Datasheet AD7192 (Analog Devices) - 10
| Manufacturer | Analog Devices |
| Description | 4.8 kHz Ultra-Low Noise 24-Bit Sigma-Delta ADC with PGA |
| Pages / Page | 41 / 10 — AD7192. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 3. Parameter. … |
| Revision | A |
| File Format / Size | PDF / 566 Kb |
| Document Language | English |
AD7192. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 3. Parameter. Rating. Table 4. Thermal Resistance. Package Type. θJA
Model Line for this Datasheet
Text Version of Document
AD7192 ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE Table 3. Parameter Rating
θJA is specified for the worst-case conditions, that is, a device AV soldered in a circuit board for surface-mount packages. DD to AGND −0.3 V to +6.5 V DVDD to AGND −0.3 V to +6.5 V
Table 4. Thermal Resistance
AGND to DGND −0.3 V to +0.3 V
Package Type θJA θJC Unit
Analog Input Voltage to AGND −0.3 V to AVDD + 0.3 V 24-Lead TSSOP 128 42 °C/W Reference Input Voltage to AGND −0.3 V to AVDD + 0.3 V Digital Input Voltage to DGND −0.3 V to DVDD + 0.3 V
ESD CAUTION
Digital Output Voltage to DGND −0.3 V to DVDD + 0.3 V AIN/Digital Input Current 10 mA Operating Temperature Range −40°C to +105°C Storage Temperature Range −65°C to +150°C Maximum Junction Temperature 150°C Lead Temperature, Soldering Reflow 260°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 9 of 40 Document Outline FEATURES INTERFACE APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING CHARACTERISTICS CIRCUIT AND TIMING DIAGRAMS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS RMS NOISE AND RESOLUTION SINC4 CHOP DISABLED SINC3 CHOP DISABLED SINC4 CHOP ENABLED SINC3 CHOP ENABLED ON-CHIP REGISTERS COMMUNICATIONS REGISTER STATUS REGISTER MODE REGISTER CONFIGURATION REGISTER DATA REGISTER ID REGISTER GPOCON REGISTER OFFSET REGISTER FULL-SCALE REGISTER ADC CIRCUIT INFORMATION OVERVIEW FILTER, OUTPUT DATA RATE, AND SETTLING TIME Chop Disabled Chop Enabled 50 Hz/60Hz Rejection Zero Latency Channel Sequencer Single Conversion Mode Continuous Conversion Mode Continuous Read CIRCUIT DESCRIPTION ANALOG INPUT CHANNEL PROGRAMMABLE GAIN ARRAY (PGA) BIPOLAR/UNIPOLAR CONFIGURATION DATA OUTPUT CODING CLOCK BURNOUT CURRENTS REFERENCE REFERENCE DETECT RESET SYSTEM SYNCHRONIZATION TEMPERATURE SENSOR BRIDGE POWER-DOWN SWITCH LOGIC OUTPUTS ENABLE PARITY CALIBRATION GROUNDING AND LAYOUT APPLICATIONS INFORMATION WEIGH SCALES OUTLINE DIMENSIONS ORDERING GUIDE
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE Table 3. Parameter Rating
θJA is specified for the worst-case conditions, that is, a device AV soldered in a circuit board for surface-mount packages. DD to AGND −0.3 V to +6.5 V DVDD to AGND −0.3 V to +6.5 V
Table 4. Thermal Resistance
AGND to DGND −0.3 V to +0.3 V
Package Type θJA θJC Unit
Analog Input Voltage to AGND −0.3 V to AVDD + 0.3 V 24-Lead TSSOP 128 42 °C/W Reference Input Voltage to AGND −0.3 V to AVDD + 0.3 V Digital Input Voltage to DGND −0.3 V to DVDD + 0.3 V
ESD CAUTION
Digital Output Voltage to DGND −0.3 V to DVDD + 0.3 V AIN/Digital Input Current 10 mA Operating Temperature Range −40°C to +105°C Storage Temperature Range −65°C to +150°C Maximum Junction Temperature 150°C Lead Temperature, Soldering Reflow 260°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 9 of 40 Document Outline FEATURES INTERFACE APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING CHARACTERISTICS CIRCUIT AND TIMING DIAGRAMS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS RMS NOISE AND RESOLUTION SINC4 CHOP DISABLED SINC3 CHOP DISABLED SINC4 CHOP ENABLED SINC3 CHOP ENABLED ON-CHIP REGISTERS COMMUNICATIONS REGISTER STATUS REGISTER MODE REGISTER CONFIGURATION REGISTER DATA REGISTER ID REGISTER GPOCON REGISTER OFFSET REGISTER FULL-SCALE REGISTER ADC CIRCUIT INFORMATION OVERVIEW FILTER, OUTPUT DATA RATE, AND SETTLING TIME Chop Disabled Chop Enabled 50 Hz/60Hz Rejection Zero Latency Channel Sequencer Single Conversion Mode Continuous Conversion Mode Continuous Read CIRCUIT DESCRIPTION ANALOG INPUT CHANNEL PROGRAMMABLE GAIN ARRAY (PGA) BIPOLAR/UNIPOLAR CONFIGURATION DATA OUTPUT CODING CLOCK BURNOUT CURRENTS REFERENCE REFERENCE DETECT RESET SYSTEM SYNCHRONIZATION TEMPERATURE SENSOR BRIDGE POWER-DOWN SWITCH LOGIC OUTPUTS ENABLE PARITY CALIBRATION GROUNDING AND LAYOUT APPLICATIONS INFORMATION WEIGH SCALES OUTLINE DIMENSIONS ORDERING GUIDE
