Datasheet 6N137, HCNW137, HCNW2601, HCNW2611, HCPL-0600, HCPL-0601, HCPL-0611, HCPL-0630, HCPL-0631, HCPL-0661, HCPL-2601, HCPL-2611, HCPL-2630, HCPL-2631, HCPL-4661 (Broadcom) - 8
| Manufacturer | Broadcom |
| Description | High CMR, High Speed TTL Compatible Optocouplers 6N137, HCPL-26xx/06xx/4661, HCNW137/26x1 |
| Pages / Page | 29 / 8 — Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61). 3.937 ± 0.127. … |
| File Format / Size | PDF / 1.3 Mb |
| Document Language | English |
Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61). 3.937 ± 0.127. (0.155 ± 0.005). NNNN Z TEST RATING CODE
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Text Version of Document
6N137, HCNW137, HCNW2601, HCNW2611, HCPL-0600, HCPL-0601, HCPL-0611, Package Outline Drawings HCPL-0630, HCPL-0631, HCPL-0661, HCPL-2601, HCPL-2611, HCPL-2630, HCPL-2631, HCPL-4661 Data Sheet
Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61) 3.937 ± 0.127 (0.155 ± 0.005) 8 7 6 5 NNNN Z TEST RATING CODE DEVICE PART NUMBER LEAD-FREE YYWW • DATE CODE PIN 1 EEE LOT ID 5.994 ± 0.203 1 2 3 4 (0.236 ± 0.008) 0.406 ± 0.076 1.270 BSC (0.016 ± 0.003) (0.050) * 5.080 ± 0.127 7° 0.432 45° X (0.200 ± 0.005) (0.017) 3.175 ± 0.127 (0.125 ± 0.005) 0 ~ 7° 0.228 ± 0.025 1.524 (0.009 ± 0.001) (0.060) 0.203 ± 0.102 (0.008 ± 0.004) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 0.305 MIN. 5.207 ± 0.254 (0.205 ± 0.010) (0.012) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX. 8-Pin Widebody DIP Package (HCNW137, HCNW2601/11) 11.23 ± 0.15 11.00 MAX. (0.442 ± 0.006) (0.433) 9.00 ± 0.15 8 7 6 5 (0.354 ± 0.006) AVAGO DEVICE PART NUMBER A NNNNNNNN Z TEST RATING CODE LEAD-FREE YYWW • DATE CODE EEE LOT ID PIN 1 1 2 3 4 10.16 (0.400) TYP. 1.55 (0.061) 7° TYP. + 0.076 MAX. 0.254 - 0.0051 + 0.003) (0.010 - 0.002) 5.10 MAX. (0.201) 3.10 (0.122) 3.90 (0.154) 0.51 (0.021) MIN. 2.54 (0.100) TYP. DIMENSIONS IN MILLIMETERS (INCHES). 1.80 ± 0.15 0.40 (0.016) (0.071 ± 0.006) 0.56 (0.022) NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Avago Technologies - 8 - Document Outline High CMR, High Speed TTL Compatible Optocouplers Description Functional Diagram Features Applications Selection Guide Ordering Information Schematic Package Outline Drawings 8-pin DIP Package (6N137, HCPL-2601/11/30/31, HCPL-4661) 8-pin DIP Package with Gull Wing Surface Mount Option 300 (6N137, HCPL-2601/11/30/31, HCPL-4661) Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61) 8-Pin Widebody DIP Package (HCNW137, HCNW2601/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11) Reflow Soldering Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-06xx Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-26xx; 46xx; 6N13x Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW137/2601/2611 Only) Absolute Maximum Ratings (No Derating Required up to 85 °C) Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew
Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61) 3.937 ± 0.127 (0.155 ± 0.005) 8 7 6 5 NNNN Z TEST RATING CODE DEVICE PART NUMBER LEAD-FREE YYWW • DATE CODE PIN 1 EEE LOT ID 5.994 ± 0.203 1 2 3 4 (0.236 ± 0.008) 0.406 ± 0.076 1.270 BSC (0.016 ± 0.003) (0.050) * 5.080 ± 0.127 7° 0.432 45° X (0.200 ± 0.005) (0.017) 3.175 ± 0.127 (0.125 ± 0.005) 0 ~ 7° 0.228 ± 0.025 1.524 (0.009 ± 0.001) (0.060) 0.203 ± 0.102 (0.008 ± 0.004) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 0.305 MIN. 5.207 ± 0.254 (0.205 ± 0.010) (0.012) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX. 8-Pin Widebody DIP Package (HCNW137, HCNW2601/11) 11.23 ± 0.15 11.00 MAX. (0.442 ± 0.006) (0.433) 9.00 ± 0.15 8 7 6 5 (0.354 ± 0.006) AVAGO DEVICE PART NUMBER A NNNNNNNN Z TEST RATING CODE LEAD-FREE YYWW • DATE CODE EEE LOT ID PIN 1 1 2 3 4 10.16 (0.400) TYP. 1.55 (0.061) 7° TYP. + 0.076 MAX. 0.254 - 0.0051 + 0.003) (0.010 - 0.002) 5.10 MAX. (0.201) 3.10 (0.122) 3.90 (0.154) 0.51 (0.021) MIN. 2.54 (0.100) TYP. DIMENSIONS IN MILLIMETERS (INCHES). 1.80 ± 0.15 0.40 (0.016) (0.071 ± 0.006) 0.56 (0.022) NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Avago Technologies - 8 - Document Outline High CMR, High Speed TTL Compatible Optocouplers Description Functional Diagram Features Applications Selection Guide Ordering Information Schematic Package Outline Drawings 8-pin DIP Package (6N137, HCPL-2601/11/30/31, HCPL-4661) 8-pin DIP Package with Gull Wing Surface Mount Option 300 (6N137, HCPL-2601/11/30/31, HCPL-4661) Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61) 8-Pin Widebody DIP Package (HCNW137, HCNW2601/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11) Reflow Soldering Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-06xx Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-26xx; 46xx; 6N13x Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW137/2601/2611 Only) Absolute Maximum Ratings (No Derating Required up to 85 °C) Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew
