Datasheet ADIS16475 (Analog Devices) - 8

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Data Sheet ADIS16475 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3.
Thermal performance is directly linked to printed circuit board
Parameter Rating
(PCB) design and operating environment. Careful attention to Mechanical Shock Survivability PCB thermal design is required. Any Axis, Unpowered 2000 g The ADIS16475 is a multichip module that includes many Any Axis, Powered 2000 g active components. The values in Table 4 identify the thermal VDD to GND −0.3 V to +3.6 V response of the hottest component inside of the ADIS16475, Digital Input Voltage to GND −0.3 V to VDD + 0.2 V with respect to the overall power dissipation of the module. Digital Output Voltage to GND −0.3 V to VDD + 0.2 V This approach enables a simple method for predicting the Calibration Temperature Range −40°C to +85°C temperature of the hottest junction, based on either ambient or Operating Temperature Range −40°C to +105°C case temperature. Storage Temperature Range1 −65°C to +150°C For example, when the ambient temperature is 70°C, the hottest Barometric Pressure 2 bar junction temperature (TJ) inside of the ADIS16475 is 76.7°C. 1 Extended exposure to temperatures that are lower than −20°C or higher TJ = θJA × VDD × IDD + 70°C than +85°C can adversely affect the accuracy of the factory calibration. Stresses at or above those listed under Absolute Maximum TJ = 158.2°C/W × 3.3 V × 0.044 A + 70°C Ratings may cause permanent damage to the product. This is a TJ = 93°C stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational
Table 4. Package Characteristics 1 2
section of this specification is not implied. Operation beyond
Package Type θJA θJC Device Weight
the maximum operating conditions for extended periods may ML-44-13 158.2°C/W 106.1°C/W 1.3 g affect product reliability. 1 θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. 2 θJC is the junction to case thermal resistance. 3 Thermal impedance values come from direct observation of the hottest temperature inside of the ADIS16475 when it is attached to an FR4-08 PCB that has two metal layers and has a thickness of 0.063 inches.
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Rev. A | Page 7 of 33 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS Timing Diagrams ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INTRODUCTION INERTIAL SENSOR SIGNAL CHAIN Gyroscope Data Sampling Accelerometer Data Sampling External Clock Options Inertial Sensor Calibration Bartlett Window FIR Filter Averaging/Decimating Filter REGISTER STRUCTURE SERIAL PERIPHERAL INTERFACE (SPI) DATA READY (DR) READING SENSOR DATA Burst Read Function DEVICE CONFIGURATION Memory Structure USER REGISTER MEMORY MAP USER REGISTER DEFINTIONS Status/Error Flag Indicators (DIAG_STAT) GYROSCOPE DATA Gyroscope Measurement Range/Scale Factor Gyroscope Data Formatting X-Axis Gyroscope (X_GYRO_LOW and X_GYRO_OUT) Y-Axis Gyroscope (Y_GYRO_LOW and Y_GYRO_OUT) Z-Axis Gyroscope (Z_GYRO_LOW and Z_GYRO_OUT) Acceleration Data Accelerometer Resolution X-Axis Accelerometer (X_ACCL_LOW and X_ACCL_OUT) Y-Axis Accelerometer (Y_ACCL_LOW and Y_ACCL_OUT) Z-Axis Accelerometer (Z_ACCL_LOW and Z_ACCL_OUT) Internal Temperature (TEMP_OUT) Time Stamp (TIME_STAMP) Data Update Counter (DATA_CNTR) DELTA ANGLES Delta Angle Measurement Range X-Axis Delta Angle (X_DELTANG_LOW and X_DELTANG_OUT) Y-Axis Delta Angle (Y_DELTANG_LOW and Y_DELTANG_OUT) Z-Axis Delta Angle (Z_DELTANG_LOW and Z_DELTANG_OUT) Delta Angle Resolution DELTA VELOCITY X-Axis Delta Velocity (X_DELTVEL_LOW and X_DELTVEL_OUT) Y-Axis Delta Velocity (Y_DELTVEL_LOW and Y_DELTVEL_OUT) Z-Axis Delta Velocity (Z_DELTVEL_LOW and Z_DELTVEL_OUT) Delta Velocity Resolution CALIBRATION Calibration, Gyroscope Bias (XG_BIAS_LOW and XG_BIAS_HIGH) Calibration, Gyroscope Bias (YG_BIAS_LOW and YG_BIAS_HIGH) Calibration, Gyroscope Bias (ZG_BIAS_LOW and ZG_BIAS_HIGH) Calibration, Accelerometer Bias (XA_BIAS_LOW and XA_BIAS_HIGH) Calibration, Accelerometer Bias (YA_BIAS_LOW and YA_BIAS_HIGH) Calibration, Accelerometer Bias (ZA_BIAS_LOW and ZA_BIAS_HIGH) Filter Control Register (FILT_CTRL) Range Identifier (RANG_MDL) Miscellaneous Control Register (MSC_CTRL) Point of Percussion Linear Acceleration Effect on Gyroscope Bias Internal Clock Mode Output Sync Mode Direct Sync Mode Pulse Sync Mode Scaled Sync Mode Decimation Filter (DEC_RATE) Data Update Rate in External Sync Modes Continuous Bias Estimation (NULL_CNFG) Global Commands (GLOB_CMD) Software Reset Flash Memory Test Flash Memory Update Sensor Self Test Factory Calibration Restore Bias Correction Update Firmware Revision (FIRM_REV) Firmware Revision Day and Month (FIRM_DM) Firmware Revision Year (FIRM_Y) Product Identification (PROD_ID) Serial Number (SERIAL_NUM) Scratch Registers (USER_SCR_1 to USER_SCR_3) Flash Memory Endurance Counter (FLSHCNT_LOW and FLSHCNT_HIGH) APPLICATIONS INFORMATION ASSEMBLY AND HANDLING TIPS Package Attributes Assembly Tips PCB Layout Suggestions Underfill Process Validation and Control POWER SUPPLY CONSIDERATIONS EVALUATION TOOLS Breakout Boards PC-Based Evaluation, EVAL-ADIS2 PACKAGING AND ORDERING INFORMATION OUTLINE DIMENSIONS ORDERING GUIDE