Datasheet MCP606, MCP607, MCP608 (Microchip) - 10
| Manufacturer | Microchip |
| Description | The MCP606 operational amplifier (op amp) has a gain bandwidth product of 155 kHz with a low typical operating current of 18.7 µA and an offset voltage that is less than 250 µV |
| Pages / Page | 42 / 10 — MCP606/7/8/9. Note:. 1000. VDD = 2.5V. L = 5 kΩ. 100. DD - VOH. DD = … |
| File Format / Size | PDF / 707 Kb |
| Document Language | English |
MCP606/7/8/9. Note:. 1000. VDD = 2.5V. L = 5 kΩ. 100. DD - VOH. DD = 5.5V. VDD = 5.5V. V) 20. ag lt. (m 15. VOL - VSS. t Vo. DD = 2.5V
Model Line for this Datasheet
Text Version of Document
MCP606/7/8/9 Note:
Unless otherwise indicated, V ≈ DD = +2.5V to +5.5V, VSS = GND, TA = +25°C, VCM = VDD/2, VOUT VDD/2, VL = VDD/2, RL = 100 kΩ to VL, CL = 60 pF, and CS is tied low.
1000 40 VDD = 2.5V m R o 35 L = 5 kΩ ro 30 ad V 100 V DD - VOH DD = 5.5V V e DD - VOH H 25 ) VDD = 5.5V V e V) 20 (m ag lt (m 15 10 VOL - VSS t Vo V u 10 DD = 2.5V put Voltage Headroom tp V u 5 OL - VSS Out O 1 0 0.1 1 10 100 -50 -25 0 25 50 75 100 Output Current (mA) Ambient Temperature (°C) FIGURE 2-19:
Output Voltage Headroom
FIGURE 2-22:
Output Voltage Headroom vs. Output Current Magnitude. vs. Ambient Temperature at RL = 5 kΩ.
10 6 e G = +2 V/V ag 5 VDD = 5.0V lt VDD = 5.5V o V ) 4 ltages (V) V VDD = 2.5V o V 1 3 ing ( w S 2 V 1 IN aximum Output M 0 VOUT 0.1 Input and Output 1.E+02 100 1.E+0 1k 3 1.E+04 10k 1.E 10+0 0k 5 -1 Frequency (Hz) Time (100 µs/div) FIGURE 2-20:
Maximum Output Voltage
FIGURE 2-23:
The MCP606/7/8/9 Show Swing vs. Frequency. No Phase Reversal.
0.12 25 +ISC , VDD = 5.5V 0.10 20 | -ISC |, VDD = 5.5V s) Low to High /µ 0.08 (V 15 0.06 ate High to Low 10 0.04 lew R S Magnitude (mA) 0.02 5 +ISC , VDD = 2.5V tput Short Circuit Current | -ISC |, VDD = 2.5V 0.00 Ou 0 -50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100 Ambient Temperature (°C) Ambient Temperature (°C) FIGURE 2-21:
Slew Rate vs. Ambient
FIGURE 2-24:
Output Short Circuit Current Temperature. Magnitude vs. Ambient Temperature. DS11177F-page 10 © 2009 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics FIGURE 1-1: Timing Diagram for the CS Pin on the MCP608. 1.1 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage at VDD = 5.5V. FIGURE 2-2: Input Offset Voltage at VDD = 2.5V. FIGURE 2-3: Quiescent Current vs. Power Supply Voltage. FIGURE 2-4: Input Offset Voltage Drift Magnitude at VDD = 5.5V. FIGURE 2-5: Input Offset Voltage Drift Magnitude at VDD = 2.5V. FIGURE 2-6: Quiescent Current vs. Ambient Temperature. FIGURE 2-7: Input Offset Voltage vs. Ambient Temperature. FIGURE 2-8: Open-Loop Gain and Phase vs. Frequency. FIGURE 2-9: Channel-to-Channel Separation (MCP607 and MCP609 only). FIGURE 2-10: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-11: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-12: Input Noise Voltage Density vs. Frequency. FIGURE 2-13: Input Bias Current, Input Offset Current vs. Ambient Temperature. FIGURE 2-14: DC Open-Loop Gain vs. Load Resistance. FIGURE 2-15: CMRR, PSRR vs. Frequency. FIGURE 2-16: Input Bias