 1 8 NC V 1 8 OUTA V
Typical Application
DD VIN– 2 EP 7 VDD VINA– 2 EP 7 VOUTB 9 V 9 V R IN+ 3 6 VOUT INA+ 3 6 VINB– 1 R2 V V V 4 5 NC V 4 5 V 1 REF SS SS INB+ VDD
MCP6H04
V SOIC, TSSOP OUT
MCP6H01
V 1 14 V OUTA OUTD V 2 13 V INA– IND– VINA+ 3 12 VIND+ V V 4 11 V 2 DD SS V R R INB+ 5 10 VINC+ 1 2 VINB– 6 9 VINC–
Difference Amplifier
VOUTB 7 8 VOUTC * Includes Exposed Thermal Pad (EP); see Table 3-1.  2010-2011 Microchip Technology Inc. DS22243D-page 1 Document Outline 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-5: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-6: Input Offset Voltage vs. Output Voltage. FIGURE 2-7: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-10: CMRR, PSRR vs. Frequency. FIGURE 2-11: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-12: Input Bias, Offset Currents vs. Ambient Temperature. FIGURE 2-13: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-14: Quiescent Current vs. Ambient Temperature. FIGURE 2-15: Quiescent Current vs. Power Supply Voltage. FIGURE 2-16: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-17: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-18: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-19: Channel-to-Channel Separation vs. Frequency (MCP6H02 only). FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-22: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-23: Output Voltage Swing vs. Frequency. FIGURE 2-24: Output Voltage Headroom vs. Output Current. FIGURE 2-25: Output Voltage Headroom vs. Output Current. FIGURE 2-26: Output Voltage Headroom vs. Output Current. FIGURE 2-27: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-28: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-29: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-30: Slew Rate vs. Ambient Temperature. FIGURE 2-31: Slew Rate vs. Ambient Temperature. FIGURE 2-32: Small Signal Non-Inverting Pulse Response. FIGURE 2-33: Small Signal Inverting Pulse Response. FIGURE 2-34: Large Signal Non-Inverting Pulse Response. FIGURE 2-35: Large Signal Inverting Pulse Response. FIGURE 2-36: The MCP6H01/2/4 Shows No Phase Reversal. FIGURE 2-37: Closed Loop Output Impedance vs. Frequency. FIGURE 2-38: Measured Input Current vs. Input Voltage (below VSS). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 3.4 Exposed Thermal Pad (EP) 4.0 Application Information 4.1 Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.7 Application Circuits FIGURE 4-8: High Side Current Sensing Using Difference Amplifier. FIGURE 4-9: Two Op Amp Instrumentation Amplifier. FIGURE 4-10: Photodetector Amplifier. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab Software 5.3 MAPS (Microchip Advanced Part Selector) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Corporate Office Atlanta Boston Chicago Cleveland Fax: 216-447-0643 Dallas Detroit Indianapolis Toronto Fax: 852-2401-3431 Australia - Sydney China - Beijing China - Shanghai India - Bangalore Korea - Daegu Korea - Seoul Singapore Taiwan - Taipei Fax: 43-7242-2244-393 Denmark - Copenhagen France - Paris Germany - Munich Italy - Milan Spain - Madrid UK - Wokingham Worldwide Sales and Service