Datasheet AD7817, AD7818 (Analog Devices) - 7
| Manufacturer | Analog Devices |
| Description | Temperature Sensor (On Chip) 4-Channel, 9 µs, 10-Bit ADC |
| Pages / Page | 20 / 7 — Data Sheet. AD7817/AD7818. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter … |
| Revision | E |
| File Format / Size | PDF / 351 Kb |
| Document Language | English |
Data Sheet. AD7817/AD7818. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter Rating. ESD CAUTION
Model Line for this Datasheet
Text Version of Document
Data Sheet AD7817/AD7818 ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
Table 3.
stress rating only; functional operation of the product at these
Parameter Rating
or any other conditions above those indicated in the operational VDD to AGND −0.3 V to +7 V section of this specification is not implied. Operation beyond VDD to DGND −0.3 V to +7 V the maximum operating conditions for extended periods may Analog Input Voltage to AGND affect product reliability. VIN1 to VIN4 −0.3 V to VDD + 0.3 V Reference Input Voltage to AGND1 −0.3 V to VDD + 0.3V Digital Input Voltage to DGND –0.3 V to VDD + 0.3 V
ESD CAUTION
Digital Output Voltage to DGND –0.3 V to VDD + 0.3 V Storage Temperature Range −65°C to +150°C Junction Temperature 150°C 16-Lead TSSOP, Power Dissipation 450 mW θ JA Thermal Impedance 120°C/W Lead Temperature, Soldering 260°C Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 16-Lead SOIC Package, Power Dissipation 450 mW θJA Thermal Impedance 100°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 8-Lead SOIC Package, Power Dissipation 450 mW θJA Thermal Impedance 157°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 8-Lead MSOP Package, Power Dissipation 450 mW θJA Thermal Impedance 206°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 1 If the reference input voltage is likely to exceed VDD by more than 0.3 V (that is, during power-up) and the reference is capable of supplying 30 mA or more, it is recommended to use a clamping diode between the REFIN pin and VDD pin. Rev. E | Page 7 of 20 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TERMINOLOGY CONTROL BYTE Address Register Overtemperature Register CIRCUIT INFORMATION CONVERTER DETAILS TYPICAL CONNECTION DIAGRAM ANALOG INPUTS Analog Input DC Acquisition Time AC Acquisition Time ON-CHIP REFERENCE ADC TRANSFER FUNCTION TEMPERATURE MEASUREMENT TEMPERATURE MEASUREMENT ERROR DUE TO REFERENCE ERROR SELF-HEATING CONSIDERATIONS OPERATING MODES Mode 1 Mode 2 POWER vs. THROUGHPUT AD7817 SERIAL INTERFACE Read Operation Write Operation Simplifying the Serial Interface AD7818 SERIAL INTERFACE MODE Read Operation Write Operation OUTLINE DIMENSIONS ORDERING GUIDE
TA = 25°C unless otherwise noted. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
Table 3.
stress rating only; functional operation of the product at these
Parameter Rating
or any other conditions above those indicated in the operational VDD to AGND −0.3 V to +7 V section of this specification is not implied. Operation beyond VDD to DGND −0.3 V to +7 V the maximum operating conditions for extended periods may Analog Input Voltage to AGND affect product reliability. VIN1 to VIN4 −0.3 V to VDD + 0.3 V Reference Input Voltage to AGND1 −0.3 V to VDD + 0.3V Digital Input Voltage to DGND –0.3 V to VDD + 0.3 V
ESD CAUTION
Digital Output Voltage to DGND –0.3 V to VDD + 0.3 V Storage Temperature Range −65°C to +150°C Junction Temperature 150°C 16-Lead TSSOP, Power Dissipation 450 mW θ JA Thermal Impedance 120°C/W Lead Temperature, Soldering 260°C Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 16-Lead SOIC Package, Power Dissipation 450 mW θJA Thermal Impedance 100°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 8-Lead SOIC Package, Power Dissipation 450 mW θJA Thermal Impedance 157°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 8-Lead MSOP Package, Power Dissipation 450 mW θJA Thermal Impedance 206°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 1 If the reference input voltage is likely to exceed VDD by more than 0.3 V (that is, during power-up) and the reference is capable of supplying 30 mA or more, it is recommended to use a clamping diode between the REFIN pin and VDD pin. Rev. E | Page 7 of 20 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TERMINOLOGY CONTROL BYTE Address Register Overtemperature Register CIRCUIT INFORMATION CONVERTER DETAILS TYPICAL CONNECTION DIAGRAM ANALOG INPUTS Analog Input DC Acquisition Time AC Acquisition Time ON-CHIP REFERENCE ADC TRANSFER FUNCTION TEMPERATURE MEASUREMENT TEMPERATURE MEASUREMENT ERROR DUE TO REFERENCE ERROR SELF-HEATING CONSIDERATIONS OPERATING MODES Mode 1 Mode 2 POWER vs. THROUGHPUT AD7817 SERIAL INTERFACE Read Operation Write Operation Simplifying the Serial Interface AD7818 SERIAL INTERFACE MODE Read Operation Write Operation OUTLINE DIMENSIONS ORDERING GUIDE
