Datasheet 6N137, HCNW137, HCNW2601, HCNW2611, HCPL-0600, HCPL-0601, HCPL-0611, HCPL-0630, HCPL-0631, HCPL-0661, HCPL-2601, HCPL-2611, HCPL-2630, HCPL-2631, HCPL-4661 (Broadcom) - 9
| Manufacturer | Broadcom |
| Description | High CMR, High Speed TTL Compatible Optocouplers 6N137, HCPL-26xx/06xx/4661, HCNW137/26x1 |
| Pages / Page | 29 / 9 — 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 … |
| File Format / Size | PDF / 1.3 Mb |
| Document Language | English |
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11). 11.23 ± 0.15. (0.442 ± 0.006)
Model Line for this Datasheet
Text Version of Document
6N137, HCNW137, HCNW2601, HCNW2611, HCPL-0600, HCPL-0601, HCPL-0611, Reflow Soldering Profile HCPL-0630, HCPL-0631, HCPL-0661, HCPL-2601, HCPL-2611, HCPL-2630, HCPL-2631, HCPL-4661 Data Sheet
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11) 11.23 ± 0.15 (0.442 ± 0.006) LAND PATTERN RECOMMENDATION 8 7 6 5 9.00 ± 0.15 (0.354 ± 0.006) 13.56 (0.534) 1 2 3 4 1.3 2.29 (0.051) (0.09) 1.55 12.30 ± 0.30 (0.061) (0.484 ± 0.012) MAX. 11.00 MAX. (0.433) 4.00 MAX. (0.158) 1.80 ± 0.15 1.00 ± 0.15 (0.071 ± 0.006) (0.039 ± 0.006) 0.75 ± 0.25 2.54 + 0.076 (0.030 ± 0.010) 0.254 (0.100) - 0.0051 BSC + 0.003) (0.010 - 0.002) DIMENSIONS IN MILLIMETERS (INCHES). 7° NOM. LEAD COPLANARITY = 0.10 mm (0.004 INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. Test Rating Code, Z Optional Identification Code
L – Option x2x A – Avago V – Option x5x or x6x – UL Logo P – Special Program Code
Reflow Soldering Profile
The recommended reflow soldering conditions are per JEDEC Standard J-STD-020 (latest revision). Non-halide flux should be used.
Regulatory Information
The 6N137, HCPL-26xx/06xx/46xx, and HCNW137/26xx have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition Program, File E55361.
IEC/EN/DIN EN 60747-5-5 CSA
Approved under CSA Component Acceptance Notice #5, File CA 88324. Avago Technologies - 9 - Document Outline High CMR, High Speed TTL Compatible Optocouplers Description Functional Diagram Features Applications Selection Guide Ordering Information Schematic Package Outline Drawings 8-pin DIP Package (6N137, HCPL-2601/11/30/31, HCPL-4661) 8-pin DIP Package with Gull Wing Surface Mount Option 300 (6N137, HCPL-2601/11/30/31, HCPL-4661) Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61) 8-Pin Widebody DIP Package (HCNW137, HCNW2601/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11) Reflow Soldering Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-06xx Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-26xx; 46xx; 6N13x Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW137/2601/2611 Only) Absolute Maximum Ratings (No Derating Required up to 85 °C) Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11) 11.23 ± 0.15 (0.442 ± 0.006) LAND PATTERN RECOMMENDATION 8 7 6 5 9.00 ± 0.15 (0.354 ± 0.006) 13.56 (0.534) 1 2 3 4 1.3 2.29 (0.051) (0.09) 1.55 12.30 ± 0.30 (0.061) (0.484 ± 0.012) MAX. 11.00 MAX. (0.433) 4.00 MAX. (0.158) 1.80 ± 0.15 1.00 ± 0.15 (0.071 ± 0.006) (0.039 ± 0.006) 0.75 ± 0.25 2.54 + 0.076 (0.030 ± 0.010) 0.254 (0.100) - 0.0051 BSC + 0.003) (0.010 - 0.002) DIMENSIONS IN MILLIMETERS (INCHES). 7° NOM. LEAD COPLANARITY = 0.10 mm (0.004 INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. Test Rating Code, Z Optional Identification Code
L – Option x2x A – Avago V – Option x5x or x6x – UL Logo P – Special Program Code
Reflow Soldering Profile
The recommended reflow soldering conditions are per JEDEC Standard J-STD-020 (latest revision). Non-halide flux should be used.
Regulatory Information
The 6N137, HCPL-26xx/06xx/46xx, and HCNW137/26xx have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition Program, File E55361.
IEC/EN/DIN EN 60747-5-5 CSA
Approved under CSA Component Acceptance Notice #5, File CA 88324. Avago Technologies - 9 - Document Outline High CMR, High Speed TTL Compatible Optocouplers Description Functional Diagram Features Applications Selection Guide Ordering Information Schematic Package Outline Drawings 8-pin DIP Package (6N137, HCPL-2601/11/30/31, HCPL-4661) 8-pin DIP Package with Gull Wing Surface Mount Option 300 (6N137, HCPL-2601/11/30/31, HCPL-4661) Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61) 8-Pin Widebody DIP Package (HCNW137, HCNW2601/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11) Reflow Soldering Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-06xx Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-26xx; 46xx; 6N13x Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW137/2601/2611 Only) Absolute Maximum Ratings (No Derating Required up to 85 °C) Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew
