Datasheet MCP4802, MCP4812, MCP4822 (Microchip)

ManufacturerMicrochip
Description8/10/12-Bit Dual Voltage Output Digital-to-Analog Converter with Internal VREF and SPI Interface
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MCP4802/4812/4822. 8/10/12-Bit Dual Voltage Output Digital-to-Analog Converter. with Internal VREF and SPI Interface

Datasheet MCP4802, MCP4812, MCP4822 Microchip

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MCP4802/4812/4822 8/10/12-Bit Dual Voltage Output Digital-to-Analog Converter with Internal VREF and SPI Interface Features Description
• MCP4802: Dual 8-Bit Voltage Output DAC The MCP4802/4812/4822 devices are dual 8-bit, 10-bit • MCP4812: Dual 10-Bit Voltage Output DAC and 12-bit buffered voltage output Digital-to-Analog • MCP4822: Dual 12-Bit Voltage Output DAC Converters (DACs), respectively. The devices operate from a single 2.7V to 5.5V supply with SPI compatible • Rail-to-Rail Output Serial Peripheral Interface. • SPI Interface with 20 MHz Clock Support The devices have a high precision internal voltage • Simultaneous Latching of the Dual DACs reference (VREF = 2.048V). The user can configure the with LDAC pin full-scale range of the device to be 2.048V or 4.096V by • Fast Settling Time of 4.5 µs setting the Gain Selection Option bit (gain of 1 of 2). • Selectable Unity or 2x Gain Output Each DAC channel can be operated in Active or • 2.048V Internal Voltage Reference Shutdown mode individually by setting the Configuration • 50 ppm/°C V register bits. In Shutdown mode, most of the internal REF Temperature Coefficient circuits in the shutdown channel are turned off for power • 2.7V to 5.5V Single-Supply Operation savings and the output amplifier is configured to present • Extended Temperature Range: -40°C to +125°C a known high resistance output load (500 k typical. The devices include double-buffered registers,
Applications
allowing synchronous updates of two DAC outputs • Set Point or Offset Trimming using the LDAC pin. These devices also incorporate a Power-on Reset (POR) circuit to ensure reliable power- • Sensor Calibration up. • Precision Selectable Voltage Reference The devices utilize a resistive string architecture, with • Portable Instrumentation (Battery-Powered) its inherent advantages of low DNL error, low ratio • Calibration of Optical Communication Devices metric temperature coefficient and fast settling time. These devices are specified over the extended temperature range (+125°C).
Related Products(1)
The devices provide high accuracy and low noise
Voltage
performance for consumer and industrial applications
DAC No. of P/N Reference
where calibration or compensation of signals (such as
Resolution Channels (VREF)
temperature, pressure and humidity) are required. MCP4801 8 1 The MCP4802/4812/4822 devices are available in the PDIP, SOIC and MSOP packages. MCP4811 10 1 MCP4821 12 1 Internal
Package Types MCP4802 8 2
(2.048V)
8-Pin PDIP, SOIC, MSOP MCP4812 10 2 MCP4822 12 2
VDD 1 8 VOUTA MCP4901 8 1 CS 2 7 VSS MCP4911 10 1 SCK 3
P48X2
6 VOUTB
C
MCP4921 12 1 SDI 4
M
5 LDAC External MCP4902 8 2
MCP4802
: 8-bit dual DAC MCP4912 10 2
MCP4812
: 10-bit dual DAC MCP4922 12 2
MCP4822
: 12-bit dual DAC
Note 1:
