Datasheet ADA4930-1-EP (Analog Devices) - 8
| Manufacturer | Analog Devices |
| Description | Ultralow Noise Drivers for Low Voltage ADCs |
| Pages / Page | 12 / 8 — ADA4930-1-EP. Enhanced Product. PIN CONFIGURATION AND FUNCTION … |
| Revision | A |
| File Format / Size | PDF / 202 Kb |
| Document Language | English |
ADA4930-1-EP. Enhanced Product. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. –FB 1. 12 PD. +IN 2. 11 +OUT. TOP VIEW. (Not to Scale)
Model Line for this Datasheet
Text Version of Document
ADA4930-1-EP Enhanced Product PIN CONFIGURATION AND FUNCTION DESCRIPTIONS S S S S –V –V –V –V 16 15 14 13 –FB 1 12 PD +IN 2 11 +OUT ADA4930-1-EP TOP VIEW (Not to Scale) –IN 3 10 –OUT +FB 4 9 VOCM 5 6 7 8 S S S S +V +V +V +V NOTES 1. EXPOSED PADDLE. THE EXPOSED PAD IS NOT ELECTRICALLY CONNECTED TO THE DEVICE. IT IS
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TYPICALLY SOLDERED TO GROUND OR A POWER PLANE ON THE PCB THAT IS THERMALLY CONDUCTIVE.
10371- Figure 4. Pin Configuration
Table 8. Pin Function Descriptions Pin No. Mnemonic Description
1 −FB Negative Output for Feedback Component Connection. 2 +IN Positive Input Summing Node. 3 −IN Negative Input Summing Node. 4 +FB Positive Output for Feedback Component Connection. 5 to 8 +VS Positive Supply Voltage. 9 VOCM Output Common-Mode Voltage. 10 +OUT Positive Output for Load Connection. 11 −OUT Negative Output for Load Connection. 12 PD Power-Down Pin. 13 to 16 −VS Negative Supply Voltage. EPAD Exposed Paddle. The exposed pad is not electrical y connected to the device. It is typically soldered to ground or a power plane on the PCB that is thermal y conductive. Rev. A | Page 8 of 12 Document Outline Features Enhanced Product Features Applications General Description Functional Block Diagrams Revision History Specifications 3.3 V Operation 3.3 V VOCM to VO, cm Performance 3.3 V General Performance 5 V Operation 5 V VOCM to VO, cm Performance 5 V General Performance Absolute Maximum Ratings Thermal Resistance Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Outline Dimensions Ordering Guide
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TYPICALLY SOLDERED TO GROUND OR A POWER PLANE ON THE PCB THAT IS THERMALLY CONDUCTIVE.
10371- Figure 4. Pin Configuration
Table 8. Pin Function Descriptions Pin No. Mnemonic Description
1 −FB Negative Output for Feedback Component Connection. 2 +IN Positive Input Summing Node. 3 −IN Negative Input Summing Node. 4 +FB Positive Output for Feedback Component Connection. 5 to 8 +VS Positive Supply Voltage. 9 VOCM Output Common-Mode Voltage. 10 +OUT Positive Output for Load Connection. 11 −OUT Negative Output for Load Connection. 12 PD Power-Down Pin. 13 to 16 −VS Negative Supply Voltage. EPAD Exposed Paddle. The exposed pad is not electrical y connected to the device. It is typically soldered to ground or a power plane on the PCB that is thermal y conductive. Rev. A | Page 8 of 12 Document Outline Features Enhanced Product Features Applications General Description Functional Block Diagrams Revision History Specifications 3.3 V Operation 3.3 V VOCM to VO, cm Performance 3.3 V General Performance 5 V Operation 5 V VOCM to VO, cm Performance 5 V General Performance Absolute Maximum Ratings Thermal Resistance Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Outline Dimensions Ordering Guide