Current, Input Offset Current vs. Common Mode Input Voltage. FIGURE 2-17: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-18: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-19: Output Voltage Headroom vs. Output Current Magnitude. FIGURE 2-20: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-21: Slew Rate vs. Ambient Temperature. FIGURE 2-22: Output Voltage Headroom vs. Ambient Temperature at RL = 5 kW. FIGURE 2-23: The MCP606/7/8/9 Show No Phase Reversal. FIGURE 2-24: Output Short Circuit Current Magnitude vs. Ambient Temperature. FIGURE 2-25: Large-signal, Non-inverting Pulse Response. FIGURE 2-26: Small-signal, Non-inverting Pulse Response. FIGURE 2-27: Chip Select (CS) Hysteresis (MCP608 only). FIGURE 2-28: Large-signal, Inverting Pulse Response. FIGURE 2-29: Small-signal, Inverting Pulse Response. FIGURE 2-30: Amplifier Output Response Times vs. Chip Select (CS) Pulse (MCP608 only). FIGURE 2-31: Measured Input Current vs. Input Voltage (below VSS). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Chip Select Digital Input 3.4 Power Supply Pins 4.0 Applications Information 4.1 Rail-to-Rail Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Unity Gain Buffer has a Limited VOUT Range. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO stabilizes large capacitive loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 MCP608 Chip Select 4.5 Supply Bypass 4.6 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.7 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.8 Application Circuits FIGURE 4-8: Low Side Battery Current Sensor. FIGURE 4-9: Photodiode (in Photo-voltaic mode) and Transimpedance Amplifier. FIGURE 4-10: Photodiode (in Photo- conductive mode) and Transimpedance Amplifier. FIGURE 4-11: Two Op Amp Instrumentation Amplifier. FIGURE 4-12: Three Op Amp Instrumentation Amplifier. FIGURE 4-13: Precision Gain with Good Load Isolation. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Mindi™ Circuit Designer & Simulator 5.4 Microchip Advanced Part Selector (MAPS) 5.5 Analog Demonstration and Evaluation Boards 5.6 Application Notes 6.0 Packaging Information 6.1 Package Marking Information
Unless otherwise indicated, V ≈ DD = +2.5V to +5.5V, VSS = GND, TA = +25°C, VCM = VDD/2, VOUT VDD/2, VL = VDD/2, RL = 100 kΩ to VL, CL = 60 pF, and CS is tied low.
1000 40 VDD = 2.5V m R o 35 L = 5 kΩ ro 30 ad V 100 V DD - VOH DD = 5.5V V e DD - VOH H 25 ) VDD = 5.5V V e V) 20 (m ag lt (m 15 10 VOL - VSS t Vo V u 10 DD = 2.5V put Voltage Headroom tp V u 5 OL - VSS Out O 1 0 0.1 1 10 100 -50 -25 0 25 50 75 100 Output Current (mA) Ambient Temperature (°C) FIGURE 2-19:
Output Voltage Headroom
FIGURE 2-22:
Output Voltage Headroom vs. Output Current Magnitude. vs. Ambient Temperature at RL = 5 kΩ.
10 6 e G = +2 V/V ag 5 VDD = 5.0V lt VDD = 5.5V o V ) 4 ltages (V) V VDD = 2.5V o V 1 3 ing ( w S 2 V 1 IN aximum Output M 0 VOUT 0.1 Input and Output 1.E+02 100 1.E+0 1k 3 1.E+04 10k 1.E 10+0 0k 5 -1 Frequency (Hz) Time (100 µs/div) FIGURE 2-20:
Maximum Output Voltage
FIGURE 2-23:
The MCP606/7/8/9 Show Swing vs. Frequency. No Phase Reversal.