The products listed here have similar AC/DC performances.  2010-2015 Microchip Technology Inc. DS20002249B-page 1 Document Outline 1.0 Electrical Characteristics FIGURE 1-1: SPI Input Timing Data. 2.0 Typical Performance Curves FIGURE 2-1: DNL vs. Code (MCP4822). FIGURE 2-2: DNL vs. Code and Temperature (MCP4822). FIGURE 2-3: Absolute DNL vs. Temperature (MCP4822). FIGURE 2-4: INL vs. Code and Temperature (MCP4822). FIGURE 2-5: Absolute INL vs. Temperature (MCP4822). FIGURE 2-6: INL vs. Code (MCP4822). FIGURE 2-7: DNL vs. Code and Temperature (MCP4812). FIGURE 2-8: INL vs. Code and Temperature (MCP4812). FIGURE 2-9: DNL vs. Code and Temperature (MCP4802). FIGURE 2-10: INL vs. Code and Temperature (MCP4802). FIGURE 2-11: Full-Scale VOUTA vs. Ambient Temperature and VDD. Gain = 1x. FIGURE 2-12: Full-Scale VOUTA vs. Ambient Temperature and VDD. Gain = 2x. FIGURE 2-13: Output Noise Voltage Density (VREF Noise Density) vs. Frequency. Gain = 1x. FIGURE 2-14: Output Noise Voltage (VREF Noise Voltage) vs. Bandwidth. Gain = 1x. FIGURE 2-15: IDD vs. Temperature and VDD. FIGURE 2-16: IDD Histogram (VDD = 2.7V). FIGURE 2-17: IDD Histogram (VDD = 5.0V). FIGURE 2-18: Software Shutdown Current vs. Temperature and VDD. FIGURE 2-19: Offset Error vs. Temperature and VDD. FIGURE 2-20: Gain Error vs. Temperature and VDD. FIGURE 2-21: VIN High Threshold vs. Temperature and VDD. FIGURE 2-22: VIN Low Threshold vs. Temperature and VDD. FIGURE 2-23: Input Hysteresis vs. Temperature and VDD. FIGURE 2-24: VOUT High Limit vs.Temperature and VDD. FIGURE 2-25: VOUT Low Limit vs. Temperature and VDD. FIGURE 2-26: IOUT High Short vs. Temperature and VDD. FIGURE 2-27: IOUT vs. VOUT. Gain = 2x. FIGURE 2-28: VOUT Rise Time. FIGURE 2-29: VOUT Fall Time. FIGURE 2-30: VOUT Rise Time. FIGURE 2-31: VOUT Rise Time. FIGURE 2-32: VOUT Rise Time Exit Shutdown. FIGURE 2-33: PSRR vs. Frequency. 3.0 Pin descriptions TABLE 3-1: Pin Function Table for MCP4802/4812/4822 3.1 Supply Voltage Pins (VDD, VSS) 3.2 Chip Select (CS) 3.3 Serial Clock Input (SCK) 3.4 Serial Data Input (SDI) 3.5 Latch DAC Input (LDAC) 3.6 Analog Outputs (VOUTA, VOUTB) 4.0 General Overview TABLE 4-1: LSb of each device FIGURE 4-1: Example for INL Error. FIGURE 4-2: Example for DNL Error. 4.1 Circuit Descriptions FIGURE 4-3: Typical Transient Response. FIGURE 4-4: Output Stage for Shutdown Mode. 5.0 Serial Interface 5.1 Overview 5.2 Write Command FIGURE 5-1: Write Command for MCP4822 (12-bit DAC). FIGURE 5-2: Write Command for MCP4812 (10-bit DAC). FIGURE 5-3: Write Command for MCP4802 (8-bit DAC). 6.0 Typical Applications 6.1 Digital Interface 6.2 Power Supply Considerations 6.3 Output Noise Considerations FIGURE 6-1: Typical Connection Diagram. 6.4 Layout Considerations 6.5 Single-Supply Operation 6.6 Bipolar Operation 6.7 Selectable Gain and Offset Bipolar Voltage Output Using a Dual Output DAC 6.8 Designing a Double-Precision DAC Using a Dual DAC 6.9 Building Programmable Current Source 7.0 Development support 7.1 Evaluation and Demonstration Boards 8.0 Packaging Information 8.1 Package Marking Information AMERICAS Corporate Office Atlanta Austin, TX Boston Chicago Cleveland Dallas Detroit Houston, TX Indianapolis Los Angeles New York, NY San Jose, CA Canada - Toronto ASIA/PACIFIC Asia Pacific Office Hong Kong Australia - Sydney China - Beijing China - Chengdu China - Chongqing China - Dongguan China - Hangzhou China - Hong Kong SAR China - Nanjing China - Qingdao China - Shanghai China - Shenyang China - Shenzhen China - Wuhan China - Xian ASIA/PACIFIC China - Xiamen China - Zhuhai India - Bangalore India - New Delhi India - Pune Japan - Osaka Japan - Tokyo Korea - Daegu Korea - Seoul Malaysia - Kuala Lumpur Malaysia - Penang Philippines - Manila Singapore Taiwan - Hsin Chu Taiwan - Kaohsiung Taiwan - Taipei Thailand - Bangkok EUROPE Austria - Wels Denmark - Copenhagen France - Paris Germany - Dusseldorf Germany - Munich Germany - Pforzheim Italy - Milan Italy - Venice Netherlands - Drunen Poland - Warsaw Spain - Madrid Sweden - Stockholm UK - Wokingham Worldwide Sales and Service