MCP651/1S/2/3/4/5/9Note: Unless otherwise indicated, TA = +25°C, VDD = +2.5V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 1 kto VL, CL = 20 pF, and CAL/CS = VSS. 1.4110 1 Lot 105) High (VDD – VCMR_H) on100(V 1.3mB) PSRR d95mmoo ro V R ( DD = 2.5V 90t C1.285ead, PSR CMRR, VDD = 5.5V npu80IHRhe dR75o 1.1ig CMRR, V HM V CM70 DD = 2.5V DD = 5.5V 651.060-50-250255075100125-50-250255075100125Ambient Temperature (°C)Ambient Temperature (°C)FIGURE 2-7: High-Input Common Mode FIGURE 2-10: CMRR and PSRR vs. Voltage Headroom vs. Ambient Temperature. Ambient Temperature. 1000130) V 800 DD = 2.5V V VDD = 5.5V µ Representative Part B) 125600de ((400in 120ltag200oGa 115V0p o o VDD = 2.5V set-200110-L-400 -40°C ent Off105u-600 +25°C +85°C Inp-800 +125°C 100DC Op-100095-0.6-0.4-0.20.00.20.40.60.81.01.21.41.61.82.0-50-250255075100125Input Common Mode Voltage (V)Ambient Temperature (°C)FIGURE 2-8: Input Offset Voltage vs. FIGURE 2-11: DC Open-Loop Gain vs. Common Mode Voltage with VDD = 2.5V. Ambient Temperature. 100010,000) V 800 VDD = 5.5V DD = 5.5V Vts V µ Representative Part CM = VCMR_H 600e (rren1,000g400ulta200Co) IB V0setA100-200Off(pffset-400O -40°C ias,-600 +25°C B10 -IOS put +85°C In-800 +125°C put-1000In1.5 -00.00.51.01.52.02.53.03.54.04.55.025456585105125Input Common Mode Voltage (V)Ambient Temperature (°C)FIGURE 2-9: Input Offset Voltage vs. FIGURE 2-12: Input Bias and Offset Common Mode Voltage with VDD = 5.5V. Currents vs. Ambient Temperature with VDD = +5.5V. 2009-2014 Microchip Technology Inc. DS20002146D-page 9 Document Outline 50 MHz, 200 µV Op Amps with mCal Features Typical Applications Design Aids Description Typical Application Circuit High Gain-Bandwidth Op Amp Portfolio Package Types 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC Electrical Specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Digital Electrical Specifications TABLE 1-4: Temperature Specifications 1.3 Timing Diagram FIGURE 1-1: Timing Diagram. 1.4 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves 2.1 DC Signal Inputs FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage Repeatability (repeated calibration). FIGURE 2-4: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Low-Input Common Mode Voltage Headroom vs. Ambient Temperature. FIGURE 2-7: High-Input Common Mode Voltage Headroom vs. Ambient Temperature. FIGURE 2-8: Input Offset Voltage vs. Common Mode Voltage with VDD = 2.5V. FIGURE 2-9: Input Offset Voltage vs. Common Mode Voltage with VDD = 5.5V. FIGURE 2-10: CMRR and PSRR vs. Ambient Temperature. FIGURE 2-11: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-12: Input Bias and Offset Currents vs. Ambient Temperature with VDD = +5.5V. FIGURE 2-13: Input Bias and Offset Currents vs. Common Mode Input Voltage with TA = +85°C. FIGURE 2-14: Input Bias and Offset Currents vs. Common Mode Input Voltage with TA = +125°C. FIGURE 2-15: Input Bias Current vs. Input Voltage (below VSS). 2.2 Other DC Voltages and Currents FIGURE 2-16: Ratio of Output Voltage Headroom to Output Current. FIGURE 2-17: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-18: Output Short-Circuit Current vs. Power Supply Voltage. FIGURE 2-19: Supply Current vs. Power Supply Voltage. FIGURE 2-20: Supply Current vs. Common Mode Input Voltage. FIGURE 2-21: Power-On Reset Voltages vs. Ambient Temperature. FIGURE 2-22: Normalized Internal Calibration Voltage. FIGURE 2-23: VCAL Input Resistance vs. Temperature. 