Datasheet MCP6021, MCP601R, MCP602, MCP603, MCP604 (Microchip)

ManufacturerMicrochip
DescriptionThe MCP6021 operational amplifier (op amp) has a gain bandwidth product of 10 MHz with a low typical operating current of 1.0 mA and an offset voltage that is less than 0.5 mV
Pages / Page54 / 1 — MCP6021/1R/2/3/4. Rail-to-Rail Input/Output, 10 MHz Op Amps. Features. …
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MCP6021/1R/2/3/4. Rail-to-Rail Input/Output, 10 MHz Op Amps. Features. Description. Applications. Package Types. MCP6021. MCP6022

Datasheet MCP6021, MCP601R, MCP602, MCP603, MCP604 Microchip

Model Line for this Datasheet

Text Version of Document

MCP6021/1R/2/3/4 Rail-to-Rail Input/Output, 10 MHz Op Amps Features Description
• Rail-to-Rail Input/Output The MCP6021, MCP6021R, MCP6022, MCP6023 and • Wide Bandwidth: 10 MHz (typical) MCP6024 from Microchip Technology Inc. are rail-to- • Low Noise: 8.7 nV/Hz at 10 kHz (typical) rail input and output operational amplifiers with high performance. Key specifications include: wide band- • Low Offset Voltage: width (10 MHz), low noise (8.7 nV/Hz), low input offset - Industrial Temperature: ±500 µV (max.) voltage and low distortion (0.00053% THD+N). The - Extended Temperature: ±250 µV (max.) MCP6023 also offers a Chip Select pin (CS) that gives • Mid-Supply VREF: MCP6021 and MCP6023 power savings when the part is not in use. • Low Supply Current: 1 mA (typical) The single MCP6021 and MCP6021R are available in • Total Harmonic Distortion: SOT-23-5 packages. The single MCP6021, single - 0.00053% (typical, G = 1 V/V) MCP6023 and dual MCP6022 are available in 8-lead PDIP, SOIC and TSSOP packages. The Extended • Unity Gain Stable Temperature single MCP6021 is available in 8-lead • Power Supply Range: 2.5V to 5.5V MSOP. The quad MCP6024 is offered in 14-lead PDIP, • Temperature Range: SOIC and TSSOP packages. - Industrial: -40°C to +85°C The MCP6021/1R/2/3/4 family is available in Industrial - Extended: -40°C to +125°C and Extended temperature ranges. It has a power supply range of 2.5V to 5.5V.
Applications
• Automotive
Package Types
• Multi-Pole Active Filters
MCP6021 MCP6022
• Audio Processing SOT-23-5 PDIP, SOIC, TSSOP • DAC Buffer VOUT 1 5 VDD VOUTA 1 8 VDD • Test Equipment VSS 2 VINA- 2 7 VOUTB • Medical Instrumentation VIN+ 3 4 VIN- VINA+ 3 6 VINB- VSS 4 5 VINB+
Design Aids MCP6021R
SOT-23-5 • SPICE Macro Models
MCP6023
PDIP, SOIC, TSSOP • FilterLab® Software VOUT 1 5 VSS • MPLAB® Mindi™ Analog Simulator VDD 2 NC 1 8 CS • Microchip Advanced Part Selector (MAPS) V V V IN+ 3 4 IN- IN- 2 7 VDD • Analog Demonstration and Evaluation Boards VIN+ 3 6 VOUT • Application Notes
MCP6021
VSS 4 5 VREF PDIP, SOIC, MSOP, TSSOP
MCP6024 Typical Application
PDIP, SOIC, TSSOP NC 1 8 NC 5.6 pF Photo V V V OUTA 1 14 VOUTD Detector IN- 2 7 DD 100 k V V V INA- 2 13 VIND- IN+ 3 6 OUT V V V INA+ 3 12 VIND+ SS 4 5 REF 100 pF VDD 4 11 VSS
MCP6021
VINB+ 5 10 VINC+ VDD/2 VINB- 6 9 VINC-
Transimpedance Amplifier
VOUTB 7 8 VOUTC  2001-2017 Microchip Technology Inc. DS20001685E-page 1 Document Outline Features Applications Design Aids Typical Application Description Package Types 1.0 Electrical Characteristics Absolute Maximum Ratings† DC Electrical Characteristics AC Electrical Characteristics MCP6023 Chip Select (CS) Electrical Characteristics Temperature Characteristics FIGURE 1-1: Timing Diagram for the CS Pin on the MCP6023. 1.1 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage (Industrial Temperature Parts). FIGURE 2-2: Input Offset Voltage (Extended Temperature Parts). FIGURE 2-3: Input Offset Voltage vs. Common-Mode Input Voltage with VDD = 2.5V. FIGURE 2-4: Input Offset Voltage Drift (Industrial Temperature Parts). FIGURE 2-5: Input Offset Voltage Drift (Extended Temperature Parts). FIGURE 2-6: Input Offset Voltage vs. Common-Mode Input Voltage with VDD = 5.5V. FIGURE 2-7: Input Offset Voltage vs. Temperature. