Datasheet AD558 (Analog Devices) - 10
| Manufacturer | Analog Devices |
| Description | DACPORT Low Cost, Complete µP-Compatible 8-Bit DAC |
| Pages / Page | 10 / 10 — Data Sheet. AD558. ORDERING GUIDE. Relative Accuracy Error Max. Full … |
| Revision | B |
| File Format / Size | PDF / 1.1 Mb |
| Document Language | English |
Data Sheet. AD558. ORDERING GUIDE. Relative Accuracy Error Max. Full Scale Error Max. Model. Temperature. Range. TMIN to TMAX
Model Line for this Datasheet
Text Version of Document
Data Sheet AD558 ORDERING GUIDE Relative Accuracy Error Max Full Scale Error Max Model Temperature Range TMIN to TMAX TMIN to TMAX Package Option
AD558JN 0°C to +70°C ±1/2 LSB ±2.5 LSB PDIP (N-16) AD558JNZ 0°C to +70°C ±1/2 LSB ±2.5 LSB PDIP (N-16) AD558JP 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20) AD558JP-REEL7 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20) AD558JPZ 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20) AD558JPZ-REEL 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20) AD558JPZ-REEL7 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20) AD558JD 0°C to +70°C ±1/2 LSB ±2.5 LSB SBDIP (D-16) AD558KN 0°C to +70°C ±1/4 LSB ±1 LSB PDIP (N-16) AD558KNZ 0°C to +70°C ±1/4 LSB ±1 LSB PDIP (N-16) AD558KP 0°C to +70°C ±1/4 LSB ±1 LSB PLCC (P-20) AD558KPZ 0°C to +70°C ±1/4 LSB ±1 LSB PLCC (P-20) AD558KPZ-REEL7 0°C to +70°C ±1/4 LSB ±1 LSB PLCC (P-20) AD558KD 0°C to +70°C ±1/4 LSB ±1 LSB SBDIP (D-16) AD558SD –55°C to +125°C ±3/4 LSB ±2.5 LSB SBDIP (D-16) AD558TD –55°C to +125°C ±3/8 LSB ±1 LSB SBDIP (D-16) AD558TCHIPS –55°C to +125°C ±3/8 LSB ±1 LSB Die part AD558SD/883B –55°C to +125°C ±3/4 LSB ±2.5 LSB SBDIP (D-16) AD558SE/883B –55°C to +125°C ±3/4 LSB ±2.5 LSB LCC (E-20-1) AD558TD/883B –55°C to +125°C ±3/8 LSB ±1 LSB SBDIP (D-16) AD558TE/883B –55°C to +125°C ±3/8 LSB ±1 LSB LCC (E-20-1) 1 For details on grade and package offerings screened in accordance with MIL-STD-883, refer to the Analog Devices Military Products Databook or current AD558/883B data sheet. 2S = Ceramic SBDIP; N = Plastic PDIP; P = Plastic Leaded Chip Carrier.
REVISION HISTORY 6/2017—Rev. A to Rev. B
Added Bond Pad Coordinates Table ... 3 Updated Outline Dimensions .. 8 Changes to Ordering Guide ... 9
©1987–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09374-0-6/17(B)
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AD558JN 0°C to +70°C ±1/2 LSB ±2.5 LSB PDIP (N-16) AD558JNZ 0°C to +70°C ±1/2 LSB ±2.5 LSB PDIP (N-16) AD558JP 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20) AD558JP-REEL7 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20) AD558JPZ 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20) AD558JPZ-REEL 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20) AD558JPZ-REEL7 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20) AD558JD 0°C to +70°C ±1/2 LSB ±2.5 LSB SBDIP (D-16) AD558KN 0°C to +70°C ±1/4 LSB ±1 LSB PDIP (N-16) AD558KNZ 0°C to +70°C ±1/4 LSB ±1 LSB PDIP (N-16) AD558KP 0°C to +70°C ±1/4 LSB ±1 LSB PLCC (P-20) AD558KPZ 0°C to +70°C ±1/4 LSB ±1 LSB PLCC (P-20) AD558KPZ-REEL7 0°C to +70°C ±1/4 LSB ±1 LSB PLCC (P-20) AD558KD 0°C to +70°C ±1/4 LSB ±1 LSB SBDIP (D-16) AD558SD –55°C to +125°C ±3/4 LSB ±2.5 LSB SBDIP (D-16) AD558TD –55°C to +125°C ±3/8 LSB ±1 LSB SBDIP (D-16) AD558TCHIPS –55°C to +125°C ±3/8 LSB ±1 LSB Die part AD558SD/883B –55°C to +125°C ±3/4 LSB ±2.5 LSB SBDIP (D-16) AD558SE/883B –55°C to +125°C ±3/4 LSB ±2.5 LSB LCC (E-20-1) AD558TD/883B –55°C to +125°C ±3/8 LSB ±1 LSB SBDIP (D-16) AD558TE/883B –55°C to +125°C ±3/8 LSB ±1 LSB LCC (E-20-1) 1 For details on grade and package offerings screened in accordance with MIL-STD-883, refer to the Analog Devices Military Products Databook or current AD558/883B data sheet. 2S = Ceramic SBDIP; N = Plastic PDIP; P = Plastic Leaded Chip Carrier.
REVISION HISTORY 6/2017—Rev. A to Rev. B
Added Bond Pad Coordinates Table ... 3 Updated Outline Dimensions .. 8 Changes to Ordering Guide ... 9
©1987–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09374-0-6/17(B)
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