2.3 Frequency Response FIGURE 2-24: CMRR and PSRR vs. Frequency. FIGURE 2-25: Open-Loop Gain vs. Frequency. FIGURE 2-26: Gain-Bandwidth Product and Phase Margin vs. Ambient Temperature. FIGURE 2-27: Gain-Bandwidth Product and Phase Margin vs. Common Mode Input Voltage. FIGURE 2-28: Gain-Bandwidth Product and Phase Margin vs. Output Voltage. FIGURE 2-29: Closed-Loop Output Impedance vs. Frequency. FIGURE 2-30: Gain Peaking vs. Normalized Capacitive Load. FIGURE 2-31: Channel-to-Channel Separation vs. Frequency. 2.4 Input Noise and Distortion FIGURE 2-32: Input Noise Voltage Density vs. Frequency. FIGURE 2-33: Input Noise Voltage Density vs. Input Common Mode Voltage with f = 100 Hz. FIGURE 2-34: Input Noise Voltage Density vs. Input Common Mode Voltage with f = 1 MHz. FIGURE 2-35: Input Noise plus Offset vs. Time with 0.1 Hz Filter. FIGURE 2-36: THD+N vs. Frequency. 2.5 Time Response FIGURE 2-37: Non-inverting Small Signal Step Response. FIGURE 2-38: Non-inverting Large Signal Step Response. FIGURE 2-39: Inverting Small Signal Step Response. FIGURE 2-40: Inverting Large Signal Step Response. FIGURE 2-41: The MCP651/1S/2/3/4/5/9 family shows no input phase reversal with overdrive. FIGURE 2-42: Slew Rate vs. Ambient Temperature. FIGURE 2-43: Maximum Output Voltage Swing vs. Frequency. 2.6 Calibration and Chip Select Response FIGURE 2-44: CAL/CS Current vs. Power Supply Voltage. FIGURE 2-45: CAL/CS Voltage, Output Voltage and Supply Current (for Side A) vs. Time with VDD = 2.5V. FIGURE 2-46: CAL/CS Voltage, Output Voltage and Supply Current (for Side A) vs. Time with VDD = 5.5V. FIGURE 2-47: CAL/CS Hysteresis vs. Ambient Temperature. FIGURE 2-48: CAL/CS Turn-On Time vs. Ambient Temperature. FIGURE 2-49: CAL/CS’s Pull-Down Resistor (RPD) vs. Ambient Temperature. FIGURE 2-50: Quiescent Current in Shutdown vs. Power Supply Voltage. FIGURE 2-51: Output Leakage Current vs. Output Voltage. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 3.4 Calibration Common Mode Voltage Input 3.5 Calibrate/Chip Select Digital Input 3.6 Exposed Thermal Pad (EP) 4.0 Applications 4.1 Calibration and Chip Select FIGURE 4-1: Common-Mode Reference’s Input Circuitry. FIGURE 4-2: Setting VCM with External Resistors. 4.2 Input FIGURE 4-3: Simplified Analog Input ESD Structures. FIGURE 4-4: Protecting the Analog Inputs. FIGURE 4-5: Unity-Gain Voltage Limitations for Linear Operation. 4.3 Rail-to-Rail Output FIGURE 4-6: Output Current. FIGURE 4-7: Diagram for Resistive Load Power Calculations. FIGURE 4-8: Diagram for Capacitive Load Power Calculations. 4.4 Improving Stability FIGURE 4-9: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-10: Recommended RISO Values for Capacitive Loads. FIGURE 4-11: Amplifier with Parasitic Capacitance. FIGURE 4-12: Maximum Recommended RF vs. Gain. 4.5 Power Supply 4.6 High-Speed PCB Layout 4.7 Typical Applications FIGURE 4-13: Power Driver. FIGURE 4-14: Transimpedance Amplifier for an Optical Detector. FIGURE 4-15: H-Bridge Driver. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information 6.2 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service