0.12 25 +ISC , VDD = 5.5V 0.10 20 | -ISC |, VDD = 5.5V s) Low to High /µ 0.08 (V 15 0.06 ate High to Low 10 0.04 lew R S Magnitude (mA) 0.02 5 +ISC , VDD = 2.5V tput Short Circuit Current | -ISC |, VDD = 2.5V 0.00 Ou 0 -50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100 Ambient Temperature (°C) Ambient Temperature (°C) FIGURE 2-21:
Slew Rate vs. Ambient
FIGURE 2-24:
Output Short Circuit Current Temperature. Magnitude vs. Ambient Temperature. DS11177F-page 10 © 2009 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics FIGURE 1-1: Timing Diagram for the CS Pin on the MCP608. 1.1 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage at VDD = 5.5V. FIGURE 2-2: Input Offset Voltage at VDD = 2.5V. FIGURE 2-3: Quiescent Current vs. Power Supply Voltage. FIGURE 2-4: Input Offset Voltage Drift Magnitude at VDD = 5.5V. FIGURE 2-5: Input Offset Voltage Drift Magnitude at VDD = 2.5V. FIGURE 2-6: Quiescent Current vs. Ambient Temperature. FIGURE 2-7: Input Offset Voltage vs. Ambient Temperature. FIGURE 2-8: Open-Loop Gain and Phase vs. Frequency. FIGURE 2-9: Channel-to-Channel Separation (MCP607 and MCP609 only). FIGURE 2-10: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-11: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-12: Input Noise Voltage Density vs. Frequency. FIGURE 2-13: Input Bias Current, Input Offset Current vs. Ambient Temperature. FIGURE 2-14: DC Open-Loop Gain vs. Load Resistance. FIGURE 2-15: CMRR, PSRR vs. Frequency. FIGURE 2-16: Input Bias Current, Input Offset Current vs. Common Mode Input Voltage. FIGURE 2-17: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-18: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-19: Output Voltage Headroom vs. Output Current Magnitude. FIGURE 2-20: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-21: Slew Rate vs. Ambient Temperature. FIGURE 2-22: Output Voltage Headroom vs. Ambient Temperature at RL = 5 kW. FIGURE 2-23: The MCP606/7/8/9 Show No Phase Reversal. FIGURE 2-24: Output Short Circuit Current Magnitude vs. Ambient Temperature. FIGURE 2-25: Large-signal, Non-inverting Pulse Response. FIGURE 2-26: Small-signal, Non-inverting Pulse Response. FIGURE 2-27: Chip Select (CS) Hysteresis (MCP608 only). FIGURE 2-28: Large-signal, Inverting Pulse Response. FIGURE 2-29: Small-signal, Inverting Pulse Response. FIGURE 2-30: Amplifier Output Response Times vs. Chip Select (CS) Pulse (MCP608 only). FIGURE 2-31: Measured Input Current vs. Input Voltage (below VSS). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Chip Select Digital Input 3.4 Power Supply Pins 4.0 Applications Information 4.1 Rail-to-Rail Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Unity Gain Buffer has a Limited VOUT Range. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO stabilizes large capacitive loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 MCP608 Chip Select 4.5 Supply Bypass 4.6 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.7 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.8 Application Circuits FIGURE 4-8: Low Side Battery Current Sensor. FIGURE 4-9: Photodiode (in Photo-voltaic mode) and Transimpedance Amplifier. FIGURE 4-10: Photodiode (in Photo- conductive mode) and Transimpedance Amplifier. FIGURE 4-11: Two Op Amp Instrumentation Amplifier. FIGURE 4-12: Three Op Amp Instrumentation Amplifier. FIGURE 4-13: Precision Gain with Good Load Isolation. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Mindi™ Circuit Designer & Simulator 5.4 Microchip Advanced Part Selector (MAPS) 5.5 Analog Demonstration and Evaluation Boards 5.6 Application Notes 6.0 Packaging Information 6.1 Package Marking Information
