Datasheet OP07D (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | Ultralow Offset Voltage Operational Amplifier |
| Pages / Page | 17 / 6 — OP07D. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter. Rating. THERMAL … |
| Revision | A |
| File Format / Size | PDF / 242 Kb |
| Document Language | English |
OP07D. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter. Rating. THERMAL RESISTANCE. Table 4. Package Type. Unit. ESD CAUTION
Text Version of Document
OP07D ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress Supply Voltage ±18 V rating only; functional operation of the device at these or any Input Voltage ±V supply other conditions above those indicated in the operational Differential Input Voltage ±0.7 V section of this specification is not implied. Exposure to absolute Output Short-Circuit Duration to GND Indefinite maximum rating conditions for extended periods may affect Storage Temperature Range −65°C to +150°C device reliability. Operating Temperature Range −40°C to +125°C Junction Temperature Range −65°C to +150°C
THERMAL RESISTANCE
Lead Temperature (Soldering, 10 sec) +300°C θJA is specified for worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.
Table 4. Package Type θ θ Unit JA JC
8-Lead DIP (N-8) 103 43 °C/W 8-Lead SOIC (R-8) 158 43 °C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. A | Page 5 of 16 Document Outline Features Applications General Description Pin Configurations Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Typical Performance Characteristics Outline Dimensions Ordering Guide
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress Supply Voltage ±18 V rating only; functional operation of the device at these or any Input Voltage ±V supply other conditions above those indicated in the operational Differential Input Voltage ±0.7 V section of this specification is not implied. Exposure to absolute Output Short-Circuit Duration to GND Indefinite maximum rating conditions for extended periods may affect Storage Temperature Range −65°C to +150°C device reliability. Operating Temperature Range −40°C to +125°C Junction Temperature Range −65°C to +150°C
THERMAL RESISTANCE
Lead Temperature (Soldering, 10 sec) +300°C θJA is specified for worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.
Table 4. Package Type θ θ Unit JA JC
8-Lead DIP (N-8) 103 43 °C/W 8-Lead SOIC (R-8) 158 43 °C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. A | Page 5 of 16 Document Outline Features Applications General Description Pin Configurations Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Typical Performance Characteristics Outline Dimensions Ordering Guide