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: Input Offset Voltage vs. Output Voltage. FIGURE 2-11: Input Noise Voltage Density vs. Common-Mode Input Voltage. FIGURE 2-12: CMRR, PSRR vs. Temperature. FIGURE 2-13: Input Bias, Offset Currents vs. Common-Mode Input Voltage. FIGURE 2-14: Quiescent Current vs. Supply Voltage. FIGURE 2-15: Output Short-Circuit Current vs. Supply Voltage. FIGURE 2-16: Input Bias, Offset Currents vs. Temperature. FIGURE 2-17: Quiescent Current vs. Temperature. FIGURE 2-18: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-19: DC Open-Loop Gain vs. Load Resistance. FIGURE 2-20: Small Signal DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Temperature. FIGURE 2-22: DC Open-Loop Gain vs. Temperature. FIGURE 2-23: Gain Bandwidth Product, Phase Margin vs. Common-Mode Input Voltage. FIGURE 2-24: Gain Bandwidth Product, Phase Margin vs. Output Voltage. FIGURE 2-25: Slew Rate vs. Temperature. FIGURE 2-26: Total Harmonic Distortion plus Noise vs. Output Voltage with f = 1 kHz. FIGURE 2-27: The MCP6021/1R/2/3/4 Family Shows No Phase Reversal Under Overdrive. FIGURE 2-28: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-29: Total Harmonic Distortion plus Noise vs. Output Voltage with f = 20 kHz. FIGURE 2-30: Channel-to-Channel Separation vs. Frequency (MCP6022 and MCP6024 only). FIGURE 2-31: Output Voltage Headroom vs. Output Current. FIGURE 2-32: Small Signal Non-Inverting Pulse Response. FIGURE 2-33: Large Signal Non-Inverting Pulse Response. FIGURE 2-34: Output Voltage Headroom vs. Temperature. FIGURE 2-35: Small Signal Inverting Pulse Response. FIGURE 2-36: Large Signal Inverting Pulse Response. FIGURE 2-37: VREF Accuracy vs. Supply Voltage (MCP6021 and MCP6023 only). FIGURE 2-38: Chip Select (CS) Hysteresis (MCP6023 only) with VDD = 2.5V. FIGURE 2-39: Chip Select (CS) to Amplifier Output Response Time (MCP6023 Only). FIGURE 2-40: VREF Accuracy vs. Temperature (MCP6021 and MCP6023 only). FIGURE 2-41: Chip Select (CS) Hysteresis (MCP6023 only) with VDD = 5.5V. FIGURE 2-42: Measured Input Current vs. Input Voltage (Below VSS) 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Reference Voltage (VREF) MCP6021 and MCP6023 3.4 Chip Select Digital Input (CS) 3.5 Power Supply (VSS and VDD) 4.0 Applications Information 4.1 Rail-to-Rail Input 4.1.1 Phase Reversal 4.1.2 Input Voltage Limits FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. 4.1.3 Input Current Limits FIGURE 4-3: Protecting the Analog Inputs. 4.1.4 Normal Operation 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO, Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Gain Peaking FIGURE 4-6: Non-Inverting Gain Circuit with Parasitic Capacitance. FIGURE 4-7: Non-Inverting Gain Circuit with Parasitic Capacitance. 4.5 MCP6023 Chip Select (CS) 4.6 MCP6021 and MCP6023 Reference Voltage FIGURE 4-8: Simplified Internal VREF Circuit (MCP6021 and MCP6023 only). FIGURE 4-9: Non-Inverting Gain Circuit Using VREF (MCP6021 and MCP6023 only). FIGURE 4-10: Inverting Gain Circuit Using VREF (MCP6021 and MCP6023 only). 4.7 Supply Bypass 4.8 Unused Operational Amplifiers FIGURE 4-11: Unused Operational Amplifiers. 4.9 PCB Surface Leakage FIGURE 4-12: Example Guard Ring Layout. 4.10 High-Speed PCB Layout 4.11 Typical Applications 4.11.1 A/D Converter Driver and Anti-Aliasing Filter FIGURE 4-13: A/D Converter Driver and Anti-Aliasing Filter with a 20 kHz Cutoff Frequency. 4.11.2 Optical Detector Amplifier FIGURE 4-14: Transimpedance Amplifier for an Optical Detector. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 MPLAB® Mindi™ Analog Simulator 5.4 Microchip Advanced Part Selector (MAPS) 5.5 Analog Demonstration and Evaluation Boards 5.6 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Package Marking Information (Continued) Package Marking Information (Continued) APPENDIX A: Revision History Revision E (January 2017) Revision D (February 2009) Revision C (December 2005) Revision B (November 2003) Revision A (November 2001) Product Identification System Worldwide Sales and Service