Datasheet Summary SAM D21EL, SAM D21GL (Microchip) - 3

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Table of Contents
Introduction..1 Features.. 1 1. Description...5 2. Configuration Summary...6 3. Ordering Information..7 3.1. SAM D21ExL..7 3.2. SAM D21GxL... 7 3.3. Device Identification... 7 4. Block Diagram... 9 5. Pinout.. 10 5.1. SAM D21GxL... 10 5.2. SAM D21ExL.. 11 6. Product Mapping... 12 7. Processor And Architecture...13 7.1. Cortex M0+ Processor... 13 7.2. Nested Vector Interrupt Controller..14 7.3. Micro Trace Buffer.. 16 7.4. High-Speed Bus System.. 17 7.5. AHB-APB Bridge.. 18 7.6. PAC - Peripheral Access Controller... 19 8. Packaging Information...29 8.1. Thermal Considerations... 29 8.2. Package Drawings... 30 8.3. Soldering Profile... 34 The Microchip Web Site.. 35 Customer Change Notification Service..35 Customer Support... 35 Product Identification System..35 Microchip Devices Code Protection Feature... 36 Legal Notice...36 Trademarks... 37 © 2017 Microchip Technology Inc.
Datasheet Summary
40001885A-page 3 Document Outline Introduction Features Table of Contents 1. Description 2. Configuration Summary 3. Ordering Information 3.1. SAM D21ExL 3.2. SAM D21GxL 3.3. Device Identification 4. Block Diagram 5. Pinout 5.1. SAM D21GxL 5.1.1. QFN48 5.2. SAM D21ExL 5.2.1. QFN32 / TQFP32 6. Product Mapping 7. Processor And Architecture 7.1. Cortex M0+ Processor 7.1.1. Cortex M0+ Configuration 7.1.2. Cortex-M0+ Peripherals 7.1.3. Cortex-M0+ Address Map 7.1.4. I/O Interface 7.1.4.1. Overview 7.1.4.2. Description 7.2. Nested Vector Interrupt Controller 7.2.1. Overview 7.2.2. Interrupt Line Mapping 7.3. Micro Trace Buffer 7.3.1. Features 7.3.2. Overview 7.4. High-Speed Bus System 7.4.1. Features 7.4.2. Configuration 7.4.3. SRAM Quality of Service 7.5. AHB-APB Bridge 7.6. PAC - Peripheral Access Controller 7.6.1. Overview 7.6.2. Register Description 7.6.2.1. PAC0 Register Description 7.6.2.1.1. Write Protect Clear 7.6.2.1.2. Write Protect Set 7.6.2.2. PAC1 Register Description 7.6.2.2.1. Write Protect Clear 7.6.2.2.2. Write Protect Set 7.6.2.3. PAC2 Register Description 7.6.2.3.1. Write Protect Clear 7.6.2.3.2. Write Protect Set 8. Packaging Information 8.1. Thermal Considerations 8.1.1. Thermal Resistance Data 8.1.2. Junction Temperature 8.2. Package Drawings 8.2.1. 48 pin QFN 8.2.2. 32 pin TQFP 8.2.3. 32 pin QFN 8.3. Soldering Profile The Microchip Web Site Customer Change Notification Service Customer Support Product Identification System Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Certified by DNV Worldwide Sales and